Global Semiconductor Etch Equipment Market 2023-2029

March 2023 | 67 pages | ID: G99C9E33285AEN
Gen Consulting Company

Abstracts

Semiconductor etch equipment is used in the production of integrated circuits, where it is used to remove layers of material from the surface of a silicon wafer to create the intricate patterns needed for circuit fabrication. Etching is a crucial step in semiconductor manufacturing, and high-quality etch equipment is essential for producing high-performance devices. The global semiconductor etch equipment market is anticipated to increase by USD 4.9 billion till 2029 at an average annual growth of 4.7 percent as per the latest market estimates.

The report covers market size and growth, segmentation, regional breakdowns, competitive landscape, trends and strategies for global semiconductor etch equipment market. It presents a quantitative analysis of the market to enable stakeholders to capitalize on the prevailing market opportunities. The report also identifies top segments for opportunities and strategies based on market trends and leading competitors’ approaches.

This industry report offers market estimates and forecasts of the global market, followed by a detailed analysis of the product type, etching film type, and region. The global market for semiconductor etch equipment can be segmented by product type: high-density etch equipment, low-density etch equipment. In 2022, the high-density etch equipment segment made up the largest share of revenue generated by the semiconductor etch equipment market. Semiconductor etch equipment market is further segmented by etching film type: conductor etching, dielectric etching, polysilicon etching. The conductor etching segment was the largest contributor to the global semiconductor etch equipment market in 2022. Based on region, the semiconductor etch equipment market is segmented into: North America, Europe, Asia-Pacific, MEA (Middle East and Africa), Latin America. Asia-Pacific is estimated to account for the largest share of the global semiconductor etch equipment market.

Market Segmentation
By product type: high-density etch equipment, low-density etch equipment
By etching film type: conductor etching, dielectric etching, polysilicon etching
By region: North America, Europe, Asia-Pacific, MEA (Middle East and Africa), Latin America

The report also provides analysis of the key companies of the industry and their detailed company profiles including Applied Materials Inc., Hitachi Ltd., Lam Research Corporation, Tokyo Electron Limited, Panasonic Corporation, KLA Corporation, Suzhou Delphi Laser Co., Ltd., ULVAC Inc., among others. In this report, key players and their strategies are thoroughly analyzed to understand the competitive outlook of the market.
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Scope of the Report
To analyze and forecast the market size of the global semiconductor etch equipment market.
To classify and forecast the global semiconductor etch equipment market based on product type, etching film type, region.
To identify drivers and challenges for the global semiconductor etch equipment market.
To examine competitive developments such as mergers & acquisitions, agreements, collaborations and partnerships, etc., in the global semiconductor etch equipment market.
To identify and analyze the profile of leading players operating in the global semiconductor etch equipment market.

Why Choose This Report
Gain a reliable outlook of the global semiconductor etch equipment market forecasts from 2023 to 2029 across scenarios.
Identify growth segments for investment.
Stay ahead of competitors through company profiles and market data.
The market estimate for ease of analysis across scenarios in Excel format.
Strategy consulting and research support for three months.
Print authentication provided for the single-user license.

Contents

PART 1. INTRODUCTION

Report description
Objectives of the study
Market segment
Years considered for the report
Currency
Key target audience

PART 2. METHODOLOGY

PART 3. EXECUTIVE SUMMARY

PART 4. MARKET OVERVIEW

Introduction
Drivers
Restraints

PART 5. MARKET BREAKDOWN BY PRODUCT TYPE

High-density etch equipment
Low-density etch equipment

PART 6. MARKET BREAKDOWN BY ETCHING FILM TYPE

Conductor etching
Dielectric etching
Polysilicon etching

PART 7. MARKET BREAKDOWN BY REGION

North America
Europe
Asia-Pacific
MEA (Middle East and Africa)
Latin America

PART 8. KEY COMPANIES

Applied Materials Inc.
Hitachi Ltd.
Lam Research Corporation
Tokyo Electron Limited
Panasonic Corporation
KLA Corporation
Suzhou Delphi Laser Co., Ltd.
ULVAC Inc.

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