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Global Market for Mixed-signal System-on-Chip Applications with a Focus on Node Geometries

December 2019 | 31 pages | ID: G4489F1CD907EN
BCC Research

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REPORT INCLUDES:
  • An overview of the global market for mixed-signal SoC applications and a detailed study on node geometries
  • Analyses of global market trends, with data from 2018, estimates for 2019, and projections of compound annual growth rates (CAGRs) through 2024
  • Characterization and quantification of SoC application market by design, technology node, application and region
  • Comparative study on digital vs manual signals
  • Detailed information about the major factors influencing the market growth and recent developments within the industry
  • Company profiles of the leading players in the industry, including Broadcom Corp., Intel Corp., Micron Technology Inc., Qualcomm Inc., Taiwan Semiconductor, and Toshiba Corp.
CHAPTER 1 INTRODUCTION

Reason for Doing This Study
Information Sources
Key Data from Secondary Sources
Key Data from Primary Sources
Methodology
Geographic Breakdown
Analyst's Credentials
Related BCC Research Reports

CHAPTER 2 EVOLUTION, ROADMAP AND SUMMARY

Development and Evolution of Mixed-Signal SoC
Report Summary

CHAPTER 3 MIXED-SIGNAL SOC: FUTURE AND GROWTH PROSPECTS

Introduction
Future Prospects
Market Dynamics: Drivers and Restraints
Market Drivers
Restraints
Opportunities

CHAPTER 4 MIXED-SIGNAL SOC BY DESIGN COMBINATION RATIO

Introduction
Analog Digital Combination (Ratio-70:30)
Analog Digital Combination (Ratio-30:70)
Other Combination Ratios

CHAPTER 5 MIXED-SIGNAL SOC BY TECHNOLOGY NODE

Introduction
22 nm and Above
16 Less Than x Less Than Equal to
12 Less Than x Less Than Equal to
9 Less Than x Less Than Equal to
Others

CHAPTER 6 MIXED-SIGNAL SOC BY APPLICATION

Introduction
Automotive
Industrial
Handheld Devices
Communications
Others

CHAPTER 7 MIXED-SIGNAL SOC BY GEOGRAPHY

Introduction
North America
Europe
Asia-Pacific
Rest of the World

CHAPTER 8 COMPANY PROFILES

BROADCOM
INTEL
MICRON TECHNOLOGY
NXP
QUALCOMM
SAMSUNG ELECTRONICS CO., LTD.
SK HYNIX INC.
TAIWAN SEMICONDUCTOR
TEXAS INSTRUMENTS
TOSHIBA

CHAPTER 9 MIXED-SIGNAL SOC PATENT ANALYSIS

Patent Review by Region
Important Patents on Mixed-Signal SoC Focusing Node Geometry

LIST OF TABLES

Summary Table: Global Market for Mixed-Signal SoC, by Region, Through 2024
Table 1: Global Market for Mixed-Signal SoC, by Design Combination Ratio, Through 2024
Table 2: Global Market for Mixed-Signal SoC, by Technology Node, Through 2024
Table 3: Global Market for Mixed-Signal SoC, by Application, Through 2024
Table 4: Global Market for Mixed-Signal SoC, by Region, Through 2024

LIST OF FIGURES

Summary Figure: Global Market for Mixed-Signal SoC, by Region, 2018-2024
Figure 1: Global Market for Mixed-Signal SoC, by Design Combination Ratio, 2018-2024
Figure 2: Global Market for Mixed-Signal SoC, by Technology Node, 2018-2024
Figure 3: Global Market for Mixed-Signal SoC, by Application, 2018-2024
Figure 4: Global Market for Mixed-Signal SoC, by Region, 2018-2024
Figure 5: Global Mixed-Signal SoC Patents Share Analysis, by Country, 2018


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