Global CMP Pad Market, 2020-2026
The global CMP pad market size was valued at $874.91 million in 2019 and is projected to reach $1,336.53 million by 2026, registering a CAGR of 6.24% from 2020 to 2026. By wafer size, the CMP pad market is classified into 200 mm, 300 mm, 450 mm. On the basis of region, the CMP pad industry is analyzed across North America, Europe, Asia-Pacific, South America and MEA (the Middle East, and Africa).
By Wafer Size:
The base year of the study is 2019, and forecasts run up to 2026.
Research Objective
By Wafer Size:
- 200 mm
- 300 mm
- 450 mm
- North America (U.S., Canada, Mexico, etc.)
- Asia-Pacific (China, Japan, India, Korea, Australia, Indonesia, Taiwan, Thailand, etc.)
- Europe (Germany, UK, France, Italy, Russia, Spain, etc.)
- Middle East & Africa (Turkey, Saudi Arabia, Iran, Egypt, Nigeria, UAE, Israel, South Africa, etc.)
- South America (Brazil, Argentina, Colombia, Chile, Venezuela, Peru, etc.)
- DuPont de Nemours, Inc.
- Cabot Microelectronics Corporation
- Fujibo Holdings, Inc.
- IV Technologies Co., Ltd.
- TWI Incorporated
- KPX Chemical Co., Ltd.
- TOHO Engineering Co., Ltd.
- The 3M Company
- FNS TECH Co., Ltd.
- JSR Micro Inc.
- NITTA DuPont Incorporated
- Spartan Felt Co. Incorporated
The base year of the study is 2019, and forecasts run up to 2026.
Research Objective
- To analyze and forecast the market size of global CMP pad market.
- To classify and forecast global CMP pad market based on wafer size.
- To identify drivers and challenges for global CMP pad market.
- To examine competitive developments such as mergers & acquisitions, agreements, collaborations and partnerships, etc., in global CMP pad market.
- To conduct pricing analysis for global CMP pad market.
- To identify and analyze the profile of leading players operating in global CMP pad market.
- Manufacturers of CMP pad
- Raw material suppliers
- Market research and consulting firms
- Government bodies such as regulating authorities and policy makers
- Organizations, forums and alliances related to CMP pad
PART 1. INTRODUCTION
1.1 Market Definition
1.2 Key Benefit
1.3 Market Segment
PART 2. METHODOLOGY
2.1 Primary
2.2 Secondary
PART 3. EXECUTIVE SUMMARY
PART 4. MARKET OVERVIEW
4.1 Introduction
4.2 Market Size and Forecast
4.3 Market Dynamics
4.3.1 Drivers
4.3.2 Restraints
4.4 Impact of COVID-19 Pandemic on Global Economy
4.5 Porter's Five Forces Analysis
4.5.1 Bargaining Power of Suppliers
4.5.2 Bargaining Power of Consumers
4.5.3 Threat of New Entrants
4.5.4 Threat of Substitute Products and Services
4.5.5 Degree of Competition
PART 5. GLOBAL MARKET FOR CMP PAD BY WAFER SIZE
5.1 Market Overview
5.2 200 mm
5.2.1 Market Size and Forecast
5.3 300 mm
5.3.1 Market Size and Forecast
5.4 450 mm
5.4.1 Market Size and Forecast
PART 6. GLOBAL MARKET FOR CMP PAD BY GEOGRAPHY
6.1 Overview
6.1.1 Market Size and Forecast
6.2 North America
6.2.1 Market Size and Forecast
6.2.2 North America: CMP Pad Market by Country
6.2.2.1 United States
6.2.2.2 Canada
6.2.2.3 Mexico
6.3 Europe
6.3.1 Market Size and Forecast
6.3.2 Europe: CMP Pad Market by Country
6.3.2.1 Germany
6.3.2.2 France
6.3.2.3 United Kingdom
6.3.2.4 Italy
6.3.2.5 Rest of The Europe
6.4 Asia-Pacific
6.4.1 Market Size and Forecast
6.4.2 Asia-Pacific: CMP Pad Market by Country
6.4.2.1 China
6.4.2.2 India
6.4.2.3 Japan
6.4.2.4 South Korea
6.4.2.5 ASEAN Countries
6.5 Middle East and Africa (MEA)
6.5.1 Market Size and Forecast
6.5.2 MEA: CMP Pad Market by Country
6.5.2.1 Saudi Arabia
6.5.2.2 South Africa
6.5.2.3 Turkey
6.6 South America
6.6.1 Market Size and Forecast
6.6.2 South America: CMP Pad Market by Country
6.6.2.1 Brazil
6.6.2.2 Argentina
6.6.2.3 Rest of South America
PART 7. COMPETITIVE LANDSCAPE
7.1 Market Share
7.2 Mergers & Acquisitions, Agreements, Collaborations and Partnerships
PART 8. KEY COMPETITOR PROFILES
8.1 DuPont de Nemours, Inc.
8.2 Cabot Microelectronics Corporation
8.3 Fujibo Holdings, Inc.
8.4 IV Technologies Co., Ltd.
8.5 TWI Incorporated
8.6 KPX Chemical Co., Ltd.
8.7 TOHO Engineering Co., Ltd.
8.8 The 3M Company
8.9 FNS TECH Co., Ltd.
8.10 JSR Micro Inc.
8.11 NITTA DuPont Incorporated
8.12 Spartan Felt Co. Incorporated
*LIST IS NOT EXHAUSTIVE
PART 9. PATENT ANALYSIS
9.1 Patent Statistics
9.2 Regional Analysis
9.3 Trends Analysis
DISCLAIMER
1.1 Market Definition
1.2 Key Benefit
1.3 Market Segment
PART 2. METHODOLOGY
2.1 Primary
2.2 Secondary
PART 3. EXECUTIVE SUMMARY
PART 4. MARKET OVERVIEW
4.1 Introduction
4.2 Market Size and Forecast
4.3 Market Dynamics
4.3.1 Drivers
4.3.2 Restraints
4.4 Impact of COVID-19 Pandemic on Global Economy
4.5 Porter's Five Forces Analysis
4.5.1 Bargaining Power of Suppliers
4.5.2 Bargaining Power of Consumers
4.5.3 Threat of New Entrants
4.5.4 Threat of Substitute Products and Services
4.5.5 Degree of Competition
PART 5. GLOBAL MARKET FOR CMP PAD BY WAFER SIZE
5.1 Market Overview
5.2 200 mm
5.2.1 Market Size and Forecast
5.3 300 mm
5.3.1 Market Size and Forecast
5.4 450 mm
5.4.1 Market Size and Forecast
PART 6. GLOBAL MARKET FOR CMP PAD BY GEOGRAPHY
6.1 Overview
6.1.1 Market Size and Forecast
6.2 North America
6.2.1 Market Size and Forecast
6.2.2 North America: CMP Pad Market by Country
6.2.2.1 United States
6.2.2.2 Canada
6.2.2.3 Mexico
6.3 Europe
6.3.1 Market Size and Forecast
6.3.2 Europe: CMP Pad Market by Country
6.3.2.1 Germany
6.3.2.2 France
6.3.2.3 United Kingdom
6.3.2.4 Italy
6.3.2.5 Rest of The Europe
6.4 Asia-Pacific
6.4.1 Market Size and Forecast
6.4.2 Asia-Pacific: CMP Pad Market by Country
6.4.2.1 China
6.4.2.2 India
6.4.2.3 Japan
6.4.2.4 South Korea
6.4.2.5 ASEAN Countries
6.5 Middle East and Africa (MEA)
6.5.1 Market Size and Forecast
6.5.2 MEA: CMP Pad Market by Country
6.5.2.1 Saudi Arabia
6.5.2.2 South Africa
6.5.2.3 Turkey
6.6 South America
6.6.1 Market Size and Forecast
6.6.2 South America: CMP Pad Market by Country
6.6.2.1 Brazil
6.6.2.2 Argentina
6.6.2.3 Rest of South America
PART 7. COMPETITIVE LANDSCAPE
7.1 Market Share
7.2 Mergers & Acquisitions, Agreements, Collaborations and Partnerships
PART 8. KEY COMPETITOR PROFILES
8.1 DuPont de Nemours, Inc.
8.2 Cabot Microelectronics Corporation
8.3 Fujibo Holdings, Inc.
8.4 IV Technologies Co., Ltd.
8.5 TWI Incorporated
8.6 KPX Chemical Co., Ltd.
8.7 TOHO Engineering Co., Ltd.
8.8 The 3M Company
8.9 FNS TECH Co., Ltd.
8.10 JSR Micro Inc.
8.11 NITTA DuPont Incorporated
8.12 Spartan Felt Co. Incorporated
*LIST IS NOT EXHAUSTIVE
PART 9. PATENT ANALYSIS
9.1 Patent Statistics
9.2 Regional Analysis
9.3 Trends Analysis
DISCLAIMER
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