Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity

April 2023 | 187 pages | ID: GE114305C0B7EN
GMD Research

Abstracts

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.

Highlighted with 110 tables and 82 figures, this 187-page report “Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:

• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces

The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region.

Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• FC BGA
• FC CSP
• Other Packaging Types

Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate

By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)

By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)

By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications

Geographically, the following regions together with the listed national/local markets are fully investigated:

• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (UAE, Saudi Arabia, South Africa and Rest of MEA)

For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included.

The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.

Selected Key Players:

ASE Group

AT&S Austria Technologie & Systemtechnik AG

Fujitsu Ltd.

IBIDEN Co., Ltd.

Kinsus Interconnect Technology Corp.

Korea Circuit Co., Ltd.

KYOCERA Corporation

LG Innotek Co., Ltd.

Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)

Shenzhen Fastprint Circuit Tech

Shinko Electric Industries Co., Ltd.

Siliconware Precision Industries Co., Ltd.

STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)

TTM Technologies Inc.

Unimicron Corporation

Zhen Ding Technology Holding Ltd.

Zhuhai ACCESS Semiconductor

(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

Contents

1 INTRODUCTION

1.1 Industry Definition and Research Scope
  1.1.1 Industry Definition
  1.1.2 Research Scope
1.2 Research Methodology
  1.2.1 Overview of Market Research Methodology
  1.2.2 Market Assumption
  1.2.3 Secondary Data
  1.2.4 Primary Data
  1.2.5 Data Filtration and Model Design
  1.2.6 Market Size/Share Estimation
  1.2.7 Research Limitations
1.3 Executive Summary

2 MARKET OVERVIEW AND DYNAMICS

2.1 Market Size and Forecast
  2.1.1 Impact of COVID-19 on World Economy
  2.1.2 Impact of COVID-19 on the Market
  2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery
2.2 Major Growth Drivers
2.3 Market Restraints and Challenges
2.4 Emerging Opportunities and Market Trends
2.5 Porter’s Fiver Forces Analysis

3 SEGMENTATION OF GLOBAL MARKET BY PACKAGING TYPE

3.1 Market Overview by Packaging Type
3.2 FC BGA
3.3 FC CSP
3.4 Other Packaging Types

4 SEGMENTATION OF GLOBAL MARKET BY MATERIAL TYPE

4.1 Market Overview by Material Type
4.2 Rigid Integrated Circuit Substrate
4.3 Flex Integrated Circuit Substrate
4.4 Ceramic Integrated Circuit Substrate

5 SEGMENTATION OF GLOBAL MARKET BY MANUFACTURING METHOD

5.1 Market Overview by Manufacturing Method
5.2 Subtraction Process (SP)
5.3 Addition Process (AP)
5.4 Modified Semi-additive Process (MSAP)

6 SEGMENTATION OF GLOBAL MARKET BY BONDING TECHNOLOGY

6.1 Market Overview by Bonding Technology
6.2 Wire Bonding
6.3 FC Bonding
6.4 Tape Automated Bonding (TAB)

7 SEGMENTATION OF GLOBAL MARKET BY APPLICATION

7.1 Market Overview by Application
7.2 Mobile and Consumer Electronics
7.3 Automotive and Transportation
7.4 IT and Telecom
7.5 Other Applications

8 SEGMENTATION OF GLOBAL MARKET BY REGION

8.1 Geographic Market Overview 2021-2031
8.2 North America Market 2021-2031 by Country
  8.2.1 Overview of North America Market
  8.2.2 U.S.
  8.2.3 Canada
  8.2.4 Mexico
8.3 European Market 2021-2031 by Country
  8.3.1 Overview of European Market
  8.3.2 Germany
  8.3.3 U.K.
  8.3.4 France
  8.3.5 Spain
  8.3.6 Italy
  8.3.7 Netherlands
  8.3.8 Rest of European Market
8.4 Asia-Pacific Market 2021-2031 by Country/Region
  8.4.1 Overview of Asia-Pacific Market
  8.4.2 Japan
  8.4.3 China
  8.4.4 Australia
  8.4.5 Taiwan
  8.4.6 South Korea
  8.4.7 Rest of APAC Region
8.5 South America Market 2021-2031 by Country
  8.5.1 Argentina
  8.5.2 Brazil
  8.5.3 Chile
  8.5.4 Rest of South America Market
8.6 MEA Market 2021-2031 by Country
  8.6.1 UAE
  8.6.2 Saudi Arabia
  8.6.3 South Africa
  8.6.4 Other National Markets

9 COMPETITIVE LANDSCAPE

9.1 Overview of Key Vendors
9.2 New Product Launch, Partnership, Investment, and M&A
9.3 Company Profiles
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
RELATED REPORTS

List Of Tables

LIST OF TABLES:

Table 1. Snapshot of Global Advanced IC Substrates Market in Balanced Perspective, 2021-2031
Table 2. World Economic Outlook, 2021-2031
Table 3. World Economic Outlook, 2021-2023
Table 4. Scenarios for Economic Impact of Ukraine Crisis
Table 5. World Semiconductor Market, 2021-2031, $ bn
Table 6. Main Product Trends and Market Opportunities in Global Advanced IC Substrates Market
Table 7. Global Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 8. Global Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 9. Global Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn
Table 10. Global Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn
Table 11. Global Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 12. Global Advanced IC Substrates Market by Region, 2021-2031, $ mn
Table 13. Leading National Advanced IC Substrates Market, 2022 and 2031, $ mn
Table 14. North America Advanced IC Substrates Market by Country, 2021-2031, $ mn
Table 15. U.S. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 16. U.S. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 17. U.S. Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 18. Canada Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 19. Canada Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 20. Canada Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 21. Mexico Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 22. Mexico Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 23. Mexico Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 24. Europe Advanced IC Substrates Market by Country, 2021-2031, $ mn
Table 25. Germany Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 26. Germany Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 27. Germany Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 28. U.K. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 29. U.K. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 30. U.K. Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 31. France Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 32. France Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 33. France Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 34. Spain Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 35. Spain Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 36. Spain Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 37. Italy Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 38. Italy Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 39. Italy Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 40. Netherlands Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 41. Netherlands Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 42. Netherlands Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 43. Advanced IC Substrates Market in Rest of Europe by Country, 2021-2031, $ mn
Table 44. APAC Advanced IC Substrates Market by Country/Region, 2021-2031, $ mn
Table 45. Japan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 46. Japan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 47. Japan Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 48. China Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 49. China Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 50. China Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 51. Australia Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 52. Australia Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 53. Australia Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 54. Taiwan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 55. Taiwan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 56. Taiwan Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 57. South Korea Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 58. South Korea Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 59. South Korea Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 60. Advanced IC Substrates Market in Rest of APAC by Country/Region, 2021-2031, $ mn
Table 61. South America Advanced IC Substrates Market by Country, 2021-2031, $ mn
Table 62. Argentina Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 63. Argentina Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 64. Argentina Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 65. Brazil Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 66. Brazil Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 67. Brazil Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 68. Chile Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 69. Chile Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 70. Chile Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 71. MEA Advanced IC Substrates Market by Country, 2021-2031, $ mn
Table 72. UAE Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 73. UAE Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 74. UAE Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 75. Saudi Arabia Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 76. Saudi Arabia Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 77. Saudi Arabia Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 78. South Africa Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 79. South Africa Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 80. South Africa Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 81. ASE Group: Company Snapshot
Table 82. ASE Group: Business Segmentation
Table 83. ASE Group: Product Portfolio
Table 84. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot
Table 85. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment
Table 86. Fujitsu Limited: Company Snapshot
Table 87. Fujitsu Limited: Business Segmentation and Share
Table 88. Fujitsu Limited: Revenue Distribution by Region in 2021
Table 89. IBIDEN Co., Ltd.: Company Snapshot
Table 90. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment
Table 91. Kinsus Interconnect Technology Corp..: Company Snapshot
Table 92. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment
Table 93. Korea Circuit Co., Ltd.: Company Snapshot
Table 94. KYOCERA Corporation: Company Snapshot
Table 95. KYOCERA Corporation: Breakdown of Revenue by Business Segment
Table 96. LG Innotek Co., Ltd.: Company Snapshot
Table 97. Nan Ya PCB Co., Ltd.: Company Snapshot
Table 98. Shenzhen Fastprint Circuit Tech: Company Snapshot
Table 99. Shinko Electric Industries Co., Ltd.: Company Snapshot
Table 100. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment
Table 101. Siliconware Precision Industries Co., Ltd.: Company Snapshot
Table 102. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment
Table 103. STATS ChipPAC Pte. Ltd.: Company Snapshot
Table 104. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment
Table 105. TTM Technologies Inc.: Company Snapshot
Table 106. TTM Technologies Inc.: Breakdown of Revenue by Business Segment
Table 107. Unimicron Corporation: Company Snapshot
Table 108. Unimicron Corporation: Breakdown of Revenue by Business Segment
Table 109. Zhen Ding Technology Holding Ltd.: Company Snapshot
Table 110. Zhuhai ACCESS Semiconductor: Company Snapshot

List Of Figures

LIST OF FIGURES:

Figure 1. Research Method Flow Chart
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation
Figure 3. Global Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2022-2031
Figure 4. Industry Value Chain Analysis
Figure 5. Global Advanced IC Substrates Market, 2021-2031, $ mn
Figure 6. Impact of COVID-19 on Business
Figure 7. Primary Drivers and Impact Factors of Global Advanced IC Substrates Market
Figure 8. World 5G Devices Market by Value, 2019-2030, $ bn
Figure 9. World Autonomous Vehicle Market, 2019-2030, $ mn
Figure 10. Primary Restraints and Impact Factors of Global Advanced IC Substrates Market
Figure 11. Investment Opportunity Analysis
Figure 12. Porter’s Fiver Forces Analysis of Global Advanced IC Substrates Market
Figure 13. Breakdown of Global Advanced IC Substrates Market by Packaging Type, 2021-2031, % of Revenue
Figure 14. Global Addressable Market Cap in 2023-2031 by Packaging Type, Value ($ mn) and Share (%)
Figure 15. Global Advanced IC Substrates Market by Packaging Type: FC BGA, 2021-2031, $ mn
Figure 16. Global Advanced IC Substrates Market by Packaging Type: FC CSP, 2021-2031, $ mn
Figure 17. Global Advanced IC Substrates Market by Packaging Type: Other Packaging Types, 2021-2031, $ mn
Figure 18. Breakdown of Global Advanced IC Substrates Market by Material Type, 2021-2031, % of Sales Revenue
Figure 19. Global Addressable Market Cap in 2023-2031 by Material Type, Value ($ mn) and Share (%)
Figure 20. Global Advanced IC Substrates Market by Material Type: Rigid Integrated Circuit Substrate, 2021-2031, $ mn
Figure 21. Global Advanced IC Substrates Market by Material Type: Flex Integrated Circuit Substrate, 2021-2031, $ mn
Figure 22. Global Advanced IC Substrates Market by Material Type: Ceramic Integrated Circuit Substrate, 2021-2031, $ mn
Figure 23. Breakdown of Global Advanced IC Substrates Market by Manufacturing Method, 2021-2031, % of Sales Revenue
Figure 24. Global Addressable Market Cap in 2023-2031 by Manufacturing Method, Value ($ mn) and Share (%)
Figure 25. Global Advanced IC Substrates Market by Manufacturing Method: Subtraction Process (SP), 2021-2031, $ mn
Figure 26. Global Advanced IC Substrates Market by Manufacturing Method: Addition Process (AP), 2021-2031, $ mn
Figure 27. Global Advanced IC Substrates Market by Manufacturing Method: Modified Semi-additive Process (MSAP), 2021-2031, $ mn
Figure 28. Breakdown of Global Advanced IC Substrates Market by Bonding Technology, 2021-2031, % of Revenue
Figure 29. Global Addressable Market Cap in 2023-2031 by Bonding Technology, Value ($ mn) and Share (%)
Figure 30. Global Advanced IC Substrates Market by Bonding Technology: Wire Bonding, 2021-2031, $ mn
Figure 31. Picture of Wire Bonding Illustrated in a DIP Package
Figure 32. Global Advanced IC Substrates Market by Bonding Technology: FC Bonding, 2021-2031, $ mn
Figure 33. Picture of a Flipped Chip (IC) on a Passive Substrate
Figure 34. Global Advanced IC Substrates Market by Bonding Technology: Tape Automated Bonding (TAB), 2021-2031, $ mn
Figure 35. Breakdown of Global Advanced IC Substrates Market by Application, 2021-2031, % of Revenue
Figure 36. Global Addressable Market Cap in 2023-2031 by Application, Value ($ mn) and Share (%)
Figure 37. Global Advanced IC Substrates Market by Application: Mobile and Consumer Electronics, 2021-2031, $ mn
Figure 38. Global Advanced IC Substrates Market by Application: Automotive and Transportation, 2021-2031, $ mn
Figure 39. Global Advanced IC Substrates Market by Application: IT and Telecom, 2021-2031, $ mn
Figure 40. Global Advanced IC Substrates Market by Application: Other Applications, 2021-2031, $ mn
Figure 41. Global Market Snapshot by Region
Figure 42. Geographic Spread of Worldwide Advanced IC Substrates Market, 2021-2031, % of Sales Revenue
Figure 43. Global Addressable Market Cap in 2023-2031 by Region, Value ($ mn) and Share (%)
Figure 44. North American Advanced IC Substrates Market, 2021-2031, $ mn
Figure 45. Breakdown of North America Advanced IC Substrates Market by Country, 2022 and 2031, % of Revenue
Figure 46. Contribution to North America 2023-2031 Cumulative Market by Country, Value ($ mn) and Share (%)
Figure 47. U.S. Advanced IC Substrates Market, 2021-2031, $ mn
Figure 48. Canada Advanced IC Substrates Market, 2021-2031, $ mn
Figure 49. Advanced IC Substrates Market in Mexico, 2021-2031, $ mn
Figure 50. European Advanced IC Substrates Market, 2021-2031, $ mn
Figure 51. Breakdown of European Advanced IC Substrates Market by Country, 2022 and 2031, % of Revenue
Figure 52. Contribution to Europe 2023-2031 Cumulative Market by Country, Value ($ mn) and Share (%)
Figure 53. Advanced IC Substrates Market in Germany, 2021-2031, $ mn
Figure 54. Advanced IC Substrates Market in U.K., 2021-2031, $ mn
Figure 55. Advanced IC Substrates Market in France, 2021-2031, $ mn
Figure 56. Advanced IC Substrates Market in Spain, 2021-2031, $ mn
Figure 57. Advanced IC Substrates Market in Italy, 2021-2031, $ mn
Figure 58. Advanced IC Substrates Market in Netherlands, 2021-2031, $ mn
Figure 59. Advanced IC Substrates Market in Rest of Europe, 2021-2031, $ mn
Figure 60. Asia-Pacific Advanced IC Substrates Market, 2021-2031, $ mn
Figure 61. Breakdown of APAC Advanced IC Substrates Market by Country/Region, 2022 and 2031, % of Revenue
Figure 62. Contribution to APAC 2023-2031 Cumulative Market by Country/Region, Value ($ mn) and Share (%)
Figure 63. Advanced IC Substrates Market in Japan, 2021-2031, $ mn
Figure 64. Advanced IC Substrates Market in China, 2021-2031, $ mn
Figure 65. Advanced IC Substrates Market in Australia, 2021-2031, $ mn
Figure 66. Advanced IC Substrates Market in Taiwan, 2021-2031, $ mn
Figure 67. Advanced IC Substrates Market in South Korea, 2021-2031, $ mn
Figure 68. Advanced IC Substrates Market in Rest of APAC, 2021-2031, $ mn
Figure 69. South America Advanced IC Substrates Market, 2021-2031, $ mn
Figure 70. Breakdown of South America Advanced IC Substrates Market by Country, 2022 and 2031, % of Revenue
Figure 71. Contribution to South America 2023-2031 Cumulative Market by Country, Value ($ mn) and Share (%)
Figure 72. Advanced IC Substrates Market in Argentina, 2021-2031, $ mn
Figure 73. Advanced IC Substrates Market in Brazil, 2021-2031, $ mn
Figure 74. Advanced IC Substrates Market in Chile, 2021-2031, $ mn
Figure 75. Advanced IC Substrates Market in Rest of South America, 2021-2031, $ mn
Figure 76. Advanced IC Substrates Market in Middle East and Africa (MEA), 2021-2031, $ mn
Figure 77. Breakdown of MEA Advanced IC Substrates Market by Country, 2022 and 2031, % of Revenue
Figure 78. Contribution to MEA 2023-2031 Cumulative Market by Country, Value ($ mn) and Share (%)
Figure 79. Advanced IC Substrates Market in UAE, 2021-2031, $ mn
Figure 80. Advanced IC Substrates Market in Saudi Arabia, 2021-2031, $ mn
Figure 81. Advanced IC Substrates Market in South Africa, 2021-2031, $ mn
Figure 82. Growth Stage of Global Advanced IC Substrates Industry over the Forecast Period