Flexible Substrate Trends: Market Research Report
Flexible Substrates refer to ultra-thin and ultra-light base components upon which electronic devices are deposited at the time of assembling electronic circuits to fabricate extremely lightweight and rollable flexible electronics. Plastic, glass, and stainless steel are the most commonly used materials for flexible substrates.
The report analyzes and presents an overview of Flexible Substrates market worldwide. The report also provides a review of market trends, growth drivers, and strategic industry activities of major companies worldwide. In addition, 18 companies operating in the Flexible Substartes arena worldwide including 3M Company, BenQ Materials Corporation, Polyonics Inc., Rogers Corporation and others are profiled.
The report analyzes and presents an overview of Flexible Substrates market worldwide. The report also provides a review of market trends, growth drivers, and strategic industry activities of major companies worldwide. In addition, 18 companies operating in the Flexible Substartes arena worldwide including 3M Company, BenQ Materials Corporation, Polyonics Inc., Rogers Corporation and others are profiled.
1. FLEXIBLE SUBSTRATES – AN OVERVIEW
Flexible Substrates - Adding Flexibility and Conformability to Electronic Devices
2. MARKET TRENDS
Market Overview
Printed Electronics Technologies Emerge in Commercial Applications
Flexible Substrates Witness Upsurge in OLED Displays and Lightings
Flexible PVs - An Emerging Solution for Use in Solar Modules
Flexible Substrates Garner Considerable Research Interest for Developing Flexible Medical Devices
Increase in Adoption of Organic Electronics-based IC Designing Method for Non-Invasive Monitoring Devices
Flexible Substrates Face Stiff Competition from Existing Substrates and Technologies
3. RECENT INDUSTRY ACTIVITY
Clariant International Acquires Silver Nanoparticle Ink Technology of Bayer
New Energy Technologies Enters into Phase 2 of CRADA with US NREL
Soligie Inks Agreement with Thin Film Electronics
Universal Display and Fujifilm Ink Agreement
DuPont Microcircuit Materials and Holst Centre Collaborate for Printed Structures on Flexible Substrates Program
FLEXcon to Acquire Graphics Division of Arlon
AU Optronics Enters into Partnership with Flexible Display Center
4. PRODUCT LAUNCHES
MOMA Consortium Develops Re-Programmable Memory Arrays
Polyonics Expands PolyFLEX Flexible Substrates and Films Range
Kolon Industries Unveils Colourless Polyimide Material
Wayne State University Develops New Technology to Integrate CMOS Devices in Flexible Substrates
Beneq Introduces Web Coating System WCS
HP Develops Technology for Production of AMOLED Panels
Lawrence Berkeley National Laboratory Develops New Carbon Nanotube Ink
North Dakota State University Develops Laser-Enabled Advanced Packaging Technology
DKN Research Unveils UTF Connector Concept Model
5. MARKET PARTICIPANTS
3M COMPANY (USA)
American Semiconductor, Inc. (USA)
Argotec LLC (USA)
Arlon Graphics LLC (USA)
AzCoat, Inc. (USA)
BenQ Materials Corporation (Taiwan)
Corning, Inc. (USA)
DuPont Teijin Films U. S. Ltd. Partnership (USA)
Dyesol Ltd. (Australia)
E. I. DuPont de Nemours and Company (USA)
Griff Paper and Film (USA)
Heraeus Materials Technology GmbH & Co. KG (Germany)
Heraeus Packaging Technology (Germany)
Polyonics, Inc. (USA)
Porex Corporation (USA)
Rogers Corporation (USA)
SCHOTT North America, Inc. (USA)
Teijin Ltd. (Japan)
6. APPENDIX
Flexible Substrates - Adding Flexibility and Conformability to Electronic Devices
2. MARKET TRENDS
Market Overview
Printed Electronics Technologies Emerge in Commercial Applications
Flexible Substrates Witness Upsurge in OLED Displays and Lightings
Flexible PVs - An Emerging Solution for Use in Solar Modules
Flexible Substrates Garner Considerable Research Interest for Developing Flexible Medical Devices
Increase in Adoption of Organic Electronics-based IC Designing Method for Non-Invasive Monitoring Devices
Flexible Substrates Face Stiff Competition from Existing Substrates and Technologies
3. RECENT INDUSTRY ACTIVITY
Clariant International Acquires Silver Nanoparticle Ink Technology of Bayer
New Energy Technologies Enters into Phase 2 of CRADA with US NREL
Soligie Inks Agreement with Thin Film Electronics
Universal Display and Fujifilm Ink Agreement
DuPont Microcircuit Materials and Holst Centre Collaborate for Printed Structures on Flexible Substrates Program
FLEXcon to Acquire Graphics Division of Arlon
AU Optronics Enters into Partnership with Flexible Display Center
4. PRODUCT LAUNCHES
MOMA Consortium Develops Re-Programmable Memory Arrays
Polyonics Expands PolyFLEX Flexible Substrates and Films Range
Kolon Industries Unveils Colourless Polyimide Material
Wayne State University Develops New Technology to Integrate CMOS Devices in Flexible Substrates
Beneq Introduces Web Coating System WCS
HP Develops Technology for Production of AMOLED Panels
Lawrence Berkeley National Laboratory Develops New Carbon Nanotube Ink
North Dakota State University Develops Laser-Enabled Advanced Packaging Technology
DKN Research Unveils UTF Connector Concept Model
5. MARKET PARTICIPANTS
3M COMPANY (USA)
American Semiconductor, Inc. (USA)
Argotec LLC (USA)
Arlon Graphics LLC (USA)
AzCoat, Inc. (USA)
BenQ Materials Corporation (Taiwan)
Corning, Inc. (USA)
DuPont Teijin Films U. S. Ltd. Partnership (USA)
Dyesol Ltd. (Australia)
E. I. DuPont de Nemours and Company (USA)
Griff Paper and Film (USA)
Heraeus Materials Technology GmbH & Co. KG (Germany)
Heraeus Packaging Technology (Germany)
Polyonics, Inc. (USA)
Porex Corporation (USA)
Rogers Corporation (USA)
SCHOTT North America, Inc. (USA)
Teijin Ltd. (Japan)
6. APPENDIX
