Europe Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity

April 2023 | 132 pages | ID: E7361B2EABB3EN
GMD Research

Abstracts

Europe advanced IC substrates market was valued at $562.7 million in 2022 and will grow by 5.4% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.

Highlighted with 61 tables and 50 figures, this 132-page report “Europe Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:

• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces

The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.

Based on Packaging Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• FC BGA
• FC CSP
• Other Packaging Types

Based on Material Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate

By Manufacturing Method, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)

By Bonding Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)

By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications

Geographically, the following national/local markets are fully investigated:

• Germany
• UK
• France
• Spain
• Italy
• Netherlands
• Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)

For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included.

The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.

Selected Key Players:

ASE Group

AT&S Austria Technologie & Systemtechnik AG

Fujitsu Ltd.

IBIDEN Co., Ltd.

Kinsus Interconnect Technology Corp.

Korea Circuit Co., Ltd.

KYOCERA Corporation

LG Innotek Co., Ltd.

Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)

Shenzhen Fastprint Circuit Tech

Shinko Electric Industries Co., Ltd.

Siliconware Precision Industries Co., Ltd.

STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)

TTM Technologies Inc.

Unimicron Corporation

Zhen Ding Technology Holding Ltd.

Zhuhai ACCESS Semiconductor

(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

Contents

1 INTRODUCTION

1.1 Industry Definition and Research Scope
  1.1.1 Industry Definition
  1.1.2 Research Scope
1.2 Research Methodology
  1.2.1 Overview of Market Research Methodology
  1.2.2 Market Assumption
  1.2.3 Secondary Data
  1.2.4 Primary Data
  1.2.5 Data Filtration and Model Design
  1.2.6 Market Size/Share Estimation
  1.2.7 Research Limitations
1.3 Executive Summary

2 MARKET OVERVIEW AND DYNAMICS

2.1 Market Size and Forecast
  2.1.1 Impact of COVID-19 on World Economy
  2.1.2 Impact of COVID-19 on the Market
  2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery
2.2 Major Growth Drivers
2.3 Market Restraints and Challenges
2.4 Emerging Opportunities and Market Trends
2.5 Porter’s Fiver Forces Analysis

3 SEGMENTATION OF EUROPE MARKET BY PACKAGING TYPE

3.1 Market Overview by Packaging Type
3.2 FC BGA
3.3 FC CSP
3.4 Other Packaging Types

4 SEGMENTATION OF EUROPE MARKET BY MATERIAL TYPE

4.1 Market Overview by Material Type
4.2 Rigid Integrated Circuit Substrate
4.3 Flex Integrated Circuit Substrate
4.4 Ceramic Integrated Circuit Substrate

5 SEGMENTATION OF EUROPE MARKET BY MANUFACTURING METHOD

5.1 Market Overview by Manufacturing Method
5.2 Subtraction Process (SP)
5.3 Addition Process (AP)
5.4 Modified Semi-additive Process (MSAP)

6 SEGMENTATION OF EUROPE MARKET BY BONDING TECHNOLOGY

6.1 Market Overview by Bonding Technology
6.2 Wire Bonding
6.3 FC Bonding
6.4 Tape Automated Bonding (TAB)

7 SEGMENTATION OF EUROPE MARKET BY APPLICATION

7.1 Market Overview by Application
7.2 Mobile and Consumer Electronics
7.3 Automotive and Transportation
7.4 IT and Telecom
7.5 Other Applications

8 EUROPEAN MARKET 2021-2031 BY COUNTRY

8.1 Overview of European Market
8.2 Germany
8.3 U.K.
8.4 France
8.5 Spain
8.6 Italy
8.7 Netherlands
8.8 Rest of European Market

9 COMPETITIVE LANDSCAPE

9.1 Overview of Key Vendors
9.2 New Product Launch, Partnership, Investment, and M&A
9.3 Company Profiles
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
RELATED REPORTS

List Of Tables

LIST OF TABLES:

Table 1. Snapshot of Europe Advanced IC Substrates Market in Balanced Perspective, 2021-2031
Table 2. World Economic Outlook, 2021-2031
Table 3. World Economic Outlook, 2021-2023
Table 4. Scenarios for Economic Impact of Ukraine Crisis
Table 5. World Semiconductor Market, 2021-2031, $ bn
Table 6. Main Product Trends and Market Opportunities in Europe Advanced IC Substrates Market
Table 7. Europe Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 8. Europe Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 9. Europe Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn
Table 10. Europe Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn
Table 11. Europe Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 12. Europe Advanced IC Substrates Market by Country, 2021-2031, $ mn
Table 13. Germany Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 14. Germany Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 15. Germany Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 16. U.K. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 17. U.K. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 18. U.K. Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 19. France Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 20. France Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 21. France Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 22. Spain Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 23. Spain Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 24. Spain Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 25. Italy Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 26. Italy Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 27. Italy Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 28. Netherlands Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 29. Netherlands Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 30. Netherlands Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 31. Advanced IC Substrates Market in Rest of Europe by Country, 2021-2031, $ mn
Table 32. ASE Group: Company Snapshot
Table 33. ASE Group: Business Segmentation
Table 34. ASE Group: Product Portfolio
Table 35. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot
Table 36. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment
Table 37. Fujitsu Limited: Company Snapshot
Table 38. Fujitsu Limited: Business Segmentation and Share
Table 39. Fujitsu Limited: Revenue Distribution by Region in 2021
Table 40. IBIDEN Co., Ltd.: Company Snapshot
Table 41. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment
Table 42. Kinsus Interconnect Technology Corp..: Company Snapshot
Table 43. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment
Table 44. Korea Circuit Co., Ltd.: Company Snapshot
Table 45. KYOCERA Corporation: Company Snapshot
Table 46. KYOCERA Corporation: Breakdown of Revenue by Business Segment
Table 47. LG Innotek Co., Ltd.: Company Snapshot
Table 48. Nan Ya PCB Co., Ltd.: Company Snapshot
Table 49. Shenzhen Fastprint Circuit Tech: Company Snapshot
Table 50. Shinko Electric Industries Co., Ltd.: Company Snapshot
Table 51. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment
Table 52. Siliconware Precision Industries Co., Ltd.: Company Snapshot
Table 53. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment
Table 54. STATS ChipPAC Pte. Ltd.: Company Snapshot
Table 55. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment
Table 56. TTM Technologies Inc.: Company Snapshot
Table 57. TTM Technologies Inc.: Breakdown of Revenue by Business Segment
Table 58. Unimicron Corporation: Company Snapshot
Table 59. Unimicron Corporation: Breakdown of Revenue by Business Segment
Table 60. Zhen Ding Technology Holding Ltd.: Company Snapshot
Table 61. Zhuhai ACCESS Semiconductor: Company Snapshot
LIST OF TABLES:

Table 1. Snapshot of Europe Advanced IC Substrates Market in Balanced Perspective, 2021-2031
Table 2. World Economic Outlook, 2021-2031
Table 3. World Economic Outlook, 2021-2023
Table 4. Scenarios for Economic Impact of Ukraine Crisis
Table 5. World Semiconductor Market, 2021-2031, $ bn
Table 6. Main Product Trends and Market Opportunities in Europe Advanced IC Substrates Market
Table 7. Europe Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 8. Europe Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 9. Europe Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn
Table 10. Europe Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn
Table 11. Europe Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 12. Europe Advanced IC Substrates Market by Country, 2021-2031, $ mn
Table 13. Germany Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 14. Germany Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 15. Germany Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 16. U.K. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 17. U.K. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 18. U.K. Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 19. France Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 20. France Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 21. France Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 22. Spain Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 23. Spain Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 24. Spain Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 25. Italy Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 26. Italy Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 27. Italy Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 28. Netherlands Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 29. Netherlands Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 30. Netherlands Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 31. Advanced IC Substrates Market in Rest of Europe by Country, 2021-2031, $ mn
Table 32. ASE Group: Company Snapshot
Table 33. ASE Group: Business Segmentation
Table 34. ASE Group: Product Portfolio
Table 35. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot
Table 36. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment
Table 37. Fujitsu Limited: Company Snapshot
Table 38. Fujitsu Limited: Business Segmentation and Share
Table 39. Fujitsu Limited: Revenue Distribution by Region in 2021
Table 40. IBIDEN Co., Ltd.: Company Snapshot
Table 41. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment
Table 42. Kinsus Interconnect Technology Corp..: Company Snapshot
Table 43. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment
Table 44. Korea Circuit Co., Ltd.: Company Snapshot
Table 45. KYOCERA Corporation: Company Snapshot
Table 46. KYOCERA Corporation: Breakdown of Revenue by Business Segment
Table 47. LG Innotek Co., Ltd.: Company Snapshot
Table 48. Nan Ya PCB Co., Ltd.: Company Snapshot
Table 49. Shenzhen Fastprint Circuit Tech: Company Snapshot
Table 50. Shinko Electric Industries Co., Ltd.: Company Snapshot
Table 51. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment
Table 52. Siliconware Precision Industries Co., Ltd.: Company Snapshot
Table 53. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment
Table 54. STATS ChipPAC Pte. Ltd.: Company Snapshot
Table 55. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment
Table 56. TTM Technologies Inc.: Company Snapshot
Table 57. TTM Technologies Inc.: Breakdown of Revenue by Business Segment
Table 58. Unimicron Corporation: Company Snapshot
Table 59. Unimicron Corporation: Breakdown of Revenue by Business Segment
Table 60. Zhen Ding Technology Holding Ltd.: Company Snapshot
Table 61. Zhuhai ACCESS Semiconductor: Company Snapshot