Asia Pacific Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 ?m, Less than 25/25 ?m), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity
Asia Pacific substrate-like PCB (SLP) market will grow by 15.6% annually with a total addressable market cap of $ 25,000.1 million over 2022-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization.
Highlighted with 26 tables and 36 figures, this 88-page report “Asia Pacific Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 ?m, Less than 25/25 ?m), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
Based on Inspection Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
Highlighted with 26 tables and 36 figures, this 88-page report “Asia Pacific Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 ?m, Less than 25/25 ?m), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
- Market Structure
- Growth Drivers
- Restraints and Challenges
- Emerging Product Trends & Market Opportunities
- Porter’s Fiver Forces
Based on Inspection Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Automated Optical Inspection (AOI)
- Direct Imaging (DI)
- Automated Optical Shaping (AOS)
- 25/25 and 30/30 ?m
- Less than 25/25 ?m
- Consumer Electronics
- Automotive Industry
- Medical Industry
- Industrial Use
- Computing and Communications
- Other Applications
- Japan
- China
- South Korea
- Australia
- India
- Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 INTRODUCTION
1.1 Industry Definition and Research Scope
1.1.1 Industry Definition
1.1.2 Research Scope
1.2 Research Methodology
1.2.1 Overview of Market Research Methodology
1.2.2 Market Assumption
1.2.3 Secondary Data
1.2.4 Primary Data
1.2.5 Data Filtration and Model Design
1.2.6 Market Size/Share Estimation
1.2.7 Research Limitations
1.3 Executive Summary
2 MARKET OVERVIEW AND DYNAMICS
2.1 Market Size and Forecast
2.1.1 Impact of COVID-19 on World Economy
2.1.2 Impact of COVID-19 on the Market
2.2 Major Growth Drivers
2.3 Market Restraints and Challenges
2.4 Emerging Opportunities and Market Trends
2.5 Porter’s Fiver Forces Analysis
3 SEGMENTATION OF ASIA PACIFIC MARKET BY INSPECTION TECHNOLOGY
3.1 Market Overview by Inspection Technology
3.2 Automated Optical Inspection (AOI)
3.3 Direct Imaging (DI)
4 SEGMENTATION OF ASIA PACIFIC MARKET BY LINE/SPACE
4.1 Market Overview by Line/Space
4.2 25/25 and 30/30 ?m
4.3 Less than 25/25 ?m
5 SEGMENTATION OF ASIA PACIFIC MARKET BY APPLICATION
5.1 Market Overview by Application
5.2 Consumer Electronics
5.3 Automotive Industry
5.4 Medical Industry
5.5 Industrial Use
5.6 Computing and Communications
5.7 Other Applications
6 ASIA-PACIFIC MARKET 2021-2031 BY COUNTRY
6.1 Overview of Asia-Pacific Market
6.2 Japan
6.3 China
6.4 Australia
6.5 India
6.6 South Korea
6.7 Rest of APAC Region
7 COMPETITIVE LANDSCAPE
7.1 Overview of Key Vendors
7.2 New Product Launch, Partnership, Investment, and M&A
7.3 Company Profiles
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
RELATED REPORTS
1.1 Industry Definition and Research Scope
1.1.1 Industry Definition
1.1.2 Research Scope
1.2 Research Methodology
1.2.1 Overview of Market Research Methodology
1.2.2 Market Assumption
1.2.3 Secondary Data
1.2.4 Primary Data
1.2.5 Data Filtration and Model Design
1.2.6 Market Size/Share Estimation
1.2.7 Research Limitations
1.3 Executive Summary
2 MARKET OVERVIEW AND DYNAMICS
2.1 Market Size and Forecast
2.1.1 Impact of COVID-19 on World Economy
2.1.2 Impact of COVID-19 on the Market
2.2 Major Growth Drivers
2.3 Market Restraints and Challenges
2.4 Emerging Opportunities and Market Trends
2.5 Porter’s Fiver Forces Analysis
3 SEGMENTATION OF ASIA PACIFIC MARKET BY INSPECTION TECHNOLOGY
3.1 Market Overview by Inspection Technology
3.2 Automated Optical Inspection (AOI)
3.3 Direct Imaging (DI)
4 SEGMENTATION OF ASIA PACIFIC MARKET BY LINE/SPACE
4.1 Market Overview by Line/Space
4.2 25/25 and 30/30 ?m
4.3 Less than 25/25 ?m
5 SEGMENTATION OF ASIA PACIFIC MARKET BY APPLICATION
5.1 Market Overview by Application
5.2 Consumer Electronics
5.3 Automotive Industry
5.4 Medical Industry
5.5 Industrial Use
5.6 Computing and Communications
5.7 Other Applications
6 ASIA-PACIFIC MARKET 2021-2031 BY COUNTRY
6.1 Overview of Asia-Pacific Market
6.2 Japan
6.3 China
6.4 Australia
6.5 India
6.6 South Korea
6.7 Rest of APAC Region
7 COMPETITIVE LANDSCAPE
7.1 Overview of Key Vendors
7.2 New Product Launch, Partnership, Investment, and M&A
7.3 Company Profiles
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
RELATED REPORTS
LIST OF TABLES:
Table 1. Snapshot of Asia Pacific Substrate-Like PCB Market in Balanced Perspective, 2021-2031
Table 2. World Economic Outlook, 2021-2031
Table 3. Main Product Trends and Market Opportunities in Asia Pacific Substrate-Like PCB Market
Table 4. Asia Pacific Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 5. Asia Pacific Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 6. Asia Pacific Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 7. APAC Substrate-Like PCB Market by Country, 2021-2031, $ mn
Table 8. Japan Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 9. Japan Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 10. Japan Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 11. China Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 12. China Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 13. China Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 14. Australia Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 15. Australia Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 16. Australia Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 17. India Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 18. India Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 19. India Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 20. South Korea Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 21. South Korea Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 22. South Korea Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 23. Substrate-Like PCB Market in Rest of APAC by Country/Region, 2021-2031, $ mn
Table 24. Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S): Company Snapshot
Table 25. Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S): Business Segmentation
Table 26. Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S): Product Portfolio
Table 1. Snapshot of Asia Pacific Substrate-Like PCB Market in Balanced Perspective, 2021-2031
Table 2. World Economic Outlook, 2021-2031
Table 3. Main Product Trends and Market Opportunities in Asia Pacific Substrate-Like PCB Market
Table 4. Asia Pacific Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 5. Asia Pacific Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 6. Asia Pacific Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 7. APAC Substrate-Like PCB Market by Country, 2021-2031, $ mn
Table 8. Japan Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 9. Japan Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 10. Japan Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 11. China Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 12. China Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 13. China Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 14. Australia Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 15. Australia Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 16. Australia Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 17. India Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 18. India Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 19. India Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 20. South Korea Substrate-Like PCB Market by Inspection Technology, 2021-2031, $ mn
Table 21. South Korea Substrate-Like PCB Market by Line/Space, 2021-2031, $ mn
Table 22. South Korea Substrate-Like PCB Market by Application, 2021-2031, $ mn
Table 23. Substrate-Like PCB Market in Rest of APAC by Country/Region, 2021-2031, $ mn
Table 24. Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S): Company Snapshot
Table 25. Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S): Business Segmentation
Table 26. Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S): Product Portfolio
LIST OF FIGURES:
Figure 1. Research Method Flow Chart
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation
Figure 3. Asia Pacific Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031
Figure 4. Asia Pacific Substrate-Like PCB Market, 2021-2031, $ mn
Figure 5. Impact of COVID-19 on Business
Figure 6. Primary Drivers and Impact Factors of Asia Pacific Substrate-Like PCB Market
Figure 7. World Smartphone Market by Value, 2017-2027, $ bn
Figure 8. World Smart Wearable Devices Market, 2019-2030, $ mn
Figure 9. Primary Restraints and Impact Factors of Asia Pacific Substrate-Like PCB Market
Figure 10. Investment Opportunity Analysis
Figure 11. Porter’s Fiver Forces Analysis of Asia Pacific Substrate-Like PCB Market
Figure 12. Breakdown of Asia Pacific Substrate-Like PCB Market by Inspection Technology, 2021-2031, % of Revenue
Figure 13. Asia Pacific Addressable Market Cap in 2022-2031 by Inspection Technology, Value ($ mn) and Share (%)
Figure 14. Asia Pacific Substrate-Like PCB Market by Inspection Technology: Automated Optical Inspection (AOI), 2021-2031, $ mn
Figure 15. Asia Pacific Substrate-Like PCB Market by Inspection Technology: Direct Imaging (DI), 2021-2031, $ mn
Figure 16. Breakdown of Asia Pacific Substrate-Like PCB Market by Line/Space, 2021-2031, % of Sales Revenue
Figure 17. Asia Pacific Addressable Market Cap in 2022-2031 by Line/Space, Value ($ mn) and Share (%)
Figure 18. Asia Pacific Substrate-Like PCB Market by Line/Space: 25/25 and 30/30 ?m, 2021-2031, $ mn
Figure 19. Asia Pacific Substrate-Like PCB Market by Line/Space: Less than 25/25 ?m, 2021-2031, $ mn
Figure 20. Breakdown of Asia Pacific Substrate-Like PCB Market by Application, 2021-2031, % of Sales Revenue
Figure 21. Asia Pacific Addressable Market Cap in 2022-2031 by Application, Value ($ mn) and Share (%)
Figure 22. Asia Pacific Substrate-Like PCB Market by Application: Consumer Electronics, 2021-2031, $ mn
Figure 23. Asia Pacific Substrate-Like PCB Market by Application: Automotive Industry, 2021-2031, $ mn
Figure 24. Asia Pacific Substrate-Like PCB Market by Application: Medical Industry, 2021-2031, $ mn
Figure 25. Asia Pacific Substrate-Like PCB Market by Application: Industrial Use, 2021-2031, $ mn
Figure 26. Asia Pacific Substrate-Like PCB Market by Application: Computing and Communications, 2021-2031, $ mn
Figure 27. Asia Pacific Substrate-Like PCB Market by Application: Other Applications, 2021-2031, $ mn
Figure 28. Breakdown of APAC Substrate-Like PCB Market by Country, 2021 and 2031, % of Revenue
Figure 29. Contribution to APAC 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%)
Figure 30. Substrate-Like PCB Market in Japan, 2021-2031, $ mn
Figure 31. Substrate-Like PCB Market in China, 2021-2031, $ mn
Figure 32. Substrate-Like PCB Market in Australia, 2021-2031, $ mn
Figure 33. Substrate-Like PCB Market in India, 2021-2031, $ mn
Figure 34. Substrate-Like PCB Market in South Korea, 2021-2031, $ mn
Figure 35. Substrate-Like PCB Market in Rest of APAC, 2021-2031, $ mn
Figure 36. Growth Stage of Asia Pacific Substrate-Like PCB Industry over the Forecast Period
Figure 1. Research Method Flow Chart
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation
Figure 3. Asia Pacific Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031
Figure 4. Asia Pacific Substrate-Like PCB Market, 2021-2031, $ mn
Figure 5. Impact of COVID-19 on Business
Figure 6. Primary Drivers and Impact Factors of Asia Pacific Substrate-Like PCB Market
Figure 7. World Smartphone Market by Value, 2017-2027, $ bn
Figure 8. World Smart Wearable Devices Market, 2019-2030, $ mn
Figure 9. Primary Restraints and Impact Factors of Asia Pacific Substrate-Like PCB Market
Figure 10. Investment Opportunity Analysis
Figure 11. Porter’s Fiver Forces Analysis of Asia Pacific Substrate-Like PCB Market
Figure 12. Breakdown of Asia Pacific Substrate-Like PCB Market by Inspection Technology, 2021-2031, % of Revenue
Figure 13. Asia Pacific Addressable Market Cap in 2022-2031 by Inspection Technology, Value ($ mn) and Share (%)
Figure 14. Asia Pacific Substrate-Like PCB Market by Inspection Technology: Automated Optical Inspection (AOI), 2021-2031, $ mn
Figure 15. Asia Pacific Substrate-Like PCB Market by Inspection Technology: Direct Imaging (DI), 2021-2031, $ mn
Figure 16. Breakdown of Asia Pacific Substrate-Like PCB Market by Line/Space, 2021-2031, % of Sales Revenue
Figure 17. Asia Pacific Addressable Market Cap in 2022-2031 by Line/Space, Value ($ mn) and Share (%)
Figure 18. Asia Pacific Substrate-Like PCB Market by Line/Space: 25/25 and 30/30 ?m, 2021-2031, $ mn
Figure 19. Asia Pacific Substrate-Like PCB Market by Line/Space: Less than 25/25 ?m, 2021-2031, $ mn
Figure 20. Breakdown of Asia Pacific Substrate-Like PCB Market by Application, 2021-2031, % of Sales Revenue
Figure 21. Asia Pacific Addressable Market Cap in 2022-2031 by Application, Value ($ mn) and Share (%)
Figure 22. Asia Pacific Substrate-Like PCB Market by Application: Consumer Electronics, 2021-2031, $ mn
Figure 23. Asia Pacific Substrate-Like PCB Market by Application: Automotive Industry, 2021-2031, $ mn
Figure 24. Asia Pacific Substrate-Like PCB Market by Application: Medical Industry, 2021-2031, $ mn
Figure 25. Asia Pacific Substrate-Like PCB Market by Application: Industrial Use, 2021-2031, $ mn
Figure 26. Asia Pacific Substrate-Like PCB Market by Application: Computing and Communications, 2021-2031, $ mn
Figure 27. Asia Pacific Substrate-Like PCB Market by Application: Other Applications, 2021-2031, $ mn
Figure 28. Breakdown of APAC Substrate-Like PCB Market by Country, 2021 and 2031, % of Revenue
Figure 29. Contribution to APAC 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%)
Figure 30. Substrate-Like PCB Market in Japan, 2021-2031, $ mn
Figure 31. Substrate-Like PCB Market in China, 2021-2031, $ mn
Figure 32. Substrate-Like PCB Market in Australia, 2021-2031, $ mn
Figure 33. Substrate-Like PCB Market in India, 2021-2031, $ mn
Figure 34. Substrate-Like PCB Market in South Korea, 2021-2031, $ mn
Figure 35. Substrate-Like PCB Market in Rest of APAC, 2021-2031, $ mn
Figure 36. Growth Stage of Asia Pacific Substrate-Like PCB Industry over the Forecast Period