Asia Pacific Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity

April 2023 | 131 pages | ID: AA53C27A07F4EN
GMD Research

Abstracts

Asia Pacific advanced IC substrates market will grow by 7.6% annually with a total addressable market cap of $92,888.8 million over 2023-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.

Highlighted with 58 tables and 49 figures, this 131-page report “Asia Pacific Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:

• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces

The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.

Based on Packaging Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• FC BGA
• FC CSP
• Other Packaging Types

Based on Material Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate

By Manufacturing Method, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)

By Bonding Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)

By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications

Geographically, the following national/local markets are fully investigated:

• Japan
• China
• South Korea
• Australia
• Taiwan
• Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)

For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included.

The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.

Selected Key Players:

ASE Group

AT&S Austria Technologie & Systemtechnik AG

Fujitsu Ltd.

IBIDEN Co., Ltd.

Kinsus Interconnect Technology Corp.

Korea Circuit Co., Ltd.

KYOCERA Corporation

LG Innotek Co., Ltd.

Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)

Shenzhen Fastprint Circuit Tech

Shinko Electric Industries Co., Ltd.

Siliconware Precision Industries Co., Ltd.

STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)

TTM Technologies Inc.

Unimicron Corporation

Zhen Ding Technology Holding Ltd.

Zhuhai ACCESS Semiconductor

(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

Contents

1 INTRODUCTION

1.1 Industry Definition and Research Scope
  1.1.1 Industry Definition
  1.1.2 Research Scope
1.2 Research Methodology
  1.2.1 Overview of Market Research Methodology
  1.2.2 Market Assumption
  1.2.3 Secondary Data
  1.2.4 Primary Data
  1.2.5 Data Filtration and Model Design
  1.2.6 Market Size/Share Estimation
  1.2.7 Research Limitations
1.3 Executive Summary

2 MARKET OVERVIEW AND DYNAMICS

2.1 Market Size and Forecast
  2.1.1 Impact of COVID-19 on World Economy
  2.1.2 Impact of COVID-19 on the Market
  2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery
2.2 Major Growth Drivers
2.3 Market Restraints and Challenges
2.4 Emerging Opportunities and Market Trends
2.5 Porter’s Fiver Forces Analysis

3 SEGMENTATION OF ASIA PACIFIC MARKET BY PACKAGING TYPE

3.1 Market Overview by Packaging Type
3.2 FC BGA
3.3 FC CSP
3.4 Other Packaging Types

4 SEGMENTATION OF ASIA PACIFIC MARKET BY MATERIAL TYPE

4.1 Market Overview by Material Type
4.2 Rigid Integrated Circuit Substrate
4.3 Flex Integrated Circuit Substrate
4.4 Ceramic Integrated Circuit Substrate

5 SEGMENTATION OF ASIA PACIFIC MARKET BY MANUFACTURING METHOD

5.1 Market Overview by Manufacturing Method
5.2 Subtraction Process (SP)
5.3 Addition Process (AP)
5.4 Modified Semi-additive Process (MSAP)

6 SEGMENTATION OF ASIA PACIFIC MARKET BY BONDING TECHNOLOGY

6.1 Market Overview by Bonding Technology
6.2 Wire Bonding
6.3 FC Bonding
6.4 Tape Automated Bonding (TAB)

7 SEGMENTATION OF ASIA PACIFIC MARKET BY APPLICATION

7.1 Market Overview by Application
7.2 Mobile and Consumer Electronics
7.3 Automotive and Transportation
7.4 IT and Telecom
7.5 Other Applications

8 ASIA-PACIFIC MARKET 2021-2031 BY COUNTRY/REGION

8.1 Overview of Asia-Pacific Market
8.2 Japan
8.3 China
8.4 Australia
8.5 Taiwan
8.6 South Korea
8.7 Rest of APAC Region

9 COMPETITIVE LANDSCAPE

9.1 Overview of Key Vendors
9.2 New Product Launch, Partnership, Investment, and M&A
9.3 Company Profiles
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
RELATED REPORTS

List Of Tables

LIST OF TABLES:

Table 1. Snapshot of Asia Pacific Advanced IC Substrates Market in Balanced Perspective, 2021-2031
Table 2. World Economic Outlook, 2021-2031
Table 3. World Economic Outlook, 2021-2023
Table 4. Scenarios for Economic Impact of Ukraine Crisis
Table 5. World Semiconductor Market, 2021-2031, $ bn
Table 6. Main Product Trends and Market Opportunities in Asia Pacific Advanced IC Substrates Market
Table 7. Asia Pacific Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 8. Asia Pacific Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 9. Asia Pacific Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn
Table 10. Asia Pacific Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn
Table 11. Asia Pacific Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 12. APAC Advanced IC Substrates Market by Country/Region, 2021-2031, $ mn
Table 13. Japan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 14. Japan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 15. Japan Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 16. China Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 17. China Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 18. China Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 19. Australia Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 20. Australia Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 21. Australia Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 22. Taiwan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 23. Taiwan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 24. Taiwan Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 25. South Korea Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn
Table 26. South Korea Advanced IC Substrates Market by Material Type, 2021-2031, $ mn
Table 27. South Korea Advanced IC Substrates Market by Application, 2021-2031, $ mn
Table 28. Advanced IC Substrates Market in Rest of APAC by Country/Region, 2021-2031, $ mn
Table 29. ASE Group: Company Snapshot
Table 30. ASE Group: Business Segmentation
Table 31. ASE Group: Product Portfolio
Table 32. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot
Table 33. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment
Table 34. Fujitsu Limited: Company Snapshot
Table 35. Fujitsu Limited: Business Segmentation and Share
Table 36. Fujitsu Limited: Revenue Distribution by Region in 2021
Table 37. IBIDEN Co., Ltd.: Company Snapshot
Table 38. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment
Table 39. Kinsus Interconnect Technology Corp..: Company Snapshot
Table 40. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment
Table 41. Korea Circuit Co., Ltd.: Company Snapshot
Table 42. KYOCERA Corporation: Company Snapshot
Table 43. KYOCERA Corporation: Breakdown of Revenue by Business Segment
Table 44. LG Innotek Co., Ltd.: Company Snapshot
Table 45. Nan Ya PCB Co., Ltd.: Company Snapshot
Table 46. Shenzhen Fastprint Circuit Tech: Company Snapshot
Table 47. Shinko Electric Industries Co., Ltd.: Company Snapshot
Table 48. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment
Table 49. Siliconware Precision Industries Co., Ltd.: Company Snapshot
Table 50. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment
Table 51. STATS ChipPAC Pte. Ltd.: Company Snapshot
Table 52. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment
Table 53. TTM Technologies Inc.: Company Snapshot
Table 54. TTM Technologies Inc.: Breakdown of Revenue by Business Segment
Table 55. Unimicron Corporation: Company Snapshot
Table 56. Unimicron Corporation: Breakdown of Revenue by Business Segment
Table 57. Zhen Ding Technology Holding Ltd.: Company Snapshot
Table 58. Zhuhai ACCESS Semiconductor: Company Snapshot

List Of Figures

LIST OF FIGURES:

Figure 1. Research Method Flow Chart
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation
Figure 3. Asia Pacific Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2022-2031
Figure 4. Industry Value Chain Analysis
Figure 5. Asia Pacific Advanced IC Substrates Market, 2021-2031, $ mn
Figure 6. Impact of COVID-19 on Business
Figure 7. Primary Drivers and Impact Factors of Asia Pacific Advanced IC Substrates Market
Figure 8. World 5G Devices Market by Value, 2019-2030, $ bn
Figure 9. World Autonomous Vehicle Market, 2019-2030, $ mn
Figure 10. Primary Restraints and Impact Factors of Asia Pacific Advanced IC Substrates Market
Figure 11. Investment Opportunity Analysis
Figure 12. Porter’s Fiver Forces Analysis of Asia Pacific Advanced IC Substrates Market
Figure 13. Breakdown of Asia Pacific Advanced IC Substrates Market by Packaging Type, 2021-2031, % of Revenue
Figure 14. Asia Pacific Addressable Market Cap in 2023-2031 by Packaging Type, Value ($ mn) and Share (%)
Figure 15. Asia Pacific Advanced IC Substrates Market by Packaging Type: FC BGA, 2021-2031, $ mn
Figure 16. Asia Pacific Advanced IC Substrates Market by Packaging Type: FC CSP, 2021-2031, $ mn
Figure 17. Asia Pacific Advanced IC Substrates Market by Packaging Type: Other Packaging Types, 2021-2031, $ mn
Figure 18. Breakdown of Asia Pacific Advanced IC Substrates Market by Material Type, 2021-2031, % of Sales Revenue
Figure 19. Asia Pacific Addressable Market Cap in 2023-2031 by Material Type, Value ($ mn) and Share (%)
Figure 20. Asia Pacific Advanced IC Substrates Market by Material Type: Rigid Integrated Circuit Substrate, 2021-2031, $ mn
Figure 21. Asia Pacific Advanced IC Substrates Market by Material Type: Flex Integrated Circuit Substrate, 2021-2031, $ mn
Figure 22. Asia Pacific Advanced IC Substrates Market by Material Type: Ceramic Integrated Circuit Substrate, 2021-2031, $ mn
Figure 23. Breakdown of Asia Pacific Advanced IC Substrates Market by Manufacturing Method, 2021-2031, % of Sales Revenue
Figure 24. Asia Pacific Addressable Market Cap in 2023-2031 by Manufacturing Method, Value ($ mn) and Share (%)
Figure 25. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Subtraction Process (SP), 2021-2031, $ mn
Figure 26. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Addition Process (AP), 2021-2031, $ mn
Figure 27. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Modified Semi-additive Process (MSAP), 2021-2031, $ mn
Figure 28. Breakdown of Asia Pacific Advanced IC Substrates Market by Bonding Technology, 2021-2031, % of Revenue
Figure 29. Asia Pacific Addressable Market Cap in 2023-2031 by Bonding Technology, Value ($ mn) and Share (%)
Figure 30. Asia Pacific Advanced IC Substrates Market by Bonding Technology: Wire Bonding, 2021-2031, $ mn
Figure 31. Picture of Wire Bonding Illustrated in a DIP Package
Figure 32. Asia Pacific Advanced IC Substrates Market by Bonding Technology: FC Bonding, 2021-2031, $ mn
Figure 33. Picture of a Flipped Chip (IC) on a Passive Substrate
Figure 34. Asia Pacific Advanced IC Substrates Market by Bonding Technology: Tape Automated Bonding (TAB), 2021-2031, $ mn
Figure 35. Breakdown of Asia Pacific Advanced IC Substrates Market by Application, 2021-2031, % of Revenue
Figure 36. Asia Pacific Addressable Market Cap in 2023-2031 by Application, Value ($ mn) and Share (%)
Figure 37. Asia Pacific Advanced IC Substrates Market by Application: Mobile and Consumer Electronics, 2021-2031, $ mn
Figure 38. Asia Pacific Advanced IC Substrates Market by Application: Automotive and Transportation, 2021-2031, $ mn
Figure 39. Asia Pacific Advanced IC Substrates Market by Application: IT and Telecom, 2021-2031, $ mn
Figure 40. Asia Pacific Advanced IC Substrates Market by Application: Other Applications, 2021-2031, $ mn
Figure 41. Breakdown of APAC Advanced IC Substrates Market by Country/Region, 2022 and 2031, % of Revenue
Figure 42. Contribution to APAC 2023-2031 Cumulative Market by Country/Region, Value ($ mn) and Share (%)
Figure 43. Advanced IC Substrates Market in Japan, 2021-2031, $ mn
Figure 44. Advanced IC Substrates Market in China, 2021-2031, $ mn
Figure 45. Advanced IC Substrates Market in Australia, 2021-2031, $ mn
Figure 46. Advanced IC Substrates Market in Taiwan, 2021-2031, $ mn
Figure 47. Advanced IC Substrates Market in South Korea, 2021-2031, $ mn
Figure 48. Advanced IC Substrates Market in Rest of APAC, 2021-2031, $ mn
Figure 49. Growth Stage of Asia Pacific Advanced IC Substrates Industry over the Forecast Period