3D Semiconductor Packaging Market - Forecasts from 2019 to 2024
The three-dimensional integrated circuits (ICs) are integrated circuits manufactured using a new packaging technology of stacking silicon wafers and interconnecting them vertically using Through Silicon Vias (TSVs) or Cu-Cu connections, so that they behave as a single device, achieving improved performance at reduced power and smaller footprint than two-dimensional processes. The 3D semiconductor packaging market is expected to grow at a significant CAGR of 14.46% to reach a market size of US$6.044 billion in 2024 from US$2.688 billion in 2018. As the demand for higher capacity electronic devices with more efficient power consumption increases, it drives the need to implement 3D ICs in various such devices.
DRIVERS
Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.
Heavy investments on the R&D by many key industry players.
RESTRAINTS
Competition from already established tech giants who are heavily investing in this area.
Lack of clarity regarding standardization and ownership concerns
RECENT DEVELOPMENTS
In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.
ASE Group is considering a merger with SPIL.
Segmentation
The 3D Semiconductor packaging market has been analyzed through the following segments:
By Technology
Through Silicon Vias (TSV)
Fan Out Wafer Level Packaging
Wire Bonding
Others
By Industry Vertical
Electronics
Communication and Technology
Manufacturing
Automotive
Defense and Aerospace
Healthcare
Others
By Material
Bonding Wire
Lead frame
Organic Substrate
Encapsulation Resin
Ceramic Package
Die Attach Material
Others
By Geography
North America
USA
Canada
Others
South America
Brazil
Argentina
Others
Europe
United Kingdom
Germany
France
Others
Middle East and Africa
Israel
UAE
Saudi Arabia
Others
Asia Pacific
China
Japan
South Korea
India
Others
DRIVERS
Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.
Heavy investments on the R&D by many key industry players.
RESTRAINTS
Competition from already established tech giants who are heavily investing in this area.
Lack of clarity regarding standardization and ownership concerns
RECENT DEVELOPMENTS
In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.
ASE Group is considering a merger with SPIL.
Segmentation
The 3D Semiconductor packaging market has been analyzed through the following segments:
By Technology
Through Silicon Vias (TSV)
Fan Out Wafer Level Packaging
Wire Bonding
Others
By Industry Vertical
Electronics
Communication and Technology
Manufacturing
Automotive
Defense and Aerospace
Healthcare
Others
By Material
Bonding Wire
Lead frame
Organic Substrate
Encapsulation Resin
Ceramic Package
Die Attach Material
Others
By Geography
North America
USA
Canada
Others
South America
Brazil
Argentina
Others
Europe
United Kingdom
Germany
France
Others
Middle East and Africa
Israel
UAE
Saudi Arabia
Others
Asia Pacific
China
Japan
South Korea
India
Others
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. KEY FINDINGS
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. 3D SEMICONDUCTOR PACKAGING MARKET BY TECHNOLOGY
5.1. Through Silicon Vias (TSV)
5.2. Fan Out Wafer Level Packaging
5.3. Wire Bonding
5.4. Others
6. 3D SEMICONDUCTOR PACKAGING MARKET BY INDUSTRY VERTICAL
6.1. Electronics
6.2. Communication and Technology
6.3. Manufacturing
6.4. Automotive
6.5. Defense and Aerospace
6.6. Healthcare
6.7. Others
7. 3D SEMICONDUCTOR PACKAGING MARKET BY MATERIAL
7.1. Bonding Wire
7.2. Lead frame
7.3. Organic Substrate
7.4. Encapsulation Resin
7.5. Organic Substrate
7.6. Ceramic Package
7.7. Die Attach Material
7.8. Others
8. 3D SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Others
8.2. South America
8.2.1. Brazil
8.2.2. Argentina
8.2.3. Others
8.3. Europe
8.3.1. United Kingdom
8.3.2. Germany
8.3.3. France
8.3.4. Others
8.4. Middle East and Africa
8.4.1. Israel
8.4.2. UAE
8.4.3. Saudi Arabia
8.4.4. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. India
8.5.5. Others
9. COMPETITIVE INTELLIGENCE
9.1. Competitive Benchmarking and Analysis
9.2. Recent Investments and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. Samsung Electronics
10.2. Intel Corporation
10.3. Xilinx
10.4. Sony
10.5. Taiwan Semiconductor Manufacturing Company
10.6. Amkor Technology Inc
10.7. ASE Group
10.8. Microchip
10.9. Siliconware PrecisionIndustries Co.
10.10. GlobalFOundries Inc
10.11. Applied Materials
10.12. International Busines Machines Corp.
10.13. Tezzaron Semiconductors
10.14. STATS ChipPac Ltd
10.15. Micralyne, Inc
10.16. Toshiba
10.17. SK Hynix
LIST OF FIGURES
LIST OF TABLES
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. KEY FINDINGS
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. 3D SEMICONDUCTOR PACKAGING MARKET BY TECHNOLOGY
5.1. Through Silicon Vias (TSV)
5.2. Fan Out Wafer Level Packaging
5.3. Wire Bonding
5.4. Others
6. 3D SEMICONDUCTOR PACKAGING MARKET BY INDUSTRY VERTICAL
6.1. Electronics
6.2. Communication and Technology
6.3. Manufacturing
6.4. Automotive
6.5. Defense and Aerospace
6.6. Healthcare
6.7. Others
7. 3D SEMICONDUCTOR PACKAGING MARKET BY MATERIAL
7.1. Bonding Wire
7.2. Lead frame
7.3. Organic Substrate
7.4. Encapsulation Resin
7.5. Organic Substrate
7.6. Ceramic Package
7.7. Die Attach Material
7.8. Others
8. 3D SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Others
8.2. South America
8.2.1. Brazil
8.2.2. Argentina
8.2.3. Others
8.3. Europe
8.3.1. United Kingdom
8.3.2. Germany
8.3.3. France
8.3.4. Others
8.4. Middle East and Africa
8.4.1. Israel
8.4.2. UAE
8.4.3. Saudi Arabia
8.4.4. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. India
8.5.5. Others
9. COMPETITIVE INTELLIGENCE
9.1. Competitive Benchmarking and Analysis
9.2. Recent Investments and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. Samsung Electronics
10.2. Intel Corporation
10.3. Xilinx
10.4. Sony
10.5. Taiwan Semiconductor Manufacturing Company
10.6. Amkor Technology Inc
10.7. ASE Group
10.8. Microchip
10.9. Siliconware PrecisionIndustries Co.
10.10. GlobalFOundries Inc
10.11. Applied Materials
10.12. International Busines Machines Corp.
10.13. Tezzaron Semiconductors
10.14. STATS ChipPac Ltd
10.15. Micralyne, Inc
10.16. Toshiba
10.17. SK Hynix
LIST OF FIGURES
LIST OF TABLES
