Global Physical Vapor Deposition Equipment for SiC and GaN Supply, Demand and Key Producers, 2026-2032

September 2026 | 133 pages | ID: G1C67E91076DEN
GlobalInfoResearch

Abstracts

The global Physical Vapor Deposition Equipment for SiC and GaN market size is expected to reach $ 2371 million by 2032, rising at a market growth of 7.4% CAGR during the forecast period (2026-2032).

In 2025, global Physical Vapor Deposition Equipment for SiC and GaN production reached approximately 1,215 units with average price of 1.05 million USD/Unit .

Physical Vapor Deposition Equipment for SiC and GaN refers to vacuum thin-film deposition systems used in the fabrication of silicon carbide and gallium nitride semiconductor devices, where materials are physically transferred from solid or vapor sources and deposited onto device wafers to form functional thin films. The equipment is primarily used for frontside metallization, backside metallization, ohmic and Schottky contacts, gate and interconnect metals, barrier or seed layers, carbon protective layers and other functional films required in SiC and GaN device processing. Typical systems integrate high-vacuum process chambers, sputtering or evaporation sources, wafer handling, pre-clean and thermal-conditioning modules, process control and automation. Core specifications include supported wafer diameter, film uniformity, deposition rate, particle performance, vacuum level, wafer temperature capability, film stress and production throughput. This study classifies Physical Vapor Deposition Equipment for SiC and GaN by deposition technology into Magnetron Sputtering PVD Equipment, Ionized PVD Equipment, Evaporation PVD Equipment and Other PVD Equipment, with applications primarily in SiC MOSFETs, SiC diodes, GaN HEMTs, GaN power devices, GaN RF devices and associated compound-semiconductor R&D and production lines.

Key Findings

• Magnetron sputtering represents the principal PVD technology route for metallization and functional thin-film formation in SiC and GaN device manufacturing
• SiC power-device manufacturing is driving demand for specialized wafer handling backside metallization contact formation and carbon protective-layer deposition
• GaN PVD applications are extending from conventional metallization toward contacts functional layers and emerging sputtered compound-semiconductor films
• Equipment competition increasingly centers on process stability film uniformity wafer handling productivity and integration of multiple vacuum process modules

Market Trends

Physical Vapor Deposition Equipment for SiC and GaN is evolving from adapted semiconductor PVD platforms toward process architectures specifically optimized for wide-bandgap semiconductor manufacturing. SiC production creates distinctive requirements associated with transparent or semi-transparent wafer handling, wafer bow, thinner processed wafers, backside metallization, high-temperature process compatibility and carbon protection following implantation, while GaN devices require tightly controlled contact metals, gate structures, seed layers and other functional films. Applied Materials has enhanced Endura wafer handling for transparent SiC wafers, KLA's SPTS Sigma PVD platform addresses metal deposition for power devices, ULVAC offers dedicated sputtering and evaporation systems within its SiC process portfolio, and Evatec explicitly develops PVD technologies for both SiC and GaN power devices. The broader technology direction is toward cluster-based vacuum integration, lower contamination, tighter film-stress control and greater flexibility in frontside and backside processing. For GaN, PVD is also expanding beyond conventional metal deposition, with development work involving sputtered GaN and lattice-matching or seed-layer processes, indicating potential for PVD to participate in a broader portion of future compound-semiconductor thin-film stacks.

Market Dynamics

Drivers

The major demand driver is the continuing industrialization of SiC and GaN power and RF semiconductor manufacturing. SiC devices require multiple metal and functional-film deposition steps across frontside contacts, backside structures and related interfaces, while increasing wafer diameters and higher-volume production raise requirements for repeatability, automated wafer handling and throughput. KLA describes PVD as an important process for thick frontside conductor layers and multilayer backside metallization in power semiconductor devices, while Evatec positions PVD systems for high-volume production of power transistors and diodes. GaN adds another growth dimension through power electronics and RF applications, where contact formation and other specialized thin films must be deposited with tight control over composition, stress and interface quality. The movement of wide-bandgap devices from specialty production toward increasingly standardized manufacturing therefore supports investment in production-grade PVD platforms rather than laboratory deposition tools alone.

Restraints

Physical Vapor Deposition Equipment for SiC and GaN faces relatively high equipment and process-development barriers. Wide-bandgap wafers can present handling characteristics that differ from conventional silicon, and device performance is sensitive to contact resistance, film adhesion, stress, contamination and thermal history. Process chambers, targets, wafer handling and pre-treatment modules must therefore be optimized around individual film stacks and device architectures, increasing qualification time and engineering cost. Production equipment also requires high vacuum reliability, particle control, preventive maintenance and stable target utilization over long manufacturing cycles. In addition, PVD competes with alternative deposition technologies for selected functional films, meaning the addressable process share depends on material requirements and device design rather than simply on growth in SiC and GaN wafer output.

Opportunities

The most attractive opportunities are associated with expanding SiC wafer production, increasing device complexity and the extension of PVD into additional GaN functional films. SiC manufacturing increasingly requires specialized backside metal stacks, frontside contact layers and carbon capping or protective deposition, creating opportunities for dedicated modules and multi-chamber platforms. Evatec explicitly identifies PVD solutions for metals, contacts, piezoelectrics and dielectrics in SiC and GaN power devices, while ULVAC combines sputtering and evaporation systems within its power-device process portfolio. For GaN, emerging sputter-based deposition of GaN and lattice-matching or seed layers could broaden the role of PVD beyond metallization if manufacturing performance and economics continue to improve. Another opportunity lies in integrating pre-clean, heating, cooling and multiple deposition modules within cluster architectures, reducing atmospheric exposure between critical process steps and enabling equipment suppliers to capture more value per manufacturing line.

Challenges

The central challenge is converting technically feasible PVD processes into stable, high-yield production recipes across increasingly demanding SiC and GaN device structures. Film thickness, composition, interface cleanliness and stress must remain tightly controlled across the wafer and from lot to lot, while power-device wafers can introduce additional challenges associated with bow, thinning and backside processing. Equipment makers must also support evolving wafer diameters without compromising yield or productivity. In GaN, the range of competing deposition approaches and the diversity of RF and power-device architectures create additional uncertainty regarding which functional layers will ultimately migrate toward sputtering or other PVD methods. Suppliers therefore need strong process-development capability in addition to vacuum-equipment engineering, while customers increasingly evaluate equipment based on demonstrated device-level results, uptime, service response and production economics rather than nominal deposition specifications alone.

Industry Chain Analysis

The upstream industry chain for Physical Vapor Deposition Equipment for SiC and GaN includes vacuum chambers, vacuum pumps, valves, mass-flow and pressure-control components, sputtering cathodes, evaporation sources, RF and DC power supplies, targets and evaporation materials, heaters, electrostatic or mechanical wafer chucks, wafer-transfer robots, sensors and process-control electronics. Semiconductor-grade metal and compound targets are critical consumables because purity, microstructure and target utilization affect film quality and operating cost. The increasing use of cluster architectures also raises the importance of transfer chambers, load locks, pre-clean modules and integrated vacuum-control systems. KLA's Sigma platform supports integration of pretreatment with PVD within a cluster environment, while ULVAC offers multi-chamber platforms capable of combining PVD with heating, cooling and pre-clean functionality.

Midstream equipment manufacturers create value through vacuum-system design, process-source engineering, wafer handling, film-uniformity control, recipe development and integration of multiple deposition and pretreatment steps. Downstream customers are SiC and GaN wafer fabs, integrated device manufacturers, foundries, compound-semiconductor producers and R&D or pilot facilities. The economic value of equipment is strongly linked to process qualification and installed-base support because customers require stable recipes, spare parts, chamber maintenance and target-management services throughout production. As SiC and GaN manufacturing scales, competitive advantage increasingly depends on the ability to combine equipment reliability with device-specific process expertise and global field-service capability.

Segment Insights

By deposition technology, the Physical Vapor Deposition Equipment for SiC and GaN market is classified into Magnetron Sputtering PVD Equipment, Ionized PVD Equipment, Evaporation PVD Equipment and Other PVD Equipment. Magnetron sputtering forms the broadest technology base because it supports controlled deposition of metals and other functional materials with high uniformity and compatibility with automated semiconductor manufacturing. Production sputtering platforms are widely used for frontside and backside metallization, contact layers, UBM-related structures and other device films. ULVAC's power-device portfolio includes dedicated sputtering systems, while KLA's Sigma PVD platform deposits conductive and insulating layers for semiconductor and power-device applications.

Ionized PVD provides additional control over incoming material flux and step coverage and is valuable where device structures require enhanced bottom or sidewall coverage and lower-temperature processing. Applied Materials' high-ionization PVD technologies illustrate the role of plasma-assisted control in advanced metal deposition. Evaporation remains relevant for selected metal stacks and compound-semiconductor processes where material characteristics, deposition rate or film requirements favor thermal or electron-beam evaporation. The technology mix therefore reflects individual device structures rather than a single universal deposition method, although sputtering remains the most broadly applicable route across SiC and GaN manufacturing.

Downstream Market Opportunities

SiC power devices represent one of the clearest downstream opportunities for Physical Vapor Deposition Equipment for SiC and GaN because MOSFETs, Schottky diodes and related devices require multiple contact and metallization steps, including specialized backside processes. Applied Materials, Evatec, KLA/SPTS and ULVAC have all developed PVD capabilities relevant to power-device processing, demonstrating the increasing equipment intensity of this manufacturing segment. GaN power devices and GaN RF devices provide another opportunity through ohmic contacts, gate metallization and functional-film requirements, while emerging sputtered GaN processes could create additional equipment demand if adopted in production. R&D and pilot lines remain commercially relevant because wide-bandgap semiconductor manufacturers continue to develop new materials, contact schemes and device structures before transferring processes into high-volume manufacturing.

Regional Insights

Asia-Pacific is a strategically important manufacturing region for Physical Vapor Deposition Equipment for SiC and GaN because the region combines significant semiconductor equipment manufacturing capabilities with expanding SiC and GaN device investment. Japan maintains established vacuum and semiconductor-equipment expertise through suppliers such as ULVAC and Canon Anelva, while China has developed domestic PVD equipment capabilities through confirmed suppliers including NAURA, Guangdong Huicheng Vacuum and SJI-SEMI. Taiwan's Skytech also participates in compound-semiconductor PVD equipment. This regional supplier expansion is increasing localization opportunities for wide-bandgap semiconductor production lines while raising competition around cost, delivery lead times and domestic technical support.

North America and Europe maintain strong positions in high-end process equipment and process development. Applied Materials and KLA/SPTS provide semiconductor-scale deposition platforms, while Evatec and Plasma-Therm contribute specialized compound-semiconductor and power-device capabilities. Evatec explicitly addresses SiC and GaN power-device PVD, including emerging GaN deposition processes, demonstrating Europe's continuing role in advanced thin-film development. Regional competition therefore differs in emphasis: North American and European suppliers generally benefit from process expertise and established semiconductor installed bases, while Asian suppliers increasingly combine local manufacturing, customer proximity and expanding wide-bandgap semiconductor ecosystems.

Competitive Landscape Analysis

The competitive landscape of Physical Vapor Deposition Equipment for SiC and GaN combines large semiconductor capital-equipment companies, established vacuum-technology groups and specialized PVD suppliers. Applied Materials and KLA/SPTS participate through semiconductor-grade PVD platforms and broad installed-base process expertise; Evatec has developed a focused position in thin-film technologies for SiC and GaN power devices; ULVAC combines sputtering, evaporation and other process equipment within a broad power-device portfolio. NAURA, Guangdong Huicheng Vacuum, SJI-SEMI and Skytech broaden the Asian supplier base, while KDF Technologies, PVD Products and Plasma-Therm represent more specialized equipment approaches. Canon Anelva also contributes established semiconductor sputtering capability. Competition is increasingly determined by the ability to handle wide-bandgap wafers reliably, qualify application-specific film stacks, maintain low particles and stable film properties, integrate frontside and backside processes and support customers during production ramps. Large semiconductor-equipment groups benefit from process integration, installed-base service and manufacturing scale, whereas specialist suppliers can differentiate through application flexibility, customized chamber configurations and faster development around specific SiC or GaN processes. As device manufacturing matures, sustained differentiation is likely to depend more on production yield, uptime, process repeatability and total cost of ownership than on basic PVD availability.

Report Scope

This report studies the global Physical Vapor Deposition Equipment for SiC and GaN production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Physical Vapor Deposition Equipment for SiC and GaN and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Physical Vapor Deposition Equipment for SiC and GaN that contribute to its increasing demand across many markets.

Highlights and key features of the study

• Global Physical Vapor Deposition Equipment for SiC and GaN total production and demand, 2021-2032, (Units)
• Global Physical Vapor Deposition Equipment for SiC and GaN total production value, 2021-2032, (USD Million)
• Global Physical Vapor Deposition Equipment for SiC and GaN production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
• Global Physical Vapor Deposition Equipment for SiC and GaN consumption by region & country, CAGR, 2021-2032 & (Units)
• U.S. VS China: Physical Vapor Deposition Equipment for SiC and GaN domestic production, consumption, key domestic manufacturers and share
• Global Physical Vapor Deposition Equipment for SiC and GaN production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
• Global Physical Vapor Deposition Equipment for SiC and GaN production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
• Global Physical Vapor Deposition Equipment for SiC and GaN production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)

This report profiles key players in the global Physical Vapor Deposition Equipment for SiC and GaN market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Applied Materials, Inc., Evatec AG, KLA Corporation (SPTS Technologies), NAURA Technology Group Co., Ltd., Guangdong Huicheng Vacuum Technology Co., Ltd., Canon Anelva Corporation, ULVAC, Inc., KDF Technologies, PVD Products, Inc., SJI-SEMI Co., Ltd., etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Physical Vapor Deposition Equipment for SiC and GaN market

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.

Global Physical Vapor Deposition Equipment for SiC and GaN Market, By Region:

• United States
• China
• Europe
• Japan
• South Korea
• ASEAN
• India
• Rest of World

Market Segmentation

Global Physical Vapor Deposition Equipment for SiC and GaN Market, Segmentation by Type:

• Magnetron Sputtering Systems
• Evaporation PVD Systems
• Ion-Beam and HiPIMS Systems
• Hybrid PVD Systems
• Others

Global Physical Vapor Deposition Equipment for SiC and GaN Market, Segmentation by Wafer Size:

• Wafer Size 150 mm and Below
• 200 mm Wafer Systems
• 300 mm Wafer Systems
• Multi-Size Flexible Systems
• Others

Global Physical Vapor Deposition Equipment for SiC and GaN Market, Segmentation by Structure:

• Cluster PVD Systems
• Standalone PVD Systems
• In-Line PVD Systems

Global Physical Vapor Deposition Equipment for SiC and GaN Market, Segmentation by Application:

• SiC Devices
• GaN Devices

Companies Profiled:

• Applied Materials, Inc.
• Evatec AG
• KLA Corporation (SPTS Technologies)
• NAURA Technology Group Co., Ltd.
• Guangdong Huicheng Vacuum Technology Co., Ltd.
• Canon Anelva Corporation
• ULVAC, Inc.
• KDF Technologies
• PVD Products, Inc.
• SJI-SEMI Co., Ltd.
• Skytech Inc.
• Plasma-Therm LLC

Key Questions Answered

1. How big is the global Physical Vapor Deposition Equipment for SiC and GaN market?
2. What is the demand of the global Physical Vapor Deposition Equipment for SiC and GaN market?
3. What is the year over year growth of the global Physical Vapor Deposition Equipment for SiC and GaN market?
4. What is the total value of the global Physical Vapor Deposition Equipment for SiC and GaN market?
5. Who are the Major Players in the global Physical Vapor Deposition Equipment for SiC and GaN market?
6. What are the growth factors driving the market demand?

Contents

1 SUPPLY SUMMARY

1.1 Physical Vapor Deposition Equipment for SiC and GaN Introduction
1.2 World Physical Vapor Deposition Equipment for SiC and GaN Supply & Forecast
  1.2.1 World Physical Vapor Deposition Equipment for SiC and GaN Production Value (2021 & 2025 & 2032)
  1.2.2 World Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032)
  1.2.3 World Physical Vapor Deposition Equipment for SiC and GaN Pricing Trends (2021-2032)
1.3 World Physical Vapor Deposition Equipment for SiC and GaN Production by Region (Based on Production Site)
  1.3.1 World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Region (2021-2032)
  1.3.2 World Physical Vapor Deposition Equipment for SiC and GaN Production by Region (2021-2032)
  1.3.3 World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Region (2021-2032)
  1.3.4 North America Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032)
  1.3.5 Europe Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032)
  1.3.6 China Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032)
  1.3.7 Japan Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032)
1.4 Market Drivers, Restraints and Trends
  1.4.1 Physical Vapor Deposition Equipment for SiC and GaN Market Drivers
  1.4.2 Factors Affecting Demand
  1.4.3 Physical Vapor Deposition Equipment for SiC and GaN Major Market Trends

2 DEMAND SUMMARY

2.1 World Physical Vapor Deposition Equipment for SiC and GaN Demand (2021-2032)
2.2 World Physical Vapor Deposition Equipment for SiC and GaN Consumption by Region
  2.2.1 World Physical Vapor Deposition Equipment for SiC and GaN Consumption by Region (2021-2026)
  2.2.2 World Physical Vapor Deposition Equipment for SiC and GaN Consumption Forecast by Region (2027-2032)
2.3 United States Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032)
2.4 China Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032)
2.5 Europe Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032)
2.6 Japan Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032)
2.7 South Korea Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032)
2.8 ASEAN Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032)
2.9 India Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032)

3 WORLD MANUFACTURERS COMPETITIVE ANALYSIS

3.1 World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Manufacturer (2021-2026)
3.2 World Physical Vapor Deposition Equipment for SiC and GaN Production by Manufacturer (2021-2026)
3.3 World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Manufacturer (2021-2026)
3.4 Physical Vapor Deposition Equipment for SiC and GaN Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
  3.5.1 Global Physical Vapor Deposition Equipment for SiC and GaN Industry Rank of Major Manufacturers
  3.5.2 Global Concentration Ratios (CR4) for Physical Vapor Deposition Equipment for SiC and GaN in 2025
  3.5.3 Global Concentration Ratios (CR8) for Physical Vapor Deposition Equipment for SiC and GaN in 2025
3.6 Physical Vapor Deposition Equipment for SiC and GaN Market: Overall Company Footprint Analysis
  3.6.1 Physical Vapor Deposition Equipment for SiC and GaN Market: Region Footprint
  3.6.2 Physical Vapor Deposition Equipment for SiC and GaN Market: Company Product Type Footprint
  3.6.3 Physical Vapor Deposition Equipment for SiC and GaN Market: Company Product Application Footprint
3.7 Competitive Environment
  3.7.1 Historical Structure of the Industry
  3.7.2 Barriers of Market Entry
  3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations

4 UNITED STATES VS CHINA VS REST OF THE WORLD

4.1 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Production Value Comparison
  4.1.1 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Production Value Comparison (2021 & 2025 & 2032)
  4.1.2 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share Comparison (2021 & 2025 & 2032)
4.2 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Production Comparison
  4.2.1 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Production Comparison (2021 & 2025 & 2032)
  4.2.2 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Production Market Share Comparison (2021 & 2025 & 2032)
4.3 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Consumption Comparison
  4.3.1 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Consumption Comparison (2021 & 2025 & 2032)
  4.3.2 United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Consumption Market Share Comparison (2021 & 2025 & 2032)
4.4 United States Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers and Market Share, 2021-2026
  4.4.1 United States Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers, Headquarters and Production Site (States, Country)
  4.4.2 United States Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value (2021-2026)
  4.4.3 United States Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2026)
4.5 China Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers and Market Share
  4.5.1 China Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers, Headquarters and Production Site (Province, Country)
  4.5.2 China Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value (2021-2026)
  4.5.3 China Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2026)
4.6 Rest of World Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers and Market Share, 2021-2026
  4.6.1 Rest of World Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers, Headquarters and Production Site (State, Country)
  4.6.2 Rest of World Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value (2021-2026)
  4.6.3 Rest of World Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2026)

5 MARKET ANALYSIS BY TYPE

5.1 World Physical Vapor Deposition Equipment for SiC and GaN Market Size Overview by Type: 2021 VS 2025 VS 2032
5.2 Segment Introduction by Type
  5.2.1 Magnetron Sputtering Systems
  5.2.2 Evaporation PVD Systems
  5.2.3 Ion-Beam and HiPIMS Systems
  5.2.4 Hybrid PVD Systems
  5.2.5 Others
5.3 Market Segment by Type
  5.3.1 World Physical Vapor Deposition Equipment for SiC and GaN Production by Type (2021-2032)
  5.3.2 World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Type (2021-2032)
  5.3.3 World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Type (2021-2032)

6 MARKET ANALYSIS BY WAFER SIZE

6.1 World Physical Vapor Deposition Equipment for SiC and GaN Market Size Overview by Wafer Size: 2021 VS 2025 VS 2032
6.2 Segment Introduction by Wafer Size
  6.2.1 Wafer Size 150 mm and Below
  6.2.2 200 mm Wafer Systems
  6.2.3 300 mm Wafer Systems
  6.2.4 Multi-Size Flexible Systems
  6.2.5 Others
6.3 Market Segment by Wafer Size
  6.3.1 World Physical Vapor Deposition Equipment for SiC and GaN Production by Wafer Size (2021-2032)
  6.3.2 World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Wafer Size (2021-2032)
  6.3.3 World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Wafer Size (2021-2032)

7 MARKET ANALYSIS BY STRUCTURE

7.1 World Physical Vapor Deposition Equipment for SiC and GaN Market Size Overview by Structure: 2021 VS 2025 VS 2032
7.2 Segment Introduction by Structure
  7.2.1 Cluster PVD Systems
  7.2.2 Standalone PVD Systems
  7.2.3 In-Line PVD Systems
7.3 Market Segment by Structure
  7.3.1 World Physical Vapor Deposition Equipment for SiC and GaN Production by Structure (2021-2032)
  7.3.2 World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Structure (2021-2032)
  7.3.3 World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Structure (2021-2032)

8 MARKET ANALYSIS BY APPLICATION

8.1 World Physical Vapor Deposition Equipment for SiC and GaN Market Size Overview by Application: 2021 VS 2025 VS 2032
8.2 Segment Introduction by Application
  8.2.1 SiC Devices
  8.2.2 GaN Devices
8.3 Market Segment by Application
  8.3.1 World Physical Vapor Deposition Equipment for SiC and GaN Production by Application (2021-2032)
  8.3.2 World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Application (2021-2032)
  8.3.3 World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Application (2021-2032)

9 COMPANY PROFILES

9.1 Applied Materials, Inc.
  9.1.1 Applied Materials, Inc. Details
  9.1.2 Applied Materials, Inc. Major Business
  9.1.3 Applied Materials, Inc. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.1.4 Applied Materials, Inc. Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.1.5 Applied Materials, Inc. Recent Developments/Updates
  9.1.6 Applied Materials, Inc. Competitive Strengths & Weaknesses
9.2 Evatec AG
  9.2.1 Evatec AG Details
  9.2.2 Evatec AG Major Business
  9.2.3 Evatec AG Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.2.4 Evatec AG Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.2.5 Evatec AG Recent Developments/Updates
  9.2.6 Evatec AG Competitive Strengths & Weaknesses
9.3 KLA Corporation (SPTS Technologies)
  9.3.1 KLA Corporation (SPTS Technologies) Details
  9.3.2 KLA Corporation (SPTS Technologies) Major Business
  9.3.3 KLA Corporation (SPTS Technologies) Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.3.4 KLA Corporation (SPTS Technologies) Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.3.5 KLA Corporation (SPTS Technologies) Recent Developments/Updates
  9.3.6 KLA Corporation (SPTS Technologies) Competitive Strengths & Weaknesses
9.4 NAURA Technology Group Co., Ltd.
  9.4.1 NAURA Technology Group Co., Ltd. Details
  9.4.2 NAURA Technology Group Co., Ltd. Major Business
  9.4.3 NAURA Technology Group Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.4.4 NAURA Technology Group Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.4.5 NAURA Technology Group Co., Ltd. Recent Developments/Updates
  9.4.6 NAURA Technology Group Co., Ltd. Competitive Strengths & Weaknesses
9.5 Guangdong Huicheng Vacuum Technology Co., Ltd.
  9.5.1 Guangdong Huicheng Vacuum Technology Co., Ltd. Details
  9.5.2 Guangdong Huicheng Vacuum Technology Co., Ltd. Major Business
  9.5.3 Guangdong Huicheng Vacuum Technology Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.5.4 Guangdong Huicheng Vacuum Technology Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.5.5 Guangdong Huicheng Vacuum Technology Co., Ltd. Recent Developments/Updates
  9.5.6 Guangdong Huicheng Vacuum Technology Co., Ltd. Competitive Strengths & Weaknesses
9.6 Canon Anelva Corporation
  9.6.1 Canon Anelva Corporation Details
  9.6.2 Canon Anelva Corporation Major Business
  9.6.3 Canon Anelva Corporation Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.6.4 Canon Anelva Corporation Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.6.5 Canon Anelva Corporation Recent Developments/Updates
  9.6.6 Canon Anelva Corporation Competitive Strengths & Weaknesses
9.7 ULVAC, Inc.
  9.7.1 ULVAC, Inc. Details
  9.7.2 ULVAC, Inc. Major Business
  9.7.3 ULVAC, Inc. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.7.4 ULVAC, Inc. Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.7.5 ULVAC, Inc. Recent Developments/Updates
  9.7.6 ULVAC, Inc. Competitive Strengths & Weaknesses
9.8 KDF Technologies
  9.8.1 KDF Technologies Details
  9.8.2 KDF Technologies Major Business
  9.8.3 KDF Technologies Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.8.4 KDF Technologies Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.8.5 KDF Technologies Recent Developments/Updates
  9.8.6 KDF Technologies Competitive Strengths & Weaknesses
9.9 PVD Products, Inc.
  9.9.1 PVD Products, Inc. Details
  9.9.2 PVD Products, Inc. Major Business
  9.9.3 PVD Products, Inc. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.9.4 PVD Products, Inc. Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.9.5 PVD Products, Inc. Recent Developments/Updates
  9.9.6 PVD Products, Inc. Competitive Strengths & Weaknesses
9.10 SJI-SEMI Co., Ltd.
  9.10.1 SJI-SEMI Co., Ltd. Details
  9.10.2 SJI-SEMI Co., Ltd. Major Business
  9.10.3 SJI-SEMI Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.10.4 SJI-SEMI Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.10.5 SJI-SEMI Co., Ltd. Recent Developments/Updates
  9.10.6 SJI-SEMI Co., Ltd. Competitive Strengths & Weaknesses
9.11 Skytech Inc.
  9.11.1 Skytech Inc. Details
  9.11.2 Skytech Inc. Major Business
  9.11.3 Skytech Inc. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.11.4 Skytech Inc. Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.11.5 Skytech Inc. Recent Developments/Updates
  9.11.6 Skytech Inc. Competitive Strengths & Weaknesses
9.12 Plasma-Therm LLC
  9.12.1 Plasma-Therm LLC Details
  9.12.2 Plasma-Therm LLC Major Business
  9.12.3 Plasma-Therm LLC Physical Vapor Deposition Equipment for SiC and GaN Product and Services
  9.12.4 Plasma-Therm LLC Physical Vapor Deposition Equipment for SiC and GaN Production, Price, Value, Gross Margin and Market Share (2021-2026)
  9.12.5 Plasma-Therm LLC Recent Developments/Updates
  9.12.6 Plasma-Therm LLC Competitive Strengths & Weaknesses

10 INDUSTRY CHAIN ANALYSIS

10.1 Physical Vapor Deposition Equipment for SiC and GaN Industry Chain
10.2 Physical Vapor Deposition Equipment for SiC and GaN Upstream Analysis
  10.2.1 Physical Vapor Deposition Equipment for SiC and GaN Core Raw Materials
  10.2.2 Main Manufacturers of Physical Vapor Deposition Equipment for SiC and GaN Core Raw Materials
10.3 Midstream Analysis
10.4 Downstream Analysis
10.5 Physical Vapor Deposition Equipment for SiC and GaN Production Mode
10.6 Physical Vapor Deposition Equipment for SiC and GaN Procurement Model
10.7 Physical Vapor Deposition Equipment for SiC and GaN Industry Sales Model and Sales Channels
  10.7.1 Physical Vapor Deposition Equipment for SiC and GaN Sales Model
  10.7.2 Physical Vapor Deposition Equipment for SiC and GaN Typical Distributors

11 RESEARCH FINDINGS AND CONCLUSION

12 APPENDIX

12.1 Methodology
12.2 Research Process and Data Source
12.3 Disclaimer

List Of Tables

LIST OF TABLES

Table 1. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Region (2021, 2025 and 2032) & (USD Million)
Table 2. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Region (2021-2026) & (USD Million)
Table 3. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Region (2027-2032) & (USD Million)
Table 4. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Region (2021-2026)
Table 5. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Region (2027-2032)
Table 6. World Physical Vapor Deposition Equipment for SiC and GaN Production by Region (2021-2026) & (Units)
Table 7. World Physical Vapor Deposition Equipment for SiC and GaN Production by Region (2027-2032) & (Units)
Table 8. World Physical Vapor Deposition Equipment for SiC and GaN Production Market Share by Region (2021-2026)
Table 9. World Physical Vapor Deposition Equipment for SiC and GaN Production Market Share by Region (2027-2032)
Table 10. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Region (2021-2026) & (K US$/Unit)
Table 11. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Region (2027-2032) & (K US$/Unit)
Table 12. Physical Vapor Deposition Equipment for SiC and GaN Major Market Trends
Table 13. World Physical Vapor Deposition Equipment for SiC and GaN Consumption Growth Rate Forecast by Region (2021 & 2025 & 2032) & (Units)
Table 14. World Physical Vapor Deposition Equipment for SiC and GaN Consumption by Region (2021-2026) & (Units)
Table 15. World Physical Vapor Deposition Equipment for SiC and GaN Consumption Forecast by Region (2027-2032) & (Units)
Table 16. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Manufacturer (2021-2026) & (USD Million)
Table 17. Production Value Market Share of Key Physical Vapor Deposition Equipment for SiC and GaN Producers in 2025
Table 18. World Physical Vapor Deposition Equipment for SiC and GaN Production by Manufacturer (2021-2026) & (Units)
Table 19. Production Market Share of Key Physical Vapor Deposition Equipment for SiC and GaN Producers in 2025
Table 20. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Manufacturer (2021-2026) & (K US$/Unit)
Table 21. Global Physical Vapor Deposition Equipment for SiC and GaN Company Evaluation Quadrant
Table 22. World Physical Vapor Deposition Equipment for SiC and GaN Industry Rank of Major Manufacturers, Based on Production Value in 2025
Table 23. Head Office and Physical Vapor Deposition Equipment for SiC and GaN Production Site of Key Manufacturer
Table 24. Physical Vapor Deposition Equipment for SiC and GaN Market: Company Product Type Footprint
Table 25. Physical Vapor Deposition Equipment for SiC and GaN Market: Company Product Application Footprint
Table 26. Physical Vapor Deposition Equipment for SiC and GaN Competitive Factors
Table 27. Physical Vapor Deposition Equipment for SiC and GaN New Entrant and Capacity Expansion Plans
Table 28. Physical Vapor Deposition Equipment for SiC and GaN Mergers & Acquisitions Activity
Table 29. United States VS China Physical Vapor Deposition Equipment for SiC and GaN Production Value Comparison, (2021 & 2025 & 2032) & (USD Million)
Table 30. United States VS China Physical Vapor Deposition Equipment for SiC and GaN Production Comparison, (2021 & 2025 & 2032) & (Units)
Table 31. United States VS China Physical Vapor Deposition Equipment for SiC and GaN Consumption Comparison, (2021 & 2025 & 2032) & (Units)
Table 32. United States Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value, (2021-2026) & (USD Million)
Table 34. United States Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share (2021-2026)
Table 35. United States Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2026) & (Units)
Table 36. United States Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Market Share (2021-2026)
Table 37. China Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value, (2021-2026) & (USD Million)
Table 39. China Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share (2021-2026)
Table 40. China Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production, (2021-2026) & (Units)
Table 41. China Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Market Share (2021-2026)
Table 42. Rest of World Based Physical Vapor Deposition Equipment for SiC and GaN Manufacturers, Headquarters and Production Site (State, Country)
Table 43. Rest of World Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value, (2021-2026) & (USD Million)
Table 44. Rest of World Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share (2021-2026)
Table 45. Rest of World Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production, (2021-2026) & (Units)
Table 46. Rest of World Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Market Share (2021-2026)
Table 47. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Type, (USD Million), 2021 & 2025 & 2032
Table 48. World Physical Vapor Deposition Equipment for SiC and GaN Production by Type (2021-2026) & (Units)
Table 49. World Physical Vapor Deposition Equipment for SiC and GaN Production by Type (2027-2032) & (Units)
Table 50. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Type (2021-2026) & (USD Million)
Table 51. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Type (2027-2032) & (USD Million)
Table 52. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Type (2021-2026) & (K US$/Unit)
Table 53. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Type (2027-2032) & (K US$/Unit)
Table 54. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Wafer Size, (USD Million), 2021 & 2025 & 2032
Table 55. World Physical Vapor Deposition Equipment for SiC and GaN Production by Wafer Size (2021-2026) & (Units)
Table 56. World Physical Vapor Deposition Equipment for SiC and GaN Production by Wafer Size (2027-2032) & (Units)
Table 57. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Wafer Size (2021-2026) & (USD Million)
Table 58. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Wafer Size (2027-2032) & (USD Million)
Table 59. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Wafer Size (2021-2026) & (K US$/Unit)
Table 60. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Wafer Size (2027-2032) & (K US$/Unit)
Table 61. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Structure, (USD Million), 2021 & 2025 & 2032
Table 62. World Physical Vapor Deposition Equipment for SiC and GaN Production by Structure (2021-2026) & (Units)
Table 63. World Physical Vapor Deposition Equipment for SiC and GaN Production by Structure (2027-2032) & (Units)
Table 64. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Structure (2021-2026) & (USD Million)
Table 65. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Structure (2027-2032) & (USD Million)
Table 66. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Structure (2021-2026) & (K US$/Unit)
Table 67. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Structure (2027-2032) & (K US$/Unit)
Table 68. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Application, (USD Million), 2021 & 2025 & 2032
Table 69. World Physical Vapor Deposition Equipment for SiC and GaN Production by Application (2021-2026) & (Units)
Table 70. World Physical Vapor Deposition Equipment for SiC and GaN Production by Application (2027-2032) & (Units)
Table 71. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Application (2021-2026) & (USD Million)
Table 72. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Application (2027-2032) & (USD Million)
Table 73. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Application (2021-2026) & (K US$/Unit)
Table 74. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Application (2027-2032) & (K US$/Unit)
Table 75. Applied Materials, Inc. Basic Information, Manufacturing Base and Competitors
Table 76. Applied Materials, Inc. Major Business
Table 77. Applied Materials, Inc. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 78. Applied Materials, Inc. Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 79. Applied Materials, Inc. Recent Developments/Updates
Table 80. Applied Materials, Inc. Competitive Strengths & Weaknesses
Table 81. Evatec AG Basic Information, Manufacturing Base and Competitors
Table 82. Evatec AG Major Business
Table 83. Evatec AG Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 84. Evatec AG Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 85. Evatec AG Recent Developments/Updates
Table 86. Evatec AG Competitive Strengths & Weaknesses
Table 87. KLA Corporation (SPTS Technologies) Basic Information, Manufacturing Base and Competitors
Table 88. KLA Corporation (SPTS Technologies) Major Business
Table 89. KLA Corporation (SPTS Technologies) Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 90. KLA Corporation (SPTS Technologies) Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 91. KLA Corporation (SPTS Technologies) Recent Developments/Updates
Table 92. KLA Corporation (SPTS Technologies) Competitive Strengths & Weaknesses
Table 93. NAURA Technology Group Co., Ltd. Basic Information, Manufacturing Base and Competitors
Table 94. NAURA Technology Group Co., Ltd. Major Business
Table 95. NAURA Technology Group Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 96. NAURA Technology Group Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 97. NAURA Technology Group Co., Ltd. Recent Developments/Updates
Table 98. NAURA Technology Group Co., Ltd. Competitive Strengths & Weaknesses
Table 99. Guangdong Huicheng Vacuum Technology Co., Ltd. Basic Information, Manufacturing Base and Competitors
Table 100. Guangdong Huicheng Vacuum Technology Co., Ltd. Major Business
Table 101. Guangdong Huicheng Vacuum Technology Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 102. Guangdong Huicheng Vacuum Technology Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 103. Guangdong Huicheng Vacuum Technology Co., Ltd. Recent Developments/Updates
Table 104. Guangdong Huicheng Vacuum Technology Co., Ltd. Competitive Strengths & Weaknesses
Table 105. Canon Anelva Corporation Basic Information, Manufacturing Base and Competitors
Table 106. Canon Anelva Corporation Major Business
Table 107. Canon Anelva Corporation Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 108. Canon Anelva Corporation Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 109. Canon Anelva Corporation Recent Developments/Updates
Table 110. Canon Anelva Corporation Competitive Strengths & Weaknesses
Table 111. ULVAC, Inc. Basic Information, Manufacturing Base and Competitors
Table 112. ULVAC, Inc. Major Business
Table 113. ULVAC, Inc. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 114. ULVAC, Inc. Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 115. ULVAC, Inc. Recent Developments/Updates
Table 116. ULVAC, Inc. Competitive Strengths & Weaknesses
Table 117. KDF Technologies Basic Information, Manufacturing Base and Competitors
Table 118. KDF Technologies Major Business
Table 119. KDF Technologies Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 120. KDF Technologies Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 121. KDF Technologies Recent Developments/Updates
Table 122. KDF Technologies Competitive Strengths & Weaknesses
Table 123. PVD Products, Inc. Basic Information, Manufacturing Base and Competitors
Table 124. PVD Products, Inc. Major Business
Table 125. PVD Products, Inc. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 126. PVD Products, Inc. Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 127. PVD Products, Inc. Recent Developments/Updates
Table 128. PVD Products, Inc. Competitive Strengths & Weaknesses
Table 129. SJI-SEMI Co., Ltd. Basic Information, Manufacturing Base and Competitors
Table 130. SJI-SEMI Co., Ltd. Major Business
Table 131. SJI-SEMI Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 132. SJI-SEMI Co., Ltd. Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 133. SJI-SEMI Co., Ltd. Recent Developments/Updates
Table 134. SJI-SEMI Co., Ltd. Competitive Strengths & Weaknesses
Table 135. Skytech Inc. Basic Information, Manufacturing Base and Competitors
Table 136. Skytech Inc. Major Business
Table 137. Skytech Inc. Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 138. Skytech Inc. Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 139. Skytech Inc. Recent Developments/Updates
Table 140. Skytech Inc. Competitive Strengths & Weaknesses
Table 141. Plasma-Therm LLC Basic Information, Manufacturing Base and Competitors
Table 142. Plasma-Therm LLC Major Business
Table 143. Plasma-Therm LLC Physical Vapor Deposition Equipment for SiC and GaN Product and Services
Table 144. Plasma-Therm LLC Physical Vapor Deposition Equipment for SiC and GaN Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2021-2026)
Table 145. Plasma-Therm LLC Recent Developments/Updates
Table 146. Plasma-Therm LLC Competitive Strengths & Weaknesses
Table 147. Global Key Players of Physical Vapor Deposition Equipment for SiC and GaN Upstream (Raw Materials)
Table 148. Global Physical Vapor Deposition Equipment for SiC and GaN Typical Customers
Table 149. Physical Vapor Deposition Equipment for SiC and GaN Typical Distributors

List Of Figures

LIST OF FIGURES

Figure 1. Physical Vapor Deposition Equipment for SiC and GaN Picture
Figure 2. World Physical Vapor Deposition Equipment for SiC and GaN Production Value: 2021 & 2025 & 2032, (USD Million)
Figure 3. World Physical Vapor Deposition Equipment for SiC and GaN Production Value and Forecast (2021-2032) & (USD Million)
Figure 4. World Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032) & (Units)
Figure 5. World Physical Vapor Deposition Equipment for SiC and GaN Average Price (2021-2032) & (K US$/Unit)
Figure 6. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Region (2021-2032)
Figure 7. World Physical Vapor Deposition Equipment for SiC and GaN Production Market Share by Region (2021-2032)
Figure 8. North America Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032) & (Units)
Figure 9. Europe Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032) & (Units)
Figure 10. China Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032) & (Units)
Figure 11. Japan Physical Vapor Deposition Equipment for SiC and GaN Production (2021-2032) & (Units)
Figure 12. Physical Vapor Deposition Equipment for SiC and GaN Market Drivers
Figure 13. Factors Affecting Demand
Figure 14. World Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032) & (Units)
Figure 15. World Physical Vapor Deposition Equipment for SiC and GaN Consumption Market Share by Region (2021-2032)
Figure 16. United States Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032) & (Units)
Figure 17. China Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032) & (Units)
Figure 18. Europe Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032) & (Units)
Figure 19. Japan Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032) & (Units)
Figure 20. South Korea Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032) & (Units)
Figure 21. ASEAN Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032) & (Units)
Figure 22. India Physical Vapor Deposition Equipment for SiC and GaN Consumption (2021-2032) & (Units)
Figure 23. Producer Shipments of Physical Vapor Deposition Equipment for SiC and GaN by Manufacturer Revenue ($MM) and Market Share (%): 2025
Figure 24. Global Four-firm Concentration Ratios (CR4) for Physical Vapor Deposition Equipment for SiC and GaN Markets in 2025
Figure 25. Global Four-firm Concentration Ratios (CR8) for Physical Vapor Deposition Equipment for SiC and GaN Markets in 2025
Figure 26. United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share Comparison (2021 & 2025 & 2032)
Figure 27. United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Production Market Share Comparison (2021 & 2025 & 2032)
Figure 28. United States VS China: Physical Vapor Deposition Equipment for SiC and GaN Consumption Market Share Comparison (2021 & 2025 & 2032)
Figure 29. United States Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Market Share 2025
Figure 30. China Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Market Share 2025
Figure 31. Rest of World Based Manufacturers Physical Vapor Deposition Equipment for SiC and GaN Production Market Share 2025
Figure 32. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Type, (USD Million), 2021 & 2025 & 2032
Figure 33. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Type in 2025
Figure 34. Magnetron Sputtering Systems
Figure 35. Evaporation PVD Systems
Figure 36. Ion-Beam and HiPIMS Systems
Figure 37. Hybrid PVD Systems
Figure 38. Others
Figure 39. World Physical Vapor Deposition Equipment for SiC and GaN Production Market Share by Type (2021-2032)
Figure 40. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Type (2021-2032)
Figure 41. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Type (2021-2032) & (K US$/Unit)
Figure 42. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Wafer Size, (USD Million), 2021 & 2025 & 2032
Figure 43. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Wafer Size in 2025
Figure 44. Wafer Size 150 mm and Below
Figure 45. 200 mm Wafer Systems
Figure 46. 300 mm Wafer Systems
Figure 47. Multi-Size Flexible Systems
Figure 48. Others
Figure 49. World Physical Vapor Deposition Equipment for SiC and GaN Production Market Share by Wafer Size (2021-2032)
Figure 50. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Wafer Size (2021-2032)
Figure 51. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Wafer Size (2021-2032) & (K US$/Unit)
Figure 52. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Structure, (USD Million), 2021 & 2025 & 2032
Figure 53. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Structure in 2025
Figure 54. Cluster PVD Systems
Figure 55. Standalone PVD Systems
Figure 56. In-Line PVD Systems
Figure 57. World Physical Vapor Deposition Equipment for SiC and GaN Production Market Share by Structure (2021-2032)
Figure 58. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Structure (2021-2032)
Figure 59. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Structure (2021-2032) & (K US$/Unit)
Figure 60. World Physical Vapor Deposition Equipment for SiC and GaN Production Value by Application, (USD Million), 2021 & 2025 & 2032
Figure 61. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Application in 2025
Figure 62. SiC Devices
Figure 63. GaN Devices
Figure 64. World Physical Vapor Deposition Equipment for SiC and GaN Production Market Share by Application (2021-2032)
Figure 65. World Physical Vapor Deposition Equipment for SiC and GaN Production Value Market Share by Application (2021-2032)
Figure 66. World Physical Vapor Deposition Equipment for SiC and GaN Average Price by Application (2021-2032) & (K US$/Unit)
Figure 67. Physical Vapor Deposition Equipment for SiC and GaN Industry Chain
Figure 68. Physical Vapor Deposition Equipment for SiC and GaN Procurement Model
Figure 69. Physical Vapor Deposition Equipment for SiC and GaN Sales Model
Figure 70. Physical Vapor Deposition Equipment for SiC and GaN Sales Channels, Direct Sales, and Distribution
Figure 71. Methodology
Figure 72. Research Process and Data Source