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United States Fan-out Wafer Level Packaging Market Report 2017

October 2017 | 95 pages | ID: UA87E1CEF81PEN
QYResearch

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In this report, the United States Fan-out Wafer Level Packaging market is valued at USD XX million in 2016 and is expected to reach USD XX million by the end of 2022, growing at a CAGR of XX% between 2016 and 2022.

Geographically, this report splits the United States market into seven regions:
  • The West
  • Southwest
  • The Middle Atlantic
  • New England
  • The South
  • The Midwest
  • with sales (volume), revenue (value), market share and growth rate of Fan-out Wafer Level Packaging in these regions, from 2012 to 2022 (forecast).
United States Fan-out Wafer Level Packaging market competition by top manufacturers/players, with Fan-out Wafer Level Packaging sales volume, price, revenue (Million USD) and market share for each manufacturer/player; the top players including
  • STATS ChipPAC
  • TSMC
  • Texas Instruments
  • Rudolph Technologies
  • SEMES
  • SUSS MicroTec
  • STMicroelectronics
  • Ultratech
On the basis of product, this report displays the sales volume, revenue, product price, market share and growth rate of each type, primarily split into
  • Bump Pitch 0.4mm
  • Bump Pitch 0.35mm
  • Others
On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, sales volume, market share and growth rate of Fan-out Wafer Level Packaging for each application, including
  • Analog and Mixed IC
  • Wireless Connectivity
  • Misc, Logic and Memory IC
  • MEMS and Sensors
  • CMOS Image Sensors
United States Fan-out Wafer Level Packaging Market Report 2017

1 FAN-OUT WAFER LEVEL PACKAGING OVERVIEW

1.1 Product Overview and Scope of Fan-out Wafer Level Packaging
1.2 Classification of Fan-out Wafer Level Packaging by Product Category
  1.2.1 United States Fan-out Wafer Level Packaging Market Size (Sales Volume) Comparison by Type (2012-2022)
  1.2.2 United States Fan-out Wafer Level Packaging Market Size (Sales Volume) Market Share by Type (Product Category) in 2016
  1.2.3 Bump Pitch 0.4mm
  1.2.4 Bump Pitch 0.35mm
  1.2.5 Others
1.3 United States Fan-out Wafer Level Packaging Market by Application/End Users
  1.3.1 United States Fan-out Wafer Level Packaging Market Size (Consumption) and Market Share Comparison by Application (2012-2022)
  1.3.2 Analog and Mixed IC
  1.3.3 Wireless Connectivity
  1.3.4 Misc, Logic and Memory IC
  1.3.5 MEMS and Sensors
  1.3.6 CMOS Image Sensors
1.4 United States Fan-out Wafer Level Packaging Market by Region
  1.4.1 United States Fan-out Wafer Level Packaging Market Size (Value) Comparison by Region (2012-2022)
  1.4.2 The West Fan-out Wafer Level Packaging Status and Prospect (2012-2022)
  1.4.3 Southwest Fan-out Wafer Level Packaging Status and Prospect (2012-2022)
  1.4.4 The Middle Atlantic Fan-out Wafer Level Packaging Status and Prospect (2012-2022)
  1.4.5 New England Fan-out Wafer Level Packaging Status and Prospect (2012-2022)
  1.4.6 The South Fan-out Wafer Level Packaging Status and Prospect (2012-2022)
  1.4.7 The Midwest Fan-out Wafer Level Packaging Status and Prospect (2012-2022)
1.5 United States Market Size (Value and Volume) of Fan-out Wafer Level Packaging (2012-2022)
  1.5.1 United States Fan-out Wafer Level Packaging Sales and Growth Rate (2012-2022)
  1.5.2 United States Fan-out Wafer Level Packaging Revenue and Growth Rate (2012-2022)

2 UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET COMPETITION BY PLAYERS/SUPPLIERS

2.1 United States Fan-out Wafer Level Packaging Sales and Market Share of Key Players/Suppliers (2012-2017)
2.2 United States Fan-out Wafer Level Packaging Revenue and Share by Players/Suppliers (2012-2017)
2.3 United States Fan-out Wafer Level Packaging Average Price by Players/Suppliers (2012-2017)
2.4 United States Fan-out Wafer Level Packaging Market Competitive Situation and Trends
  2.4.1 United States Fan-out Wafer Level Packaging Market Concentration Rate
  2.4.2 United States Fan-out Wafer Level Packaging Market Share of Top 3 and Top 5 Players/Suppliers
  2.4.3 Mergers & Acquisitions, Expansion in United States Market
2.5 United States Players/Suppliers Fan-out Wafer Level Packaging Manufacturing Base Distribution, Sales Area, Product Type

3 UNITED STATES FAN-OUT WAFER LEVEL PACKAGING SALES (VOLUME) AND REVENUE (VALUE) BY REGION (2012-2017)

3.1 United States Fan-out Wafer Level Packaging Sales and Market Share by Region (2012-2017)
3.2 United States Fan-out Wafer Level Packaging Revenue and Market Share by Region (2012-2017)
3.3 United States Fan-out Wafer Level Packaging Price by Region (2012-2017)

4 UNITED STATES FAN-OUT WAFER LEVEL PACKAGING SALES (VOLUME) AND REVENUE (VALUE) BY TYPE (PRODUCT CATEGORY) (2012-2017)

4.1 United States Fan-out Wafer Level Packaging Sales and Market Share by Type (Product Category) (2012-2017)
4.2 United States Fan-out Wafer Level Packaging Revenue and Market Share by Type (2012-2017)
4.3 United States Fan-out Wafer Level Packaging Price by Type (2012-2017)
4.4 United States Fan-out Wafer Level Packaging Sales Growth Rate by Type (2012-2017)

5 UNITED STATES FAN-OUT WAFER LEVEL PACKAGING SALES (VOLUME) BY APPLICATION (2012-2017)

5.1 United States Fan-out Wafer Level Packaging Sales and Market Share by Application (2012-2017)
5.2 United States Fan-out Wafer Level Packaging Sales Growth Rate by Application (2012-2017)
5.3 Market Drivers and Opportunities

6 UNITED STATES FAN-OUT WAFER LEVEL PACKAGING PLAYERS/SUPPLIERS PROFILES AND SALES DATA

6.1 STATS ChipPAC
  6.1.1 Company Basic Information, Manufacturing Base and Competitors
  6.1.2 Fan-out Wafer Level Packaging Product Category, Application and Specification
    6.1.2.1 Product A
    6.1.2.2 Product B
  6.1.3 STATS ChipPAC Fan-out Wafer Level Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
  6.1.4 Main Business/Business Overview
6.2 TSMC
  6.2.2 Fan-out Wafer Level Packaging Product Category, Application and Specification
    6.2.2.1 Product A
    6.2.2.2 Product B
  6.2.3 TSMC Fan-out Wafer Level Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
  6.2.4 Main Business/Business Overview
6.3 Texas Instruments
  6.3.2 Fan-out Wafer Level Packaging Product Category, Application and Specification
    6.3.2.1 Product A
    6.3.2.2 Product B
  6.3.3 Texas Instruments Fan-out Wafer Level Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
  6.3.4 Main Business/Business Overview
6.4 Rudolph Technologies
  6.4.2 Fan-out Wafer Level Packaging Product Category, Application and Specification
    6.4.2.1 Product A
    6.4.2.2 Product B
  6.4.3 Rudolph Technologies Fan-out Wafer Level Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
  6.4.4 Main Business/Business Overview
6.5 SEMES
  6.5.2 Fan-out Wafer Level Packaging Product Category, Application and Specification
    6.5.2.1 Product A
    6.5.2.2 Product B
  6.5.3 SEMES Fan-out Wafer Level Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
  6.5.4 Main Business/Business Overview
6.6 SUSS MicroTec
  6.6.2 Fan-out Wafer Level Packaging Product Category, Application and Specification
    6.6.2.1 Product A
    6.6.2.2 Product B
  6.6.3 SUSS MicroTec Fan-out Wafer Level Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
  6.6.4 Main Business/Business Overview
6.7 STMicroelectronics
  6.7.2 Fan-out Wafer Level Packaging Product Category, Application and Specification
    6.7.2.1 Product A
    6.7.2.2 Product B
  6.7.3 STMicroelectronics Fan-out Wafer Level Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
  6.7.4 Main Business/Business Overview
6.8 Ultratech
  6.8.2 Fan-out Wafer Level Packaging Product Category, Application and Specification
    6.8.2.1 Product A
    6.8.2.2 Product B
  6.8.3 Ultratech Fan-out Wafer Level Packaging Sales, Revenue, Price and Gross Margin (2012-2017)
  6.8.4 Main Business/Business Overview

7 FAN-OUT WAFER LEVEL PACKAGING MANUFACTURING COST ANALYSIS

7.1 Fan-out Wafer Level Packaging Key Raw Materials Analysis
  7.1.1 Key Raw Materials
  7.1.2 Price Trend of Key Raw Materials
  7.1.3 Key Suppliers of Raw Materials
  7.1.4 Market Concentration Rate of Raw Materials
7.2 Proportion of Manufacturing Cost Structure
  7.2.1 Raw Materials
  7.2.2 Labor Cost
  7.2.3 Manufacturing Expenses
7.3 Manufacturing Process Analysis of Fan-out Wafer Level Packaging

8 INDUSTRIAL CHAIN, SOURCING STRATEGY AND DOWNSTREAM BUYERS

8.1 Fan-out Wafer Level Packaging Industrial Chain Analysis
8.2 Upstream Raw Materials Sourcing
8.3 Raw Materials Sources of Fan-out Wafer Level Packaging Major Manufacturers in 2016
8.4 Downstream Buyers

9 MARKETING STRATEGY ANALYSIS, DISTRIBUTORS/TRADERS

9.1 Marketing Channel
  9.1.1 Direct Marketing
  9.1.2 Indirect Marketing
  9.1.3 Marketing Channel Development Trend
9.2 Market Positioning
  9.2.1 Pricing Strategy
  9.2.2 Brand Strategy
  9.2.3 Target Client
9.3 Distributors/Traders List

10 MARKET EFFECT FACTORS ANALYSIS

10.1 Technology Progress/Risk
  10.1.1 Substitutes Threat
  10.1.2 Technology Progress in Related Industry
10.2 Consumer Needs/Customer Preference Change
10.3 Economic/Political Environmental Change

11 UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE (VALUE AND VOLUME) FORECAST (2017-2022)

11.1 United States Fan-out Wafer Level Packaging Sales Volume, Revenue Forecast (2017-2022)
11.2 United States Fan-out Wafer Level Packaging Sales Volume Forecast by Type (2017-2022)
11.3 United States Fan-out Wafer Level Packaging Sales Volume Forecast by Application (2017-2022)
11.4 United States Fan-out Wafer Level Packaging Sales Volume Forecast by Region (2017-2022)

12 RESEARCH FINDINGS AND CONCLUSION

13 APPENDIX

13.1 Methodology/Research Approach
  13.1.1 Research Programs/Design
  13.1.2 Market Size Estimation
  13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
  13.2.1 Secondary Sources
  13.2.2 Primary Sources
13.3 Disclaimer


The report requires updating with new data and is sent in 2-3 business days after order is placed.


LIST OF TABLES AND FIGURES

Figure Product Picture of Fan-out Wafer Level Packaging
Figure United States Fan-out Wafer Level Packaging Market Size (K Units) by Type (2012-2022)
Figure United States Fan-out Wafer Level Packaging Sales Volume Market Share by Type (Product Category) in 2016
Figure Bump Pitch 0.4mm Product Picture
Figure Bump Pitch 0.35mm Product Picture
Figure Others Product Picture
Figure United States Fan-out Wafer Level Packaging Market Size (K Units) by Application (2012-2022)
Figure United States Sales Market Share of Fan-out Wafer Level Packaging by Application in 2016
Figure Analog and Mixed IC Examples
Figure Wireless Connectivity Examples
Figure Misc, Logic and Memory IC Examples
Figure MEMS and Sensors Examples
Figure CMOS Image Sensors Examples
Figure United States Fan-out Wafer Level Packaging Market Size (Million USD) by Region (2012-2022)
Figure The West Fan-out Wafer Level Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure Southwest Fan-out Wafer Level Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure The Middle Atlantic Fan-out Wafer Level Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure New England Fan-out Wafer Level Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure The South of US Fan-out Wafer Level Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure The Midwest Fan-out Wafer Level Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure United States Fan-out Wafer Level Packaging Sales (K Units) and Growth Rate (2012-2022)
Figure United States Fan-out Wafer Level Packaging Revenue (Million USD) and Growth Rate (2012-2022)
Figure United States Fan-out Wafer Level Packaging Market Major Players Product Sales Volume (K Units) (2012-2017)
Table United States Fan-out Wafer Level Packaging Sales (K Units) of Key Players/Suppliers (2012-2017)
Table United States Fan-out Wafer Level Packaging Sales Share by Players/Suppliers (2012-2017)
Figure 2016 United States Fan-out Wafer Level Packaging Sales Share by Players/Suppliers
Figure 2017 United States Fan-out Wafer Level Packaging Sales Share by Players/Suppliers
Figure United States Fan-out Wafer Level Packaging Market Major Players Product Revenue (Million USD) (2012-2017)
Table United States Fan-out Wafer Level Packaging Revenue (Million USD) by Players/Suppliers (2012-2017)
Table United States Fan-out Wafer Level Packaging Revenue Share by Players/Suppliers (2012-2017)
Figure 2016 United States Fan-out Wafer Level Packaging Revenue Share by Players/Suppliers
Figure 2017 United States Fan-out Wafer Level Packaging Revenue Share by Players/Suppliers
Table United States Market Fan-out Wafer Level Packaging Average Price (USD/Unit) of Key Players/Suppliers (2012-2017)
Figure United States Market Fan-out Wafer Level Packaging Average Price (USD/Unit) of Key Players/Suppliers in 2016
Figure United States Fan-out Wafer Level Packaging Market Share of Top 3 Players/Suppliers
Figure United States Fan-out Wafer Level Packaging Market Share of Top 5 Players/Suppliers
Table United States Players/Suppliers Fan-out Wafer Level Packaging Manufacturing Base Distribution and Sales Area
Table United States Players/Suppliers Fan-out Wafer Level Packaging Product Category
Table United States Fan-out Wafer Level Packaging Sales (K Units) by Region (2012-2017)
Table United States Fan-out Wafer Level Packaging Sales Share by Region (2012-2017)
Figure United States Fan-out Wafer Level Packaging Sales Share by Region (2012-2017)
Figure United States Fan-out Wafer Level Packaging Sales Market Share by Region in 2016
Table United States Fan-out Wafer Level Packaging Revenue (Million USD) and Market Share by Region (2012-2017)
Table United States Fan-out Wafer Level Packaging Revenue Share by Region (2012-2017)
Figure United States Fan-out Wafer Level Packaging Revenue Market Share by Region (2012-2017)
Figure United States Fan-out Wafer Level Packaging Revenue Market Share by Region in 2016
Table United States Fan-out Wafer Level Packaging Price (USD/Unit) by Region (2012-2017)
Table United States Fan-out Wafer Level Packaging Sales (K Units) by Type (2012-2017)
Table United States Fan-out Wafer Level Packaging Sales Share by Type (2012-2017)
Figure United States Fan-out Wafer Level Packaging Sales Share by Type (2012-2017)
Figure United States Fan-out Wafer Level Packaging Sales Market Share by Type in 2016
Table United States Fan-out Wafer Level Packaging Revenue (Million USD) and Market Share by Type (2012-2017)
Table United States Fan-out Wafer Level Packaging Revenue Share by Type (2012-2017)
Figure Revenue Market Share of Fan-out Wafer Level Packaging by Type (2012-2017)
Figure Revenue Market Share of Fan-out Wafer Level Packaging by Type in 2016
Table United States Fan-out Wafer Level Packaging Price (USD/Unit) by Types (2012-2017)
Figure United States Fan-out Wafer Level Packaging Sales Growth Rate by Type (2012-2017)
Table United States Fan-out Wafer Level Packaging Sales (K Units) by Application (2012-2017)
Table United States Fan-out Wafer Level Packaging Sales Market Share by Application (2012-2017)
Figure United States Fan-out Wafer Level Packaging Sales Market Share by Application (2012-2017)
Figure United States Fan-out Wafer Level Packaging Sales Market Share by Application in 2016
Table United States Fan-out Wafer Level Packaging Sales Growth Rate by Application (2012-2017)
Figure United States Fan-out Wafer Level Packaging Sales Growth Rate by Application (2012-2017)
Table STATS ChipPAC Basic Information List
Table STATS ChipPAC Fan-out Wafer Level Packaging Sales (K Units), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2012-2017)
Figure STATS ChipPAC Fan-out Wafer Level Packaging Sales Growth Rate (2012-2017)
Figure STATS ChipPAC Fan-out Wafer Level Packaging Sales Market Share in United States (2012-2017)
Figure STATS ChipPAC Fan-out Wafer Level Packaging Revenue Market Share in United States (2012-2017)
Table TSMC Basic Information List
Table TSMC Fan-out Wafer Level Packaging Sales (K Units), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2012-2017)
Figure TSMC Fan-out Wafer Level Packaging Sales Growth Rate (2012-2017)
Figure TSMC Fan-out Wafer Level Packaging Sales Market Share in United States (2012-2017)
Figure TSMC Fan-out Wafer Level Packaging Revenue Market Share in United States (2012-2017)
Table Texas Instruments Basic Information List
Table Texas Instruments Fan-out Wafer Level Packaging Sales (K Units), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2012-2017)
Figure Texas Instruments Fan-out Wafer Level Packaging Sales Growth Rate (2012-2017)
Figure Texas Instruments Fan-out Wafer Level Packaging Sales Market Share in United States (2012-2017)
Figure Texas Instruments Fan-out Wafer Level Packaging Revenue Market Share in United States (2012-2017)
Table Rudolph Technologies Basic Information List
Table Rudolph Technologies Fan-out Wafer Level Packaging Sales (K Units), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2012-2017)
Figure Rudolph Technologies Fan-out Wafer Level Packaging Sales Growth Rate (2012-2017)
Figure Rudolph Technologies Fan-out Wafer Level Packaging Sales Market Share in United States (2012-2017)
Figure Rudolph Technologies Fan-out Wafer Level Packaging Revenue Market Share in United States (2012-2017)
Table SEMES Basic Information List
Table SEMES Fan-out Wafer Level Packaging Sales (K Units), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2012-2017)
Figure SEMES Fan-out Wafer Level Packaging Sales Growth Rate (2012-2017)
Figure SEMES Fan-out Wafer Level Packaging Sales Market Share in United States (2012-2017)
Figure SEMES Fan-out Wafer Level Packaging Revenue Market Share in United States (2012-2017)
Table SUSS MicroTec Basic Information List
Table SUSS MicroTec Fan-out Wafer Level Packaging Sales (K Units), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2012-2017)
Figure SUSS MicroTec Fan-out Wafer Level Packaging Sales Growth Rate (2012-2017)
Figure SUSS MicroTec Fan-out Wafer Level Packaging Sales Market Share in United States (2012-2017)
Figure SUSS MicroTec Fan-out Wafer Level Packaging Revenue Market Share in United States (2012-2017)
Table STMicroelectronics Basic Information List
Table STMicroelectronics Fan-out Wafer Level Packaging Sales (K Units), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2012-2017)
Figure STMicroelectronics Fan-out Wafer Level Packaging Sales Growth Rate (2012-2017)
Figure STMicroelectronics Fan-out Wafer Level Packaging Sales Market Share in United States (2012-2017)
Figure STMicroelectronics Fan-out Wafer Level Packaging Revenue Market Share in United States (2012-2017)
Table Ultratech Basic Information List
Table Ultratech Fan-out Wafer Level Packaging Sales (K Units), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2012-2017)
Figure Ultratech Fan-out Wafer Level Packaging Sales Growth Rate (2012-2017)
Figure Ultratech Fan-out Wafer Level Packaging Sales Market Share in United States (2012-2017)
Figure Ultratech Fan-out Wafer Level Packaging Revenue Market Share in United States (2012-2017)
Table Production Base and Market Concentration Rate of Raw Material
Figure Price Trend of Key Raw Materials
Table Key Suppliers of Raw Materials
Figure Manufacturing Cost Structure of Fan-out Wafer Level Packaging
Figure Manufacturing Process Analysis of Fan-out Wafer Level Packaging
Figure Fan-out Wafer Level Packaging Industrial Chain Analysis
Table Raw Materials Sources of Fan-out Wafer Level Packaging Major Players/Suppliers in 2016
Table Major Buyers of Fan-out Wafer Level Packaging
Table Distributors/Traders List
Figure United States Fan-out Wafer Level Packaging Sales Volume (K Units) and Growth Rate Forecast (2017-2022)
Figure United States Fan-out Wafer Level Packaging Revenue (Million USD) and Growth Rate Forecast (2017-2022)
Figure United States Fan-out Wafer Level Packaging Price (USD/Unit) Trend Forecast (2017-2022)
Table United States Fan-out Wafer Level Packaging Sales Volume (K Units) Forecast by Type (2017-2022)
Figure United States Fan-out Wafer Level Packaging Sales Volume (K Units) Forecast by Type (2017-2022)
Figure United States Fan-out Wafer Level Packaging Sales Volume (K Units) Forecast by Type in 2022
Table United States Fan-out Wafer Level Packaging Sales Volume (K Units) Forecast by Application (2017-2022)
Figure United States Fan-out Wafer Level Packaging Sales Volume (K Units) Forecast by Application (2017-2022)
Figure United States Fan-out Wafer Level Packaging Sales Volume (K Units) Forecast by Application in 2022
Table United States Fan-out Wafer Level Packaging Sales Volume (K Units) Forecast by Region (2017-2022)
Table United States Fan-out Wafer Level Packaging Sales Volume Share Forecast by Region (2017-2022)
Figure United States Fan-out Wafer Level Packaging Sales Volume Share Forecast by Region (2017-2022)
Figure United States Fan-out Wafer Level Packaging Sales Volume Share Forecast by Region in 2022
Table Research Programs/Design for This Report
Figure Bottom-up and Top-down Approaches for This Report
Figure Data Triangulation
Table Key Data Information from Secondary Sources
Table Key Data Information from Primary Sources

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