Evolving High Speed Mezzanine Connectors
This Bishop and Associates 12-chapter, 214 page research report provides a complete analysis of evolving high-speed mezzanine connectors. Current connector market values and forecasts are provided by bandwidth, region of the world, and end user market for the years 2007, 2008, 2009, and 2013.
Mezzanine architecture offers significant packaging advantages. System density has become a critical issue for circuit designers and can be increased by utilizing the space between daughtercards. Products can be effectively partitioned to provide pluggable modules simplifying repair, customization and upgrading. Printed circuit board routing issues can be simplified and layer count reduced by spreading functions over larger board surface areas.
Mezzanine architecture offers significant packaging advantages. System density has become a critical issue for circuit designers and can be increased by utilizing the space between daughtercards. Products can be effectively partitioned to provide pluggable modules simplifying repair, customization and upgrading. Printed circuit board routing issues can be simplified and layer count reduced by spreading functions over larger board surface areas.
CHAPTER 1 REPORT SCOPE AND METHODOLOGY
Report objectives
Study methodology
Data collection forms
Connector manufacturer survey
Connector user survey
CHAPTER 2 INTRODUCTION
Preface
Introduction
CHAPTER 3 HIGH SPEED CONNECTOR BASICS
Common backplane architecture
Mezzanine card architecture
High-speed transmission line issues
Defining features of high-speed mezzanine connectors
Mezzanine connector selection criteria
Bandwidth rating of connectors
Performance measurements tools
Test and analysis equipment
Comparison of electrical performance
Design support provided by connector manufacturers
CHAPTER 4 THE NEED FOR SPEED
Market drivers to higher speed interfaces
Speed vs. density
The influence of industry standards
CHAPTER 5 HIGH SPEED INTERCONNECT SYSTEM ELEMENTS
Driver and receiver technology
Printed circuit board materials
Printed circuit board design and fabrication
CHAPTER 6 HIGH-SPEED CONNECTOR AND MARKET TRENDS 2006-2008
Key market trends
High-speed mezzanine family source chart
CHAPTER 7 HIGH-SPEED MEZZANINE CONNECTORS
Mezzanine connector architecture
Advantages of mezzanine packaging
Interface types
Mezzanine connector applications
Platform reference designs
CHAPTER 8 OVERVIEW OF CURRENT HIGH-SPEED MEZZANINE CONNECTORS
Advanced Interconnections Corp. / Emulation Technology Inc.
Amphenol TCS – VHDM Stacker, XCede Stacker, NexLev
ERNI Components – MicroSpeed, MicroSpeed Blindmate,
MicroSpeed Power modules, ERmet Zd Stacker, Right-Angle PCI
Express connector
FCI – MEG-Array, GIG-Array, AirMax VS Stacker, TwinMezz
Fujitsu – FCN-260 BTB Series
HARTING – Micro Card Edge Connector
Hirose – IT-1, IT-2, IT-3
Molex – Plateau HS Mezz, HD Mezz, SEARAY, VHDM Stacker
Samtec – Q-Series, EdgeRate, DP Array, IsoRate, SEARAY,
RAZOR Beam, RU8 Series
Tyco Electronics – Mictor, Step-Z, Multi-Gig RT Stacker
STRADA-Mesa
Yamaichi Electronics USA – CNO99Series
AMC Connectors
CHAPTER 9 MEZZANINE CONNECTOR DESIGN FEATURE CHARTS
Introduction
Amphenol TCS – NexLev
ERNI – MicroSpeed
FCI – Meg-Array
FCI – Gig-Array
Fujitsu – FCN260
HARTING – Micro-Card Edge Mezzanine
Hirose – IT-2 Series
Hirose – IT-3 Series
Molex – Plateau H.S. Mezz
Molex – HD Mezz
Samtec – Q Series
Samtec – EdgeRate
Samtec – SEARAY
Samtec – RU-8.
Samtec – RAZOR Beam (SS4/ST4)
Samtec – RAZOR Beam (LSS)
Tyco Electronics –Mictor
Tyco Electronics – STRADA-Mesa
Yamaichi – CNO99
CHAPTER 10 MARKET ANALYSIS/FORECASTS
Measurement criteria
High Speed Mezzanine Connectors
World market 2007 -2013 by bandwidth segment
World market 2007 -2013 by geographic region
World market 2007 -2013 by end user
CHAPTER 11 HIGH-SPEED CONNECTOR INNOVATION
Introduction
PCB attachment
Techniz G-Flex
Verdant Electronics
TPL Group
Silicon Pipe
CHE-YU LI & Company
Paricon Technologies
CHAPTER 12 MAJOR FINDINGS AND CONCLUSIONS
Appendix A Connector Terms And Definitions
Appendix B List Of Contributors
Report objectives
Study methodology
Data collection forms
Connector manufacturer survey
Connector user survey
CHAPTER 2 INTRODUCTION
Preface
Introduction
CHAPTER 3 HIGH SPEED CONNECTOR BASICS
Common backplane architecture
Mezzanine card architecture
High-speed transmission line issues
Defining features of high-speed mezzanine connectors
Mezzanine connector selection criteria
Bandwidth rating of connectors
Performance measurements tools
Test and analysis equipment
Comparison of electrical performance
Design support provided by connector manufacturers
CHAPTER 4 THE NEED FOR SPEED
Market drivers to higher speed interfaces
Speed vs. density
The influence of industry standards
CHAPTER 5 HIGH SPEED INTERCONNECT SYSTEM ELEMENTS
Driver and receiver technology
Printed circuit board materials
Printed circuit board design and fabrication
CHAPTER 6 HIGH-SPEED CONNECTOR AND MARKET TRENDS 2006-2008
Key market trends
High-speed mezzanine family source chart
CHAPTER 7 HIGH-SPEED MEZZANINE CONNECTORS
Mezzanine connector architecture
Advantages of mezzanine packaging
Interface types
Mezzanine connector applications
Platform reference designs
CHAPTER 8 OVERVIEW OF CURRENT HIGH-SPEED MEZZANINE CONNECTORS
Advanced Interconnections Corp. / Emulation Technology Inc.
Amphenol TCS – VHDM Stacker, XCede Stacker, NexLev
ERNI Components – MicroSpeed, MicroSpeed Blindmate,
MicroSpeed Power modules, ERmet Zd Stacker, Right-Angle PCI
Express connector
FCI – MEG-Array, GIG-Array, AirMax VS Stacker, TwinMezz
Fujitsu – FCN-260 BTB Series
HARTING – Micro Card Edge Connector
Hirose – IT-1, IT-2, IT-3
Molex – Plateau HS Mezz, HD Mezz, SEARAY, VHDM Stacker
Samtec – Q-Series, EdgeRate, DP Array, IsoRate, SEARAY,
RAZOR Beam, RU8 Series
Tyco Electronics – Mictor, Step-Z, Multi-Gig RT Stacker
STRADA-Mesa
Yamaichi Electronics USA – CNO99Series
AMC Connectors
CHAPTER 9 MEZZANINE CONNECTOR DESIGN FEATURE CHARTS
Introduction
Amphenol TCS – NexLev
ERNI – MicroSpeed
FCI – Meg-Array
FCI – Gig-Array
Fujitsu – FCN260
HARTING – Micro-Card Edge Mezzanine
Hirose – IT-2 Series
Hirose – IT-3 Series
Molex – Plateau H.S. Mezz
Molex – HD Mezz
Samtec – Q Series
Samtec – EdgeRate
Samtec – SEARAY
Samtec – RU-8.
Samtec – RAZOR Beam (SS4/ST4)
Samtec – RAZOR Beam (LSS)
Tyco Electronics –Mictor
Tyco Electronics – STRADA-Mesa
Yamaichi – CNO99
CHAPTER 10 MARKET ANALYSIS/FORECASTS
Measurement criteria
High Speed Mezzanine Connectors
World market 2007 -2013 by bandwidth segment
World market 2007 -2013 by geographic region
World market 2007 -2013 by end user
CHAPTER 11 HIGH-SPEED CONNECTOR INNOVATION
Introduction
PCB attachment
Techniz G-Flex
Verdant Electronics
TPL Group
Silicon Pipe
CHE-YU LI & Company
Paricon Technologies
CHAPTER 12 MAJOR FINDINGS AND CONCLUSIONS
Appendix A Connector Terms And Definitions
Appendix B List Of Contributors
