Global Direct-to-chip Liquid Cooling Market Size study, by Cooling Solution Type, Component Cooling, Liquid Coolant Type, Application, End Use, and Regional Forecasts 2022-2032

May 2025 | 285 pages | ID: G3BBF684D6C8EN
Bizwit Research & Consulting LLP

US$ 3,218.00 US$ 4,950.00 -35 %
Offer valid until August 31, 2025!

E-mail Delivery (PDF), Hard Copy Mail Delivery

Download PDF Leaflet

Accepted cards
Wire Transfer
Checkout Later
Need Help? Ask a Question
Global Direct-to-chip Liquid Cooling Market is valued at approximately USD 1.5 billion in 2023 and is anticipated to grow with an impressive compound annual growth rate of more than 20.5% over the forecast period 2024-2032. As data centers evolve to meet the escalating demands of high-performance computing, artificial intelligence, and cloud infrastructure, thermal management has emerged as a defining priority. Direct-to-chip liquid cooling, a disruptive approach that transfers heat directly from critical components to a circulating liquid medium, is gaining rapid traction due to its unmatched efficiency and energy-saving potential. By channeling coolants directly to heat-generating CPUs, GPUs, and memory modules, this method drastically reduces the need for air-cooling infrastructure and enhances system density—ushering in a new era of thermal innovation for next-generation computing environments.

A growing sense of urgency among hyperscale data centers, colocation providers, and enterprise IT environments to minimize power usage effectiveness (PUE) and carbon emissions is catalyzing adoption. Traditional air-based cooling systems are no longer sufficient to handle the heat generated by AI-intensive workloads and densely packed servers. Direct-to-chip solutions fill this gap by facilitating precise, localized cooling, while simultaneously enabling greater compute per rack. As global environmental regulations tighten and ESG pressures rise, enterprises are shifting their strategies toward sustainable infrastructure—thereby elevating liquid cooling technologies from experimental to essential.

The market is being further propelled by technological advancements in dielectric fluids and thermal interface materials, which are broadening the application scope of direct-to-chip cooling. In particular, integration of smart sensors and closed-loop control systems allows real-time temperature optimization and predictive maintenance, reducing operational risk and prolonging hardware lifecycle. However, the transition from air to liquid requires overcoming legacy infrastructure barriers and necessitates upfront capital investment, system redesign, and technician retraining—factors that may impede early adoption in cost-sensitive segments. Nevertheless, growing R&D funding and strategic alliances among key players continue to bridge these gaps.

Strategic investments by semiconductor leaders, system integrators, and OEMs have significantly intensified competition, spurring rapid innovations in both single-phase and two-phase liquid cooling systems. As organizations race to optimize performance per watt and footprint utilization, modular and retrofit-friendly cooling systems are being aggressively deployed across new builds and legacy data centers alike. Additionally, the rise of edge computing and micro data centers in remote and space-constrained environments is creating untapped opportunities for compact and high-efficiency cooling technologies that ensure thermal stability without expanding energy budgets.

From a regional standpoint, North America currently leads the global direct-to-chip liquid cooling market, driven by early adoption among hyperscale data centers, favorable energy regulations, and advanced IT infrastructure. Europe follows closely, with strong policy support for green data center initiatives and increasing investments in digital transformation. Meanwhile, the Asia Pacific region is expected to exhibit the fastest growth throughout the forecast period. Rapid digitization in countries such as China, India, and Japan—coupled with the proliferation of cloud service providers and AI startups—has generated a surging demand for thermally efficient and scalable cooling systems tailored for high-density workloads.

Major market player included in this report are:
  • Vertiv Group Corp.
  • Schneider Electric SE
  • Asetek A/S
  • CoolIT Systems Inc.
  • Fujitsu Limited
  • Midas Green Technologies
  • Submer Technologies
  • Rittal GmbH & Co. KG
  • Chilldyne Inc.
  • Lenovo Group Limited
  • IBM Corporation
  • Advanced Cooling Technologies Inc.
  • Hewlett Packard Enterprise
  • Alibaba Group (via Alibaba Cloud)
  • LiquidStack
The detailed segments and sub-segment of the market are explained below:

By Cooling Solution Type
  • Single-Phase Cooling
  • Two-Phase Cooling
By Component Cooling
  • Processor Cooling (CPU, GPU)
  • Memory & Storage Cooling
  • Power Supply Unit (PSU)
  • Others
By Liquid Coolant Type
  • Water-Based Coolants
  • Dielectric Fluids
  • Others
By Application
  • High-Performance Computing (HPC)
  • Artificial Intelligence & Machine Learning
  • Edge Computing
  • Cloud Computing
  • Others
By End Use
  • Data Centers
  • Enterprises
  • Government & Defense
  • Research & Academia
  • Others
By Region:

North America
  • U.S.
  • Canada
Europe
  • UK
  • Germany
  • France
  • Spain
  • Italy
  • Rest of Europe
Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • Rest of Asia Pacific
Latin America
  • Brazil
  • Mexico
Middle East & Africa
  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa
Years considered for the study are as follows:
  • Historical year – 2022
  • Base year – 2023
  • Forecast period – 2024 to 2032
Key Takeaways:
  • Market Estimates & Forecast for 10 years from 2022 to 2032.
  • Annualized revenues and regional level analysis for each market segment.
  • Detailed analysis of geographical landscape with Country level analysis of major regions.
  • Competitive landscape with information on major players in the market.
  • Analysis of key business strategies and recommendations on future market approach.
  • Analysis of competitive structure of the market.
  • Demand side and supply side analysis of the market.
Companies Mentioned
  • Vertiv Group Corp.
  • Schneider Electric SE
  • Asetek A/S
  • CoolIT Systems Inc.
  • Fujitsu Limited
  • Midas Green Technologies
  • Submer Technologies
  • Rittal GmbH & Co. KG
  • Chilldyne Inc.
  • Lenovo Group Limited
  • IBM Corporation
  • Advanced Cooling Technologies Inc.
  • Hewlett Packard Enterprise
  • Alibaba Group (via Alibaba Cloud)
  • LiquidStack
CHAPTER 1. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET EXECUTIVE SUMMARY

1.1. Global Direct-to-chip Liquid Cooling Market Size & Forecast (2022-2032)
1.2. Regional Summary
1.3. Segmental Summary
  1.3.1. By Cooling Solution Type
  1.3.2. By Component Cooling
  1.3.3. By Liquid Coolant Type
  1.3.4. By Application
  1.3.5. By End Use
1.4. Key Trends
1.5. Recession Impact
1.6. Analyst Recommendation & Conclusion

CHAPTER 2. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET DEFINITION AND RESEARCH ASSUMPTIONS

2.1. Research Objective
2.2. Market Definition
2.3. Research Assumptions
  2.3.1. Inclusion & Exclusion
  2.3.2. Limitations
  2.3.3. Supply Side Analysis
    2.3.3.1. Availability
    2.3.3.2. Infrastructure
    2.3.3.3. Regulatory Environment
    2.3.3.4. Market Competition
    2.3.3.5. Economic Viability (Provider’s Perspective)
  2.3.4. Demand Side Analysis
    2.3.4.1. Energy Efficiency Mandates
    2.3.4.2. Technological Advancements in Coolants
    2.3.4.3. Sustainability & ESG Considerations
    2.3.4.4. Customer Awareness & Adoption
2.4. Estimation Methodology
2.5. Years Considered for the Study
2.6. Currency Conversion Rates

CHAPTER 3. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET DYNAMICS

3.1. Market Drivers
  3.1.1. Escalating Heat Dissipation Requirements in Hyperscale Data Centers
  3.1.2. Stringent Energy Efficiency and Carbon Reduction Targets
  3.1.3. Proliferation of AI/ML Workloads Demanding High Compute Density
3.2. Market Challenges
  3.2.1. High Initial CapEx and Retrofit Complexity
  3.2.2. Integration Barriers with Legacy Air-cooled Infrastructure
  3.2.3. Limited Skilled Workforce for Liquid Cooling Deployment
3.3. Market Opportunities
  3.3.1. Emerging Edge Data Centers and Micro-server Deployments
  3.3.2. Advances in Dielectric Fluids and Two-phase Cooling Technologies
  3.3.3. Strategic Partnerships between OEMs and Coolant Suppliers

CHAPTER 4. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET INDUSTRY ANALYSIS

4.1. Porter’s 5 Force Model
  4.1.1. Bargaining Power of Suppliers
  4.1.2. Bargaining Power of Buyers
  4.1.3. Threat of New Entrants
  4.1.4. Threat of Substitutes
  4.1.5. Competitive Rivalry
  4.1.6. Futuristic Approach to Porter’s Model
  4.1.7. Porter’s 5 Force Impact Analysis
4.2. PESTEL Analysis
  4.2.1. Political
  4.2.2. Economic
  4.2.3. Social
  4.2.4. Technological
  4.2.5. Environmental
  4.2.6. Legal
4.3. Top Investment Opportunities
4.4. Top Winning Strategies
4.5. Disruptive Trends
4.6. Industry Expert Perspective
4.7. Analyst Recommendation & Conclusion

CHAPTER 5. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET SIZE & FORECASTS BY COOLING SOLUTION TYPE (2022-2032)

5.1. Segment Dashboard
5.2. Global Market: Cooling Solution Type Revenue Trend Analysis, 2022 & 2032 (USD Billion)
  5.2.1. Single-Phase Cooling
  5.2.2. Two-Phase Cooling

CHAPTER 6. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET SIZE & FORECASTS BY COMPONENT COOLING (2022-2032)

6.1. Segment Dashboard
6.2. Global Market: Component Cooling Revenue Trend Analysis, 2022 & 2032 (USD Billion)
  6.2.1. Processor Cooling (CPU, GPU)
  6.2.2. Memory & Storage Cooling
  6.2.3. Power Supply Unit (PSU) Cooling
  6.2.4. Others

CHAPTER 7. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET SIZE & FORECASTS BY LIQUID COOLANT TYPE (2022-2032)

7.1. Segment Dashboard
7.2. Global Market: Liquid Coolant Type Revenue Trend Analysis, 2022 & 2032 (USD Billion)
  7.2.1. Water-Based Coolants
  7.2.2. Dielectric Fluids
  7.2.3. Others

CHAPTER 8. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET SIZE & FORECASTS BY APPLICATION (2022-2032)

8.1. Segment Dashboard
8.2. Global Market: Application Revenue Trend Analysis, 2022 & 2032 (USD Billion)
  8.2.1. High-Performance Computing (HPC)
  8.2.2. Artificial Intelligence & Machine Learning
  8.2.3. Edge Computing
  8.2.4. Cloud Computing
  8.2.5. Others

CHAPTER 9. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET SIZE & FORECASTS BY END USE (2022-2032)

9.1. Segment Dashboard
9.2. Global Market: End Use Revenue Trend Analysis, 2022 & 2032 (USD Billion)
  9.2.1. Data Centers
  9.2.2. Enterprises
  9.2.3. Government & Defense
  9.2.4. Research & Academia
  9.2.5. Others

CHAPTER 10. GLOBAL DIRECT-TO-CHIP LIQUID COOLING MARKET SIZE & FORECASTS BY REGION (2022-2032)

10.1. North America Market
  10.1.1. U.S. Market
    10.1.1.1. Cooling Solution Type breakdown, 2022-2032
    10.1.1.2. Component Cooling breakdown, 2022-2032
  10.1.2. Canada Market
10.2. Europe Market
  10.2.1. UK Market
  10.2.2. Germany Market
  10.2.3. France Market
  10.2.4. Spain Market
  10.2.5. Italy Market
  10.2.6. Rest of Europe Market
10.3. Asia Pacific Market
  10.3.1. China Market
  10.3.2. India Market
  10.3.3. Japan Market
  10.3.4. Australia Market
  10.3.5. South Korea Market
  10.3.6. Rest of Asia Pacific Market
10.4. Latin America Market
  10.4.1. Brazil Market
  10.4.2. Mexico Market
  10.4.3. Rest of Latin America Market
10.5. Middle East & Africa Market
  10.5.1. Saudi Arabia Market
  10.5.2. South Africa Market
  10.5.3. Rest of Middle East & Africa Market

CHAPTER 11. COMPETITIVE INTELLIGENCE

11.1. Key Company SWOT Analysis
  11.1.1. Vertiv Group Corp.
  11.1.2. Schneider Electric SE
  11.1.3. Asetek A/S
11.2. Top Market Strategies
11.3. Company Profiles
  11.3.1. Vertiv Group Corp.
    11.3.1.1. Key Information
    11.3.1.2. Overview
    11.3.1.3. Financial (Subject to Data Availability)
    11.3.1.4. Product Summary
    11.3.1.5. Market Strategies
  11.3.2. Schneider Electric SE
  11.3.3. Asetek A/S
  11.3.4. CoolIT Systems Inc.
  11.3.5. Fujitsu Limited
  11.3.6. Midas Green Technologies
  11.3.7. Submer Technologies
  11.3.8. Rittal GmbH & Co. KG

CHAPTER 12. RESEARCH PROCESS

12.1. Research Process
  12.1.1. Data Mining
  12.1.2. Analysis
  12.1.3. Market Estimation
  12.1.4. Validation
  12.1.5. Publishing
12.2. Research Attributes

LIST OF TABLES

TABLE 1. Global Direct-to-chip Liquid Cooling market, report scope
TABLE 2. Global market estimates & forecasts by Region 2022-2032 (USD Billion)
TABLE 3. Global market estimates & forecasts by Cooling Solution Type 2022-2032 (USD Billion)
TABLE 4. Global market estimates & forecasts by Component Cooling 2022-2032 (USD Billion)
TABLE 5. Global market estimates & forecasts by Liquid Coolant Type 2022-2032 (USD Billion)
TABLE 6. Global market estimates & forecasts by Application 2022-2032 (USD Billion)
TABLE 7. Global market estimates & forecasts by End Use 2022-2032 (USD Billion)
TABLE 8. Global market by segment, estimates & forecasts, 2022-2032 (USD Billion)
TABLE 9. North America market estimates & forecasts, 2022-2032 (USD Billion)
TABLE 10. U.S. market estimates & forecasts by segment, 2022-2032 (USD Billion)
TABLE 11. Canada market estimates & forecasts by segment, 2022-2032 (USD Billion)
TABLE 12. Europe market estimates & forecasts by country, 2022-2032 (USD Billion)
TABLE 13. Asia Pacific market estimates & forecasts by country, 2022-2032 (USD Billion)
TABLE 14. Latin America market estimates & forecasts by country, 2022-2032 (USD Billion)
TABLE 15. Middle East & Africa market estimates & forecasts by country, 2022-2032 (USD Billion)
TABLE 16. Global market by company, market share analysis, 2023 (%)
TABLE 17. Global market historical data comparison, 2022 vs 2023 (USD Billion)
TABLE 18. Global market PUE improvement metrics by region
TABLE 19. Global market energy consumption benchmarks
TABLE 20. Global market investment & funding analysis, 2022-2023

LIST OF FIGURES

FIG 1. Global market, research methodology
FIG 2. Global market, market estimation techniques
FIG 3. Global market size estimates & forecast methods
FIG 4. Global market, key trends 2023
FIG 5. Global market, growth prospects 2022-2032
FIG 6. Global market, Porter’s 5 Force Model
FIG 7. Global market, PESTEL analysis
FIG 8. Global market, value chain analysis
FIG 9. Global market by Cooling Solution Type, 2022 & 2032 (USD Billion)
FIG 10. Global market by Component Cooling, 2022 & 2032 (USD Billion)
FIG 11. Global market by Liquid Coolant Type, 2022 & 2032 (USD Billion)
FIG 12. Global market by Application, 2022 & 2032 (USD Billion)
FIG 13. Global market by End Use, 2022 & 2032 (USD Billion)
FIG 14. Global market, regional snapshot 2022 & 2032
FIG 15. North America market 2022 & 2032 (USD Billion)
FIG 16. Europe market 2022 & 2032 (USD Billion)
FIG 17. Asia Pacific market 2022 & 2032 (USD Billion)
FIG 18. Latin America market 2022 & 2032 (USD Billion)
FIG 19. Middle East & Africa market 2022 & 2032 (USD Billion)
FIG 20. Global market, company market share analysis (2023)


More Publications