Wafer Fabrication Equipment Market - Forecasts from 2018 to 2023
Global wafer fabrication equipment market is projected to witness a CAGR of 3.07% during the forecast period to reach a total market size of US$61.886 billion by 2023, increasing from US$51.618 billion in 2017. Semiconductor wafer fabrication is defined as process for production of integrated circuits on the semiconductor and helps in building required electrical structures. The circuits created using wafer fabrication are used in electrical and electronic devices. Rising demand of consumer electronic devices, automotive, medical devices will boost the growth of global Wafer fabrication equipment market. Vigorous growth in the market may also be attributed to the rising adaption of the innovative technologies.
This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.
Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study has been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the global wafer fabrication equipment value chain. Last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting. Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the market.
Major industry players profiled as part of the report are Lam Research Corporation, SCREEN Semiconductor Solutions Co., Ltd., Tokyo Electron Limited, Applied Materials, Inc., Hitachi High-Technologies Corporation and KLA-Tencor Corporation.
Segmentation
This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.
Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study has been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the global wafer fabrication equipment value chain. Last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting. Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the market.
Major industry players profiled as part of the report are Lam Research Corporation, SCREEN Semiconductor Solutions Co., Ltd., Tokyo Electron Limited, Applied Materials, Inc., Hitachi High-Technologies Corporation and KLA-Tencor Corporation.
Segmentation
- By Equipment Type
- Oxidation Systems
- Diffusion Systems
- Epitaxial Reactors
- Photolithography Equipment
- Others
- By Size
- 50 mm-100 mm
- 100 mm-200 mm
- 200 mm-300 mm
- 300 mm-450 mm
- By Geography
- North America
- U.S.
- Canada
- Mexico
- Others
- South America
- Brazil
- Others
- Europe
- UK
- Germany
- France
- Others
- Middle East and Africa
- Asia- Pacific
- Japan
- China
- India
- Taiwan
- South Korea
- Others
1. INTRODUCTION
2. RESEARCH METHODOLOGY
2.1. Research Process and Design
2.2. Research Assumptions
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in The Industry
4.6. Life Cycle Analysis- Regional Snapshot
4.7. Market Attractiveness
5. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY EQUIPMENT TYPE
5.1. Oxidation Systems
5.2. Diffusion Systems
5.3. Epitaxial Reactors
5.4. Photolithography Equipment
5.5. Others
6. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY SIZE
6.1. 50 mm-100 mm
6.2. 100 mm-200 mm
6.3. 200 mm-300 mm
6.4. 300 mm-450 mm
7. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY GEOGRAPHY
7.1. North America
7.1.1. U.S.
7.1.2. Canada
7.1.3. Others
7.2. South America
7.2.1. Brazil
7.2.2. Others
7.3. Europe
7.3.1. UK
7.3.2. Germany
7.3.3. France
7.3.4. Others
7.4. Middle East and Africa
7.5. Asia Pacific
7.5.1. Japan
7.5.2. China
7.5.3. India
7.5.4. Taiwan
7.5.5. South Korea
7.5.6. Others
8. COMPETITIVE INTELLIGENCE
8.1. Market Share Analysis
8.2. Investment Analysis
8.3. Recent Deals
8.4. Strategies of Key Players
9. COMPANY PROFILES
9.1. LAM RESEARCH CORPORATION
9.2. SCREEN Semiconductor Solutions Co., Ltd
9.3. Tokyo Electron Limited
9.4. Applied Materials, Inc.
9.5. Hitachi High-Technologies Corporation
9.6. KLA-Tencor Corporation
9.7. List is not exhaustive*
List of Figures
List of Tables
2. RESEARCH METHODOLOGY
2.1. Research Process and Design
2.2. Research Assumptions
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in The Industry
4.6. Life Cycle Analysis- Regional Snapshot
4.7. Market Attractiveness
5. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY EQUIPMENT TYPE
5.1. Oxidation Systems
5.2. Diffusion Systems
5.3. Epitaxial Reactors
5.4. Photolithography Equipment
5.5. Others
6. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY SIZE
6.1. 50 mm-100 mm
6.2. 100 mm-200 mm
6.3. 200 mm-300 mm
6.4. 300 mm-450 mm
7. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY GEOGRAPHY
7.1. North America
7.1.1. U.S.
7.1.2. Canada
7.1.3. Others
7.2. South America
7.2.1. Brazil
7.2.2. Others
7.3. Europe
7.3.1. UK
7.3.2. Germany
7.3.3. France
7.3.4. Others
7.4. Middle East and Africa
7.5. Asia Pacific
7.5.1. Japan
7.5.2. China
7.5.3. India
7.5.4. Taiwan
7.5.5. South Korea
7.5.6. Others
8. COMPETITIVE INTELLIGENCE
8.1. Market Share Analysis
8.2. Investment Analysis
8.3. Recent Deals
8.4. Strategies of Key Players
9. COMPANY PROFILES
9.1. LAM RESEARCH CORPORATION
9.2. SCREEN Semiconductor Solutions Co., Ltd
9.3. Tokyo Electron Limited
9.4. Applied Materials, Inc.
9.5. Hitachi High-Technologies Corporation
9.6. KLA-Tencor Corporation
9.7. List is not exhaustive*
List of Figures
List of Tables
