Thermal Scanning Probe Lithography: Continuing the Path to Semiconductor Miniaturization

March 2019 | 11 pages | ID: T57C7B659FDEN
BCC Research

Abstracts

REPORT INCLUDES:

• Technological highlights and market outlook of thermal scanning probe lithography (tSPL) as a mean to semiconductor miniaturization
• Insight into the role of tSPL process in diverse industry sectors, including electronics and optoelectronics; chemistry, biochemistry and healthcare; sensors and actuators; energy; and fabrication of 3D structures on transparent substrates etc.
• Summary of lithographic processes for creating electronic features using deposition technologies for ultrathin films
• An assessment of current trends, technology status, strengths and drawbacks, and emerging applications of tSPL at the industrial level

Contents

CHAPTER 1 TECHNOLOGY HIGHLIGHTS AND MARKET OUTLOOK

On-going Miniaturization and Nanoelectronics
Fabrication of Nanostructures
Scanning Probe Lithography
Current Technology Status and Strengths of Thermal Scanning Probe Lithography
Current and Emerging Applications
Technology Drawbacks
Competing Technologies
Market Outlook

List Of Tables

LIST OF TABLES

Table 1: Deposition Technologies for Ultrathin Films, 2019
Table 2: Lithographic Methods, 2019
Table 3: Materials Processed, by Thermal Scanning Probe Lithography, 2019
Table 4: Current and Emerging Applications, 2019
Table 5: Global Market for Nanolithography Equipment, by Region, Through 2024

List Of Figures

LIST OF FIGURES

Figure 1: From Microelectronics to Nanoelectronics
Figure 2: Global Market Share for Nanolithography Equipment, by Region, 2024