System on Chip Market - Forecasts From 2018 to 2023
The system-on-chip market is projected to grow at a CAGR of 15.57% to reach US$125.468 billion by 2023, from US$52.655 billion in 2017. The major factors driving the demand for system-on-chip solutions are increasing the need for compact ICs and budding demand for power-efficient and user-friendly devices. In addition, the high adoption of the internet of things (IoT) solutions including automotive, communications and technology, and healthcare among many others will further add to the growing demand for SoC solutions. The North American and European region held a significant market share owing to the presence of various vendors offering varied services and early adoption of technology across industry vertical. The Asia Pacific region will grow at a substantial rate on account of technological integration in manufacturing facilities and favourable government policies promoting the set-up of new manufacturing and research facilities.
This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.
Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the system-on-chip value chain. The last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.
Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the system-on-chip market.
Major industry players profiled as part of the report Taiwan Semiconductor Manufacturing Company Limited, Arm Limited, United Microelectronics Corporation, NXP Semiconductors, Qualcomm Technologies, Inc., Toshiba Electronic Devices and Storage Corporation, and Intel Corporation among others.
Segmentation
The system-on-chip market has been analyzed through the following segments:
By Component
Hardware
Software
Services
By Type
Digital
Analog
Mixed Signal
By Industry Vertical
Automotive
Consumer Electronics
Communications and Technology
Healthcare
Others
By Geography
North America
USA
Canada
Mexico
Others
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others
This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.
Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the system-on-chip value chain. The last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.
Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the system-on-chip market.
Major industry players profiled as part of the report Taiwan Semiconductor Manufacturing Company Limited, Arm Limited, United Microelectronics Corporation, NXP Semiconductors, Qualcomm Technologies, Inc., Toshiba Electronic Devices and Storage Corporation, and Intel Corporation among others.
Segmentation
The system-on-chip market has been analyzed through the following segments:
By Component
Hardware
Software
Services
By Type
Digital
Analog
Mixed Signal
By Industry Vertical
Automotive
Consumer Electronics
Communications and Technology
Healthcare
Others
By Geography
North America
USA
Canada
Mexico
Others
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. SYSTEM-ON-CHIP MARKET BY COMPONENT
5.1. Hardware
5.2. Software
5.3. Services
6. SYSTEM-ON-CHIP MARKET BY TYPE
6.1. Digital
6.2. Analog
6.3. Mixed Signal
7. SYSTEM-ON-CHIP MARKET BY INDUSTRY VERTICAL
7.1. Automotive
7.2. Consumer Electronics
7.3. Communications and Technology
7.4. Healthcare
7.5. Others
8. SYSTEM-ON-CHIP MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Mexico
8.1.4. Others
8.2. South America
8.2.1. Brazil
8.2.2. Argentina
8.2.3. Others
8.3. Europe
8.3.1. Germany
8.3.2. France
8.3.3. United Kingdom
8.3.4. Spain
8.3.5. Others
8.4. Middle East and Africa
8.4.1. Saudi Arabia
8.4.2. Israel
8.4.3. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. India
8.5.5. Others
9. COMPETITIVE INTELLIGENCE
9.1. Market Share Analysis
9.2. Recent Investment and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. Taiwan Semiconductor Manufacturing Company Limited
10.1.1. Company Overview
10.1.2. Financials
10.1.3. Products and Services
10.1.4. Recent Developments
10.2. Arm Limited
10.2.1. Company Overview
10.2.2. Financials
10.2.3. Products and Services
10.2.4. Recent Developments
10.3. United Microelectronics Corporation
10.3.1. Company Overview
10.3.2. Financials
10.3.3. Products and Services
10.3.4. Recent Developments
10.4. NXP Semiconductors
10.4.1. Company Overview
10.4.2. Financials
10.4.3. Products and Services
10.4.4. Recent Developments
10.5. Qualcomm Technologies, Inc.
10.5.1. Company Overview
10.5.2. Financials
10.5.3. Products and Services
10.5.4. Recent Developments
10.6. Toshiba Electronic Devices and Storage Corporation
10.6.1. Company Overview
10.6.2. Financials
10.6.3. Products and Services
10.6.4. Recent Developments
10.7. Intel Corporation
10.7.1. Company Overview
10.7.2. Financials
10.7.3. Products and Services
10.7.4. Recent Developments
10.8. STMicroelectronics
10.8.1. Company Overview
10.8.2. Financials
10.8.3. Products and Services
10.8.4. Recent Developments
10.9. Broadcom
10.9.1. Company Overview
10.9.2. Financials
10.9.3. Products and Services
10.9.4. Recent Developments
10.10. Infineon Technologies
10.10.1. Company Overview
10.10.2. Financials
10.10.3. Products and Services
10.10.4. Recent Developments
LIST OF FIGURES
LIST OF TABLES
DISCLAIMER
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. SYSTEM-ON-CHIP MARKET BY COMPONENT
5.1. Hardware
5.2. Software
5.3. Services
6. SYSTEM-ON-CHIP MARKET BY TYPE
6.1. Digital
6.2. Analog
6.3. Mixed Signal
7. SYSTEM-ON-CHIP MARKET BY INDUSTRY VERTICAL
7.1. Automotive
7.2. Consumer Electronics
7.3. Communications and Technology
7.4. Healthcare
7.5. Others
8. SYSTEM-ON-CHIP MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Mexico
8.1.4. Others
8.2. South America
8.2.1. Brazil
8.2.2. Argentina
8.2.3. Others
8.3. Europe
8.3.1. Germany
8.3.2. France
8.3.3. United Kingdom
8.3.4. Spain
8.3.5. Others
8.4. Middle East and Africa
8.4.1. Saudi Arabia
8.4.2. Israel
8.4.3. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. India
8.5.5. Others
9. COMPETITIVE INTELLIGENCE
9.1. Market Share Analysis
9.2. Recent Investment and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. Taiwan Semiconductor Manufacturing Company Limited
10.1.1. Company Overview
10.1.2. Financials
10.1.3. Products and Services
10.1.4. Recent Developments
10.2. Arm Limited
10.2.1. Company Overview
10.2.2. Financials
10.2.3. Products and Services
10.2.4. Recent Developments
10.3. United Microelectronics Corporation
10.3.1. Company Overview
10.3.2. Financials
10.3.3. Products and Services
10.3.4. Recent Developments
10.4. NXP Semiconductors
10.4.1. Company Overview
10.4.2. Financials
10.4.3. Products and Services
10.4.4. Recent Developments
10.5. Qualcomm Technologies, Inc.
10.5.1. Company Overview
10.5.2. Financials
10.5.3. Products and Services
10.5.4. Recent Developments
10.6. Toshiba Electronic Devices and Storage Corporation
10.6.1. Company Overview
10.6.2. Financials
10.6.3. Products and Services
10.6.4. Recent Developments
10.7. Intel Corporation
10.7.1. Company Overview
10.7.2. Financials
10.7.3. Products and Services
10.7.4. Recent Developments
10.8. STMicroelectronics
10.8.1. Company Overview
10.8.2. Financials
10.8.3. Products and Services
10.8.4. Recent Developments
10.9. Broadcom
10.9.1. Company Overview
10.9.2. Financials
10.9.3. Products and Services
10.9.4. Recent Developments
10.10. Infineon Technologies
10.10.1. Company Overview
10.10.2. Financials
10.10.3. Products and Services
10.10.4. Recent Developments
LIST OF FIGURES
LIST OF TABLES
DISCLAIMER
