Silicon on Insulator Market by Smart Cut SOI, Bonding SOI, Layer Transfer SOI, RF-SOI, Power -SOI, FD-SOI, RF FEM, MEMS Devices, Optical Communication, Image Sensing Devices, Automotive and Military & Defense - Global Forecast to 2029
The global silicon on insulator market was valued at USD 1.29 billion in 2024 and is projected to reach USD 2.55 billion by 2029; it is expected to register a CAGR of 14.7% during the forecast period. SOI technology is well-suited for the fabrication of smaller transistors, enabling higher device densities and increased functionality and silicon wastage prevention in thin-wafer manufacturing and establishment is driving the growth of the silicon on insulator market, while floating body and self-heating effects in SOI-based devices are restraining it.
“The bonding segment is expected to grow at a significant CAGR during the forecast period.”
The bonding segment is projected to grow at a significant rate while attaining a CAGR during the forecast. The growth of the segment is attributed to the advancements in bonding technologies that improved the manufacturing of SOI wafers at lower costs. This results in reduced cost of implementing SOI technology, hence expanding its further applicability in other fields such as consumer electronics and automotive industries, among others. Moreover, increased material bonding technology allows the manufacturing of larger sized SOI wafers, a requirement for the developing high-demanding applications in telecommunication, automobile, and consumer electronics industries. Bigger wafers enable many chips to be produced from a single piece of silicon, resulting in high productivity.
“RF-SOI is likely to capture the highest share during the 2023”
The market in RF-SOI wafer type is expected to capture the highest share in 2023. The growing demand for RF-SOI wafers is driven by advancements in wireless communication, the automotive industry, aerospace and defense, medical devices, and consumer electronic. All smartphones use RF-SOI wafers. The increasing adoption of ADAS features in vehicles, such as radar, lidar, and wireless connectivity, necessitates high-performance RF components. RF-SOI wafers provide the necessary characteristics for these applications. Also, the increasing demand for other components, such as digital and RF chips, also drives the market for RF-SOI wafers. Their unique properties, such as low power consumption, high integration density, and excellent RF performance, make them a valuable technology for a wide range of applications.
“The Europe is likely to capture the highest share during the 2023.”
The market in Europe is expected to capture the highest share in 2023. The market growth can be attributed to the European automotive market that has been using SOI technology in its products. The existence of major auto manufacturing industries includes Audi, Mercedes Benz, BMW Group, Daimler, Fiat Chrysler Automobiles, Opel Group, PSA Group, Renault organization, and Volkswagen Group, among others. Moreover, in March 2024, the manufacturing unit STMicroelectronics changed the STM32 microcontrollers to an 18nm Fully Depleted Silicon On Insulator (FD-SOI) manufacturing process with integrated Phase Change Memory.
Breakdown of primaries
The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
Research Coverage:
The report segments the silicon on insulator market and forecasts its size by wafer size, wafer type, technology, product, application, and region. The report also discusses the drivers, restraints, opportunities, and challenges of the market. It gives a detailed view of the market across four main regions—North America, Europe, Asia Pacific, and RoW. Supply chain analysis has been included in the report, along with the key players and their competitive analysis in the silicon on insulator ecosystem.
Key Benefits to Buy the Report:
“The bonding segment is expected to grow at a significant CAGR during the forecast period.”
The bonding segment is projected to grow at a significant rate while attaining a CAGR during the forecast. The growth of the segment is attributed to the advancements in bonding technologies that improved the manufacturing of SOI wafers at lower costs. This results in reduced cost of implementing SOI technology, hence expanding its further applicability in other fields such as consumer electronics and automotive industries, among others. Moreover, increased material bonding technology allows the manufacturing of larger sized SOI wafers, a requirement for the developing high-demanding applications in telecommunication, automobile, and consumer electronics industries. Bigger wafers enable many chips to be produced from a single piece of silicon, resulting in high productivity.
“RF-SOI is likely to capture the highest share during the 2023”
The market in RF-SOI wafer type is expected to capture the highest share in 2023. The growing demand for RF-SOI wafers is driven by advancements in wireless communication, the automotive industry, aerospace and defense, medical devices, and consumer electronic. All smartphones use RF-SOI wafers. The increasing adoption of ADAS features in vehicles, such as radar, lidar, and wireless connectivity, necessitates high-performance RF components. RF-SOI wafers provide the necessary characteristics for these applications. Also, the increasing demand for other components, such as digital and RF chips, also drives the market for RF-SOI wafers. Their unique properties, such as low power consumption, high integration density, and excellent RF performance, make them a valuable technology for a wide range of applications.
“The Europe is likely to capture the highest share during the 2023.”
The market in Europe is expected to capture the highest share in 2023. The market growth can be attributed to the European automotive market that has been using SOI technology in its products. The existence of major auto manufacturing industries includes Audi, Mercedes Benz, BMW Group, Daimler, Fiat Chrysler Automobiles, Opel Group, PSA Group, Renault organization, and Volkswagen Group, among others. Moreover, in March 2024, the manufacturing unit STMicroelectronics changed the STM32 microcontrollers to an 18nm Fully Depleted Silicon On Insulator (FD-SOI) manufacturing process with integrated Phase Change Memory.
Breakdown of primaries
The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
- By Company Type - Tier 1 – 35%, Tier 2 – 45%, Tier 3 – 20%
- By Designation— C-level Executives - 40%, Directors - 30%, Others - 30%
- By Region—North America - 40%, Europe - 20%, Asia Pacific - 30%, RoW - 10%
Research Coverage:
The report segments the silicon on insulator market and forecasts its size by wafer size, wafer type, technology, product, application, and region. The report also discusses the drivers, restraints, opportunities, and challenges of the market. It gives a detailed view of the market across four main regions—North America, Europe, Asia Pacific, and RoW. Supply chain analysis has been included in the report, along with the key players and their competitive analysis in the silicon on insulator ecosystem.
Key Benefits to Buy the Report:
- Analysis of key drivers (Increased investments in the SOI ecosystem, growth in the use of SOI wafers in consumer electronics, reduced overall cost of semiconductor devices by minimizing silicon wastage while manufacturing thin SOI wafers). Restraint (Floating body and self-heating effects in SOI-based devices, Limited availability of existing intellectual property ecosystems to fabless companies), Opportunity (Growing integrated chip industry and expanding SOI ecosystem in the Asia Pacific, Increasing use of SOI technology in IoT devices and applications), Challenges (Volatility and susceptibility of SOI-based wafers to damage caused by pressure or stress)
- Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and new product launches in the silicon on insulator market.
- Market Development: Comprehensive information about lucrative markets – the report analyses the silicon on insulator market across varied regions.
- Market Diversification: Exhaustive information about new products and services, untapped geographies, recent developments, and investments in the silicon on insulator market.
- Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players in the silicon on insulator market, such as SOITEC (France), Shin-Etsu Chemical Co., Ltd. (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), and Shanghai Simgui Technology Co., Ltd. (China).
INTRODUCTION
1. STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.3 STUDY SCOPE
1.3. MARKET SEGMENTATION
1.3.2 INCLUSIONS & EXCLUSIONS
1.3.2. Inclusions & exclusions at company level
1.3.2.2 Inclusions & exclusions at wafer size level
1.3.2.3 Inclusions & exclusions at product level
1.3.2.4 Inclusions & exclusions at technology level
1.3.2.5 Inclusions & exclusions at application level
1.3.2.6 Inclusions & exclusions at wafer type level
1.3.2.7 Inclusions & exclusions at regional level
1.4 YEARS CONSIDERED
1.5 CURRENCY CONSIDERED
1.6 UNITS CONSIDERED
1.7 STUDY LIMITATIONS
1.8 STAKEHOLDERS
1.9 SUMMARY OF CHANGES
2 RESEARCH METHODOLOGY
2. RESEARCH DATA
2.1. SECONDARY DATA
2.1.1. Major secondary sources
2.1.1.2 Key data from secondary sources
2.1.2 PRIMARY DATA
2.1.2. List of key primary interview participants
2.1.2.2 Breakdown of primaries
2.1.2.3 Key data from primary sources
2.1.3 SECONDARY AND PRIMARY RESEARCH
2.1.3. Key industry insights
2.2 MARKET SIZE ESTIMATION
2.2. BOTTOM-UP APPROACH
2.2.1. Approach to obtain market share using bottom-up analysis
(demand side)
2.2.2 TOP-DOWN APPROACH
2.2.2. Approach to obtain market share using top-down analysis
(supply side)
2.3 FACTOR ANALYSIS
2.3. SUPPLY-SIDE ANALYSIS
2.3.2 GROWTH FORECAST
2.4 MARKET BREAKDOWN AND DATA TRIANGULATION
2.5 RESEARCH ASSUMPTIONS
2.6 RISK ASSESSMENT
3 EXECUTIVE SUMMARY
4 PREMIUM INSIGHTS
4. ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SILICON-ON-INSULATOR MARKET
4.2 SILICON-ON-INSULATOR MARKET, BY APPLICATION
4.3 SILICON-ON-INSULATOR MARKET, BY WAFER TYPE
4.4 SILICON-ON-INSULATOR MARKET, BY TECHNOLOGY
4.5 SILICON-ON-INSULATOR MARKET, BY PRODUCT
4.6 SILICON-ON-INSULATOR MARKET, BY WAFER SIZE
4.7 ASIA PACIFIC: SILICON-ON-INSULATOR MARKET, BY APPLICATION AND COUNTRY
5 MARKET OVERVIEW
5. INTRODUCTION
5.2 MARKET DYNAMICS
5.2. DRIVERS
5.2.1. Increasing demand for high-performance, energy-efficient devices
5.2.1.2 Adoption of 5G and IoT technologies
5.2.1.3 Need for miniaturization
5.2.1.4 Demand for electric vehicles and smart automotive systems
5.2.2 RESTRAINTS
5.2.2. Global shortage of semiconductor chips
5.2.2.2 Availability of alternative semiconductor technologies
5.2.3 OPPORTUNITIES
5.2.3. Focus on energy efficiency and sustainability
5.2.3.2 Ongoing technological advancements
5.2.4 CHALLENGES
5.2.4. Presence of device limitations
5.2.4.2 Complexity in process control and lack of skilled workforce
5.3 VALUE CHAIN ANALYSIS
5.4 ECOSYSTEM ANALYSIS
5.5 INVESTMENT AND FUNDING SCENARIO
5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
5.7 TECHNOLOGY ANALYSIS
5.7. KEY TECHNOLOGIES
5.7.1. Wafer bonding
5.7.2 COMPLEMENTARY TECHNOLOGIES
5.7.2. SiC (Silicon Carbide)
5.7.3 ADJACENT TECHNOLOGIES
5.7.3. POI (Piezoelectric-on-Insulator)
5.8 PRICING ANALYSIS
5.8. AVERAGE SELLING PRICE TREND OF KEY PLAYERS, BY WAFER SIZE
5.8.2 AVERAGE SELLING PRICE TREND, BY WAFER SIZE
5.8.3 AVERAGE SELLING PRICE TREND FOR SILICON-ON-INSULATORS, BY REGION
5.9 PORTER’S FIVE FORCES ANALYSIS
5.9. THREAT OF NEW ENTRANTS
5.9.2 THREAT OF SUBSTITUTES
5.9.3 BARGAINING POWER OF SUPPLIERS
5.9.4 BARGAINING POWER OF BUYERS
5.9.5 INTENSITY OF COMPETITIVE RIVALRY
5.10 KEY STAKEHOLDERS & BUYING CRITERIA
5.10. KEY STAKEHOLDERS IN BUYING PROCESS
5.10.2 BUYING CRITERIA
5.1 IMPACT OF AI/GEN AI ON SILICON-ON-INSULATOR MARKET
5.12 CASE STUDIES
5.12. UMC UTILIZED SOITEC’S HIGH-PERFORMANCE SOI WAFER TO ADVANCE ITS TECHNOLOGICAL CAPABILITIES
5.12.2 GLOBALFOUNDRIES ENTERED INTO MULTIPLE LONG-TERM SUPPLY AGREEMENTS WITH SOITEC TO MAINTAIN HIGH PRODUCTION LEVELS
5.12.3 CHINA MOBILE INTEGRATED WITH SOITEC’S ADVANCED SOI TECHNOLOGY TO ACCELERATE 5G DEVELOPMENT EFFORTS
5.12.4 VTT CHOSE OKMETIC’S E-SOI WAFERS TO IMPROVE ITS PHOTONICS TECHNOLOGY
5.13 TRADE ANALYSIS
5.13. IMPORT SCENARIO (HS CODE: 854690)
5.13.2 EXPORT SCENARIO (HS CODE: 854690)
5.14 PATENT ANALYSIS
5.15 REGULATORY LANDSCAPE
5.15. STANDARDS
5.15.2 GOVERNMENT REGULATIONS
5.16 KEY CONFERENCES & EVENTS, 2024—2025
6 SILICON-ON-INSULATOR MARKET, BY WAFER SIZE
6. INTRODUCTION
6.2 LESS THAN OR EQUAL TO 200MM
6.2. IMPROVED STABILITY AND LOW SENSITIVITY OFFERED BY LESS THAN OR EQUAL TO 200MM SOI TO DRIVE GROWTH
6.3 300MM
6.3. RISING DEMAND FOR TECHNOLOGICALLY ADVANCED SOI WAFERS IN END-USE APPLICATIONS TO FUEL SEGMENT GROWTH
7 SILICON-ON-INSULATOR MARKET, BY WAFER TYPE
7. INTRODUCTION
7.2 RF-SOI
7.2. NEED FOR WIRELESS DATA TRANSMISSION TO INFLUENCE DEMAND FOR RF-SOI
7.3 POWER-SOI
7.3. DEMAND FOR ENHANCED POWER MANAGEMENT SYSTEMS TO BOOST GROWTH
7.4 FD-SOI
7.4. NEED FOR DEVICES WITH RELIABILITY AND HIGH PERFORMANCE TO SPUR DEMAND FOR FD-SOI
7.5 PD-SOI
7.5. PD-SOI WAFERS OFFER REDUCED JUNCTION CAPACITANCE, SIMPLIFIED TAP STRUCTURE, AND REDUCED SUSCEPTIBILITY TO ERRORS
7.6 OTHER WAFER TYPES
7.6. PHOTONICS-SOI
7.6.2 IMAGER-SOI
8 SILICON-ON-INSULATOR MARKET, BY TECHNOLOGY
8. INTRODUCTION
8.2 SMART CUT SOI
8.2. GROWING USE OF SMART CUT TECHNOLOGY AT WAFER MANUFACTURING SITES FOR HIGH-VOLUME PRODUCTION TO BOOST MARKET
8.3 BONDING SOI
8.3. NEED FOR BONDING SOI TECHNOLOGY IN HIGH-TEMPERATURE, HIGH-VOLTAGE APPLICATIONS TO DRIVE MARKET
8.4 LAYER TRANSFER SOI
8.4. LAYER TRANSFER SOI TECHNOLOGY IS KNOWN FOR ITS HIGH-ACCURACY, THIN-FILM LAYER TRANSFER PROCESS
9 SILICON-ON-INSULATOR MARKET, BY PRODUCT
9. INTRODUCTION
9.2 RF FEM PRODUCTS
9.2. WIDE USAGE OF RF FEM IN SMARTPHONES TO PROPEL SEGMENT GROWTH
9.3 MEMS DEVICES
9.3. INCREASING USE OF SOI WAFER-BASED MEMS IN TELECOMMUNICATION TO DRIVE MARKET
9.4 POWER PRODUCTS
9.4. SUSTAINABILITY OF POWER PRODUCTS IN HARSH ENVIRONMENTS TO BOOST THEIR ADOPTION
9.5 OPTICAL COMMUNICATION DEVICES
9.5. RISING NUMBER OF DATA CENTERS TO DRIVE MARKET GROWTH
9.6 IMAGE SENSING PRODUCTS
9.6. APPLICATION OF SOI TECHNOLOGY IN THIN CIS CHIP DEVELOPMENT AND FACIAL RECOGNITION TO DRIVE GROWTH
10 SILICON-ON-INSULATOR MARKET, BY APPLICATION
10. INTRODUCTION
10.2 CONSUMER ELECTRONICS
10.2. RISING TECHNOLOGICAL ADVANCEMENTS AND NEED FOR SOI IN MOBILE AND PORTABLE DEVICES TO DRIVE MARKET
10.3 AUTOMOTIVE
10.3. GROWING DEMAND FOR COMFORT, CONVENIENCE, AND SECURITY IN AUTOMOBILES TO BOOST MARKET
10.4 DATACOM & TELECOM
10.4. GROWING EMPHASIS ON USING SOI IN FIBER-OPTIC CONNECTIONS TO BOOST GROWTH
10.5 INDUSTRIAL
10.5. INNOVATION IN EVOLVING INDUSTRIAL SYSTEMS TO BOLSTER GROWTH OF SOI WAFERS
10.6 MILITARY, DEFENSE, AND AEROSPACE
10.6. NEED FOR ENHANCED COMMUNICATION IN MILITARY, DEFENSE, AND AEROSPACE SECTORS TO DRIVE ADOPTION OF SOI-BASED WAFERS
1 SILICON-ON-INSULATOR MARKET, BY THICKNESS
11. THIN-FILM SOI WAFERS (THICKNESS UP TO 1?M)
11.2 THICK-FILM SOI WAFERS (THICKNESS BETWEEN 1µM AND 3µM)
12 SILICON-ON-INSULATOR MARKET, BY REGION
12. INTRODUCTION
12.2 NORTH AMERICA
12.2. MACROECONOMIC OUTLOOK
12.2.2 US
12.2.2. Increasing focus on production of SOI technology to fuel growth
12.2.3 CANADA
12.2.3. Growing advancements in photonic industry to drive growth
12.2.4 MEXICO
12.2.4. Increased demand for RF-SOI devices to spur market growth
12.3 EUROPE
12.3. MACROECONOMIC OUTLOOK
12.3.2 FRANCE
12.3.2. Rising focus on research and development of SOI technology to fuel market growth
12.3.3 UK
12.3.3. Increased demand for IoT and 5G technologies to drive adoption of SOI
12.3.4 GERMANY
12.3.4. Adoption of SOI wafers in automotive sector to drive market
12.3.5 ITALY
12.3.5. Rapid innovation and technological advancements to propel growth
12.3.6 REST OF EUROPE
12.4 ASIA PACIFIC
12.4. MACROECONOMIC OUTLOOK
12.4.2 CHINA
12.4.2. Growing demand for consumer electronics to drive adoption of SOI technology
12.4.3 JAPAN
12.4.3. Presence of well-established market players to spur demand for SOI technology
12.4.4 TAIWAN
12.4.4. Increasing demand for 5G technologies to spur growth
12.4.5 REST OF ASIA PACIFIC
12.5 REST OF THE WORLD (ROW)
12.5. MACROECONOMIC OUTLOOK
12.5.2 MIDDLE EAST & AFRICA
12.5.2. Growth in initiatives and improved focus on medical technologies to drive growth
12.5.2.2 GCC countries
12.5.2.3 Rest of Middle East & Africa
12.5.3 SOUTH AMERICA
12.5.3. Growing emphasis on adoption of solar energy to bolster innovation in SOI technology
13 COMPETITIVE LANDSCAPE
13. OVERVIEW
13.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020–2024
13.3 MARKET SHARE ANALYSIS, 2023
13.4 REVENUE ANALYSIS, 2019–2023
13.5 COMPANY VALUATION AND FINANCIAL METRICS
13.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
13.6. STARS
13.6.2 EMERGING LEADERS
13.6.3 PERVASIVE PLAYERS
13.6.4 PARTICIPANTS
13.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023
13.6.5. Company footprint
13.6.5.2 Region footprint
13.6.5.3 Wafer size footprint
13.6.5.4 Wafer type footprint
13.6.5.5 Technology footprint
13.6.5.6 Product footprint
13.6.5.7 Application footprint
13.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
13.7. PROGRESSIVE COMPANIES
13.7.2 RESPONSIVE COMPANIES
13.7.3 DYNAMIC COMPANIES
13.7.4 STARTING BLOCKS
13.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
13.7.5. Detailed list of startups/SMEs
13.7.5.2 Competitive benchmarking of startups/SMEs
13.8 BRAND/PRODUCT COMPARISON
13.9 COMPETITIVE SCENARIO
13.9. PRODUCT LAUNCHES
13.9.2 DEALS
13.9.3 EXPANSION
13.9.4 OTHER DEVELOPMENTS
14 COMPANY PROFILES
14. KEY PLAYERS
14.1. SOITEC
14.1.1. Business overview
14.1.1.2 Products/Solutions/Services offered
14.1.1.3 Recent developments
14.1.1.3. Deals
14.1.1.3.2 Expansion
14.1.1.4 MnM view
14.1.1.4. Key strengths/Right to win
14.1.1.4.2 Strategic choices
14.1.1.4.3 Weaknesses/Competitive threats
14.1.2 SHIN-ETSU CHEMICAL CO., LTD.
14.1.2. Business overview
14.1.2.2 Products/Solutions/Services offered
14.1.2.3 Recent developments
14.1.2.3. Deals
14.1.2.3.2 Expansion
14.1.2.4 MnM view
14.1.2.4. Key strengths/Right to win
14.1.2.4.2 Strategic choices
14.1.2.4.3 Weaknesses/Competitive threats
14.1.3 GLOBALWAFERS
14.1.3. Business overview
14.1.3.2 Products/Solutions/Services offered
14.1.3.3 Recent developments
14.1.3.3. Deals
14.1.3.3.2 Expansion
14.1.3.3.3 Other developments
14.1.3.4 MnM view
14.1.3.4. Key strengths/Right to win
14.1.3.4.2 Strategic choices
14.1.3.4.3 Weaknesses/Competitive threats
14.1.4 SUMCO CORPORATION
14.1.4. Business overview
14.1.4.2 Products/Solutions/Services offered
14.1.4.3 MnM view
14.1.4.3. Key strengths/Right to win
14.1.4.3.2 Strategic choices
14.1.4.3.3 Weaknesses/Competitive threats
14.1.5 SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
14.1.5. Business overview
14.1.5.2 Products/Solutions/Services offered
14.1.5.3 MnM view
14.1.5.3. Key strengths/Right to win
14.1.5.3.2 Strategic choices
14.1.5.3.3 Weaknesses/Competitive threats
14.1.6 GLOBALFOUNDRIES
14.1.6. Business overview
14.1.6.2 Products/Solutions/Services offered
14.1.6.3 Recent developments
14.1.6.3. Products/Service launches
14.1.6.3.2 Deals
14.1.7 STMICROELECTRONICS
14.1.7. Business overview
14.1.7.2 Products/Solutions/Services offered
14.1.7.3 Recent developments
14.1.7.3. Products/Services launches
14.1.7.3.2 Deals
14.1.8 TOWER SEMICONDUCTOR
14.1.8. Business overview
14.1.8.2 Products/Solutions/Services offered
14.1.8.3 Recent developments
14.1.8.3. Deals
14.1.9 SILICON VALLEY MICROELECTRONICS, INC.
14.1.9. Business overview
14.1.9.2 Products/Solutions/Services offered
14.1.10 WAFERPRO
14.1.10. Business overview
14.1.10.2 Products/Solutions/Services offered
14.2 OTHER PLAYERS
14.2. NANOGRAFI NANO TECHNOLOGY
14.2.2 OKMETIC
14.2.3 PRECISION MICRO-OPTICS INC.
14.2.4 UNITED MICROELECTRONICS CORPORATION
14.2.5 ULTRASIL LLC
14.2.6 PLUTOSEMI CO., LTD
14.2.7 NXP SEMICONDUCTORS
14.2.8 MURATA MANUFACTURING CO., LTD.
14.2.9 ICEMOS TECHNOLOGY LTD.
14.2.10 PROLYX MICROELECTRONICS PRIVATE LIMITED
14.2.1 NOVA ELECTRONIC MATERIALS, LLC
14.2.12 VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
14.2.13 ROGUE VALLEY MICRODEVICES
14.2.14 SOKA TECHNOLOGY
14.2.15 ADVANCED MICRO FOUNDRY PTE LTD
15 APPENDIX
15. KEY INSIGHTS BY INDUSTRY EXPERTS
15.2 DISCUSSION GUIDE
15.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
15.4 CUSTOMIZATION OPTIONS
15.5 RELATED REPORTS
15.6 AUTHOR DETAILS
1. STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.3 STUDY SCOPE
1.3. MARKET SEGMENTATION
1.3.2 INCLUSIONS & EXCLUSIONS
1.3.2. Inclusions & exclusions at company level
1.3.2.2 Inclusions & exclusions at wafer size level
1.3.2.3 Inclusions & exclusions at product level
1.3.2.4 Inclusions & exclusions at technology level
1.3.2.5 Inclusions & exclusions at application level
1.3.2.6 Inclusions & exclusions at wafer type level
1.3.2.7 Inclusions & exclusions at regional level
1.4 YEARS CONSIDERED
1.5 CURRENCY CONSIDERED
1.6 UNITS CONSIDERED
1.7 STUDY LIMITATIONS
1.8 STAKEHOLDERS
1.9 SUMMARY OF CHANGES
2 RESEARCH METHODOLOGY
2. RESEARCH DATA
2.1. SECONDARY DATA
2.1.1. Major secondary sources
2.1.1.2 Key data from secondary sources
2.1.2 PRIMARY DATA
2.1.2. List of key primary interview participants
2.1.2.2 Breakdown of primaries
2.1.2.3 Key data from primary sources
2.1.3 SECONDARY AND PRIMARY RESEARCH
2.1.3. Key industry insights
2.2 MARKET SIZE ESTIMATION
2.2. BOTTOM-UP APPROACH
2.2.1. Approach to obtain market share using bottom-up analysis
(demand side)
2.2.2 TOP-DOWN APPROACH
2.2.2. Approach to obtain market share using top-down analysis
(supply side)
2.3 FACTOR ANALYSIS
2.3. SUPPLY-SIDE ANALYSIS
2.3.2 GROWTH FORECAST
2.4 MARKET BREAKDOWN AND DATA TRIANGULATION
2.5 RESEARCH ASSUMPTIONS
2.6 RISK ASSESSMENT
3 EXECUTIVE SUMMARY
4 PREMIUM INSIGHTS
4. ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SILICON-ON-INSULATOR MARKET
4.2 SILICON-ON-INSULATOR MARKET, BY APPLICATION
4.3 SILICON-ON-INSULATOR MARKET, BY WAFER TYPE
4.4 SILICON-ON-INSULATOR MARKET, BY TECHNOLOGY
4.5 SILICON-ON-INSULATOR MARKET, BY PRODUCT
4.6 SILICON-ON-INSULATOR MARKET, BY WAFER SIZE
4.7 ASIA PACIFIC: SILICON-ON-INSULATOR MARKET, BY APPLICATION AND COUNTRY
5 MARKET OVERVIEW
5. INTRODUCTION
5.2 MARKET DYNAMICS
5.2. DRIVERS
5.2.1. Increasing demand for high-performance, energy-efficient devices
5.2.1.2 Adoption of 5G and IoT technologies
5.2.1.3 Need for miniaturization
5.2.1.4 Demand for electric vehicles and smart automotive systems
5.2.2 RESTRAINTS
5.2.2. Global shortage of semiconductor chips
5.2.2.2 Availability of alternative semiconductor technologies
5.2.3 OPPORTUNITIES
5.2.3. Focus on energy efficiency and sustainability
5.2.3.2 Ongoing technological advancements
5.2.4 CHALLENGES
5.2.4. Presence of device limitations
5.2.4.2 Complexity in process control and lack of skilled workforce
5.3 VALUE CHAIN ANALYSIS
5.4 ECOSYSTEM ANALYSIS
5.5 INVESTMENT AND FUNDING SCENARIO
5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
5.7 TECHNOLOGY ANALYSIS
5.7. KEY TECHNOLOGIES
5.7.1. Wafer bonding
5.7.2 COMPLEMENTARY TECHNOLOGIES
5.7.2. SiC (Silicon Carbide)
5.7.3 ADJACENT TECHNOLOGIES
5.7.3. POI (Piezoelectric-on-Insulator)
5.8 PRICING ANALYSIS
5.8. AVERAGE SELLING PRICE TREND OF KEY PLAYERS, BY WAFER SIZE
5.8.2 AVERAGE SELLING PRICE TREND, BY WAFER SIZE
5.8.3 AVERAGE SELLING PRICE TREND FOR SILICON-ON-INSULATORS, BY REGION
5.9 PORTER’S FIVE FORCES ANALYSIS
5.9. THREAT OF NEW ENTRANTS
5.9.2 THREAT OF SUBSTITUTES
5.9.3 BARGAINING POWER OF SUPPLIERS
5.9.4 BARGAINING POWER OF BUYERS
5.9.5 INTENSITY OF COMPETITIVE RIVALRY
5.10 KEY STAKEHOLDERS & BUYING CRITERIA
5.10. KEY STAKEHOLDERS IN BUYING PROCESS
5.10.2 BUYING CRITERIA
5.1 IMPACT OF AI/GEN AI ON SILICON-ON-INSULATOR MARKET
5.12 CASE STUDIES
5.12. UMC UTILIZED SOITEC’S HIGH-PERFORMANCE SOI WAFER TO ADVANCE ITS TECHNOLOGICAL CAPABILITIES
5.12.2 GLOBALFOUNDRIES ENTERED INTO MULTIPLE LONG-TERM SUPPLY AGREEMENTS WITH SOITEC TO MAINTAIN HIGH PRODUCTION LEVELS
5.12.3 CHINA MOBILE INTEGRATED WITH SOITEC’S ADVANCED SOI TECHNOLOGY TO ACCELERATE 5G DEVELOPMENT EFFORTS
5.12.4 VTT CHOSE OKMETIC’S E-SOI WAFERS TO IMPROVE ITS PHOTONICS TECHNOLOGY
5.13 TRADE ANALYSIS
5.13. IMPORT SCENARIO (HS CODE: 854690)
5.13.2 EXPORT SCENARIO (HS CODE: 854690)
5.14 PATENT ANALYSIS
5.15 REGULATORY LANDSCAPE
5.15. STANDARDS
5.15.2 GOVERNMENT REGULATIONS
5.16 KEY CONFERENCES & EVENTS, 2024—2025
6 SILICON-ON-INSULATOR MARKET, BY WAFER SIZE
6. INTRODUCTION
6.2 LESS THAN OR EQUAL TO 200MM
6.2. IMPROVED STABILITY AND LOW SENSITIVITY OFFERED BY LESS THAN OR EQUAL TO 200MM SOI TO DRIVE GROWTH
6.3 300MM
6.3. RISING DEMAND FOR TECHNOLOGICALLY ADVANCED SOI WAFERS IN END-USE APPLICATIONS TO FUEL SEGMENT GROWTH
7 SILICON-ON-INSULATOR MARKET, BY WAFER TYPE
7. INTRODUCTION
7.2 RF-SOI
7.2. NEED FOR WIRELESS DATA TRANSMISSION TO INFLUENCE DEMAND FOR RF-SOI
7.3 POWER-SOI
7.3. DEMAND FOR ENHANCED POWER MANAGEMENT SYSTEMS TO BOOST GROWTH
7.4 FD-SOI
7.4. NEED FOR DEVICES WITH RELIABILITY AND HIGH PERFORMANCE TO SPUR DEMAND FOR FD-SOI
7.5 PD-SOI
7.5. PD-SOI WAFERS OFFER REDUCED JUNCTION CAPACITANCE, SIMPLIFIED TAP STRUCTURE, AND REDUCED SUSCEPTIBILITY TO ERRORS
7.6 OTHER WAFER TYPES
7.6. PHOTONICS-SOI
7.6.2 IMAGER-SOI
8 SILICON-ON-INSULATOR MARKET, BY TECHNOLOGY
8. INTRODUCTION
8.2 SMART CUT SOI
8.2. GROWING USE OF SMART CUT TECHNOLOGY AT WAFER MANUFACTURING SITES FOR HIGH-VOLUME PRODUCTION TO BOOST MARKET
8.3 BONDING SOI
8.3. NEED FOR BONDING SOI TECHNOLOGY IN HIGH-TEMPERATURE, HIGH-VOLTAGE APPLICATIONS TO DRIVE MARKET
8.4 LAYER TRANSFER SOI
8.4. LAYER TRANSFER SOI TECHNOLOGY IS KNOWN FOR ITS HIGH-ACCURACY, THIN-FILM LAYER TRANSFER PROCESS
9 SILICON-ON-INSULATOR MARKET, BY PRODUCT
9. INTRODUCTION
9.2 RF FEM PRODUCTS
9.2. WIDE USAGE OF RF FEM IN SMARTPHONES TO PROPEL SEGMENT GROWTH
9.3 MEMS DEVICES
9.3. INCREASING USE OF SOI WAFER-BASED MEMS IN TELECOMMUNICATION TO DRIVE MARKET
9.4 POWER PRODUCTS
9.4. SUSTAINABILITY OF POWER PRODUCTS IN HARSH ENVIRONMENTS TO BOOST THEIR ADOPTION
9.5 OPTICAL COMMUNICATION DEVICES
9.5. RISING NUMBER OF DATA CENTERS TO DRIVE MARKET GROWTH
9.6 IMAGE SENSING PRODUCTS
9.6. APPLICATION OF SOI TECHNOLOGY IN THIN CIS CHIP DEVELOPMENT AND FACIAL RECOGNITION TO DRIVE GROWTH
10 SILICON-ON-INSULATOR MARKET, BY APPLICATION
10. INTRODUCTION
10.2 CONSUMER ELECTRONICS
10.2. RISING TECHNOLOGICAL ADVANCEMENTS AND NEED FOR SOI IN MOBILE AND PORTABLE DEVICES TO DRIVE MARKET
10.3 AUTOMOTIVE
10.3. GROWING DEMAND FOR COMFORT, CONVENIENCE, AND SECURITY IN AUTOMOBILES TO BOOST MARKET
10.4 DATACOM & TELECOM
10.4. GROWING EMPHASIS ON USING SOI IN FIBER-OPTIC CONNECTIONS TO BOOST GROWTH
10.5 INDUSTRIAL
10.5. INNOVATION IN EVOLVING INDUSTRIAL SYSTEMS TO BOLSTER GROWTH OF SOI WAFERS
10.6 MILITARY, DEFENSE, AND AEROSPACE
10.6. NEED FOR ENHANCED COMMUNICATION IN MILITARY, DEFENSE, AND AEROSPACE SECTORS TO DRIVE ADOPTION OF SOI-BASED WAFERS
1 SILICON-ON-INSULATOR MARKET, BY THICKNESS
11. THIN-FILM SOI WAFERS (THICKNESS UP TO 1?M)
11.2 THICK-FILM SOI WAFERS (THICKNESS BETWEEN 1µM AND 3µM)
12 SILICON-ON-INSULATOR MARKET, BY REGION
12. INTRODUCTION
12.2 NORTH AMERICA
12.2. MACROECONOMIC OUTLOOK
12.2.2 US
12.2.2. Increasing focus on production of SOI technology to fuel growth
12.2.3 CANADA
12.2.3. Growing advancements in photonic industry to drive growth
12.2.4 MEXICO
12.2.4. Increased demand for RF-SOI devices to spur market growth
12.3 EUROPE
12.3. MACROECONOMIC OUTLOOK
12.3.2 FRANCE
12.3.2. Rising focus on research and development of SOI technology to fuel market growth
12.3.3 UK
12.3.3. Increased demand for IoT and 5G technologies to drive adoption of SOI
12.3.4 GERMANY
12.3.4. Adoption of SOI wafers in automotive sector to drive market
12.3.5 ITALY
12.3.5. Rapid innovation and technological advancements to propel growth
12.3.6 REST OF EUROPE
12.4 ASIA PACIFIC
12.4. MACROECONOMIC OUTLOOK
12.4.2 CHINA
12.4.2. Growing demand for consumer electronics to drive adoption of SOI technology
12.4.3 JAPAN
12.4.3. Presence of well-established market players to spur demand for SOI technology
12.4.4 TAIWAN
12.4.4. Increasing demand for 5G technologies to spur growth
12.4.5 REST OF ASIA PACIFIC
12.5 REST OF THE WORLD (ROW)
12.5. MACROECONOMIC OUTLOOK
12.5.2 MIDDLE EAST & AFRICA
12.5.2. Growth in initiatives and improved focus on medical technologies to drive growth
12.5.2.2 GCC countries
12.5.2.3 Rest of Middle East & Africa
12.5.3 SOUTH AMERICA
12.5.3. Growing emphasis on adoption of solar energy to bolster innovation in SOI technology
13 COMPETITIVE LANDSCAPE
13. OVERVIEW
13.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020–2024
13.3 MARKET SHARE ANALYSIS, 2023
13.4 REVENUE ANALYSIS, 2019–2023
13.5 COMPANY VALUATION AND FINANCIAL METRICS
13.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
13.6. STARS
13.6.2 EMERGING LEADERS
13.6.3 PERVASIVE PLAYERS
13.6.4 PARTICIPANTS
13.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023
13.6.5. Company footprint
13.6.5.2 Region footprint
13.6.5.3 Wafer size footprint
13.6.5.4 Wafer type footprint
13.6.5.5 Technology footprint
13.6.5.6 Product footprint
13.6.5.7 Application footprint
13.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
13.7. PROGRESSIVE COMPANIES
13.7.2 RESPONSIVE COMPANIES
13.7.3 DYNAMIC COMPANIES
13.7.4 STARTING BLOCKS
13.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
13.7.5. Detailed list of startups/SMEs
13.7.5.2 Competitive benchmarking of startups/SMEs
13.8 BRAND/PRODUCT COMPARISON
13.9 COMPETITIVE SCENARIO
13.9. PRODUCT LAUNCHES
13.9.2 DEALS
13.9.3 EXPANSION
13.9.4 OTHER DEVELOPMENTS
14 COMPANY PROFILES
14. KEY PLAYERS
14.1. SOITEC
14.1.1. Business overview
14.1.1.2 Products/Solutions/Services offered
14.1.1.3 Recent developments
14.1.1.3. Deals
14.1.1.3.2 Expansion
14.1.1.4 MnM view
14.1.1.4. Key strengths/Right to win
14.1.1.4.2 Strategic choices
14.1.1.4.3 Weaknesses/Competitive threats
14.1.2 SHIN-ETSU CHEMICAL CO., LTD.
14.1.2. Business overview
14.1.2.2 Products/Solutions/Services offered
14.1.2.3 Recent developments
14.1.2.3. Deals
14.1.2.3.2 Expansion
14.1.2.4 MnM view
14.1.2.4. Key strengths/Right to win
14.1.2.4.2 Strategic choices
14.1.2.4.3 Weaknesses/Competitive threats
14.1.3 GLOBALWAFERS
14.1.3. Business overview
14.1.3.2 Products/Solutions/Services offered
14.1.3.3 Recent developments
14.1.3.3. Deals
14.1.3.3.2 Expansion
14.1.3.3.3 Other developments
14.1.3.4 MnM view
14.1.3.4. Key strengths/Right to win
14.1.3.4.2 Strategic choices
14.1.3.4.3 Weaknesses/Competitive threats
14.1.4 SUMCO CORPORATION
14.1.4. Business overview
14.1.4.2 Products/Solutions/Services offered
14.1.4.3 MnM view
14.1.4.3. Key strengths/Right to win
14.1.4.3.2 Strategic choices
14.1.4.3.3 Weaknesses/Competitive threats
14.1.5 SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
14.1.5. Business overview
14.1.5.2 Products/Solutions/Services offered
14.1.5.3 MnM view
14.1.5.3. Key strengths/Right to win
14.1.5.3.2 Strategic choices
14.1.5.3.3 Weaknesses/Competitive threats
14.1.6 GLOBALFOUNDRIES
14.1.6. Business overview
14.1.6.2 Products/Solutions/Services offered
14.1.6.3 Recent developments
14.1.6.3. Products/Service launches
14.1.6.3.2 Deals
14.1.7 STMICROELECTRONICS
14.1.7. Business overview
14.1.7.2 Products/Solutions/Services offered
14.1.7.3 Recent developments
14.1.7.3. Products/Services launches
14.1.7.3.2 Deals
14.1.8 TOWER SEMICONDUCTOR
14.1.8. Business overview
14.1.8.2 Products/Solutions/Services offered
14.1.8.3 Recent developments
14.1.8.3. Deals
14.1.9 SILICON VALLEY MICROELECTRONICS, INC.
14.1.9. Business overview
14.1.9.2 Products/Solutions/Services offered
14.1.10 WAFERPRO
14.1.10. Business overview
14.1.10.2 Products/Solutions/Services offered
14.2 OTHER PLAYERS
14.2. NANOGRAFI NANO TECHNOLOGY
14.2.2 OKMETIC
14.2.3 PRECISION MICRO-OPTICS INC.
14.2.4 UNITED MICROELECTRONICS CORPORATION
14.2.5 ULTRASIL LLC
14.2.6 PLUTOSEMI CO., LTD
14.2.7 NXP SEMICONDUCTORS
14.2.8 MURATA MANUFACTURING CO., LTD.
14.2.9 ICEMOS TECHNOLOGY LTD.
14.2.10 PROLYX MICROELECTRONICS PRIVATE LIMITED
14.2.1 NOVA ELECTRONIC MATERIALS, LLC
14.2.12 VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
14.2.13 ROGUE VALLEY MICRODEVICES
14.2.14 SOKA TECHNOLOGY
14.2.15 ADVANCED MICRO FOUNDRY PTE LTD
15 APPENDIX
15. KEY INSIGHTS BY INDUSTRY EXPERTS
15.2 DISCUSSION GUIDE
15.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
15.4 CUSTOMIZATION OPTIONS
15.5 RELATED REPORTS
15.6 AUTHOR DETAILS
