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Hybrid Memory Cube and High-Bandwidth Memory Market by Density (2GB, 4GB and 8GB), Application (Enterprise Storage, Consumer Electronics (PCS, Gaming Consoles and Laptops) and Networking and Telecommunication), & Geography - Global Forecast to 2022

April 2016 | 125 pages | ID: H051258B2B5EN
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“Hybrid Memory Cube and High-Bandwidth Memory market to grow at a CAGR of 56.96%”

According to the new market research report on Hybrid Memory Cube and High-Bandwidth Memory, this market is expected to be worth USD 953.8 million by 2022, growing at a CAGR of 53.96% between 2016 and 2022. The growth of the Hybrid Memory Cube and High-Bandwidth Memory market can be attributed to its growing applications in the networking and enterprise storage sector. The exponentially increasing demand for an enriched end-user experience and increased performance in next-generation mainstream computing applications is driving the market for high-density Hybrid Memory Cube and High-Bandwidth Memory devices. The DRAM memory manufacturing industry is expected to face significant challenges over the next six to eight years as it would witness the evolution of these memory technologies.

“Hybrid Memory Cube and High-Bandwidth Memory market in APAC expected to grow at the highest rate”

This report covers regions including North America, Europe, Asia-Pacific, and Rest of the World (RoW). The market in APAC is expected to grow at a high CAGR between 2016 and 2022. The major drivers for the growth of the Hybrid Memory Cube and High-Bandwidth Memory market in APAC are the rising demand for data centers in enterprise storage applications and increasing manufacturing activities in the automotive and industrial sectors, backed by strong economic growth.

Breakdown of profile of primary participants:
  • By Company Type: Tier 1 - 25%, Tier 2 - 50%, and Tier 3 - 25%
  • By Designation: C level - 35%, Director level - 25%, and others - 40%
  • By Region: North America - 45%, APAC - 20%, Europe - 30%, and RoW - 5%
The companies that are profiled in the report are Samsung Electronics Co., Ltd. (South Korea), SK Hynix, Inc. (South Korea), Micron Technology, Inc. (U.S.), Intel Corporation (U.S.), Fujitsu Ltd. (Japan), IBM (U.S.), Xilinx Inc. (U.S.), Advanced Micro Devices, Inc. (U.S.), Nvidia Corporation (U.S.), Open-Silicon, Inc. (U.S.) and Arira (U.S.)

Reasons to buy the report:
  • This report includes the market statistics pertaining to type, application and geography along with their respective revenue.
  • The Porter’s Five Forces framework has been provided along with the value chain analysis to provide an in-depth insight into the Hybrid Memory Cube and High-Bandwidth Memory market.
  • The major drivers, restraints, challenges, and opportunities for the Hybrid Memory Cube and High-Bandwidth Memory market have been detailed in this report.
  • Illustrative segmentation, analysis, and forecast for markets based on type, application, and geography have been conducted to give an overall view of the Hybrid Memory Cube and High-Bandwidth Memory market.
  • A detailed competitive landscape has been provided including key players, in-depth analysis, and revenue of key players.
1 INTRODUCTION

1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 MARKET SCOPE
  1.3.1 MARKETS COVERED
  1.3.2 YEARS CONSIDERED FOR THE STUDY
1.4 CURRENCY
1.5 LIMITATION
1.6 STAKEHOLDERS

2 RESEARCH METHODOLOGY

2.1 INTRODUCTION
  2.1.1 SECONDARY DATA
    2.1.1.1 Key data from secondary sources
  2.1.2 PRIMARY DATA
    2.1.2.1 Key data from primary sources
    2.1.2.2 Key industry insights
2.2 MARKET SIZE ESTIMATION
  2.2.1 BOTTOM-UP APPROACH
  2.2.2 TOP-DOWN APPROACH
2.3 MARKET BREAKDOWN & DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS AND LIMITATIONS
  2.4.1 ASSUMPTIONS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

4.1 INCREASING RESEARCH & DEVELOPMENT ACTIVITIES EXPECTED TO OFFER NEW GROWTH AVENUES FOR THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
4.2 HYBRID MEMORY CUBE, AND HIGH-BANDWIDTH MEMORY MARKET GROWTH, BY APPLICATION
4.3 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET IN APAC
4.4 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY REGION
4.5 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY CONSUMER ELECTRONICS APPLICATION
4.6 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKETS, BY APPLICATION (2022)

5 MARKET OVERVIEW

5.1 INTRODUCTION
5.2 MARKET SEGMENTATION
  5.2.1 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY DENSITY
  5.2.2 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION
  5.2.3 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY GEOGRAPHY
5.3 MARKET DYNAMICS
  5.3.1 DRIVERS
    5.3.1.1 Need for high-bandwidth, low-power consuming, and highly scalable memory device
    5.3.1.2 Growing demand for enterprise storage application
  5.3.2 RESTRAINTS
    5.3.2.1 Declining ASP of traditional DRAM memory
  5.3.3 OPPORTUNITIES
    5.3.3.1 Increasing adoption of cloud-based services
    5.3.3.2 Growing big data applications
  5.3.4 CHALLENGE
    5.3.4.1 Manufacturing and fabrication challenge

6 INDUSTRY TRENDS

6.1 INTRODUCTION
6.2 VALUE CHAIN ANALYSIS
6.3 PORTER’S FIVE FORCES ANALYSIS
  6.3.1 THREAT OF NEW ENTRANTS
  6.3.2 THREAT OF SUBSTITUTES
  6.3.3 BARGAINING POWER OF SUPPLIERS
  6.3.4 BARGAINING POWER OF BUYERS
  6.3.5 INTENSITY OF RIVALRY

7 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY DENSITY

7.1 INTRODUCTION
7.2 HYBRID MEMORY CUBE (HMC)
  7.2.1 HYBRID MEMORY CUBE CONSORTIUM (HMCC) SPECIFICATION 1.1 AND 2.0
  7.2.2 HYBRID MEMORY CUBE (2GB)
  7.2.3 HYBRID MEMORY CUBE (4GB)
7.3 HIGH-BANDWIDTH MEMORY(HBM)
  7.3.1 JEDEC HIGH-BANDWIDTH MEMORY GENERATION 1 AND 2 SPECIFICATION
  7.3.2 HIGH-BANDWIDTH MEMORY (2GB)
  7.3.3 HIGH-BANDWIDTH MEMORY (4GB)
  7.3.4 HIGH-BANDWIDTH MEMORY (8GB)

8 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION

8.1 INTRODUCTION
8.2 ENTERPRISE STORAGE
8.3 CONSUMER ELECTRONICS
  8.3.1 PCS
  8.3.2 LAPTOPS
  8.3.3 GAMING CONSOLES
8.4 NETWORKING & TELECOMMUNICATION
8.5 INDUSTRIAL APPLICATIONS

9 GEOGRAPHIC ANALYSIS

9.1 INTRODUCTION
9.2 NORTH AMERICA
  9.2.1 U.S.
  9.2.2 CANADA
  9.2.3 MEXICO
9.3 EUROPE
  9.3.1 U.K.
  9.3.2 GERMANY
  9.3.3 FRANCE
  9.3.4 OTHERS
9.4 APAC
  9.4.1 CHINA
  9.4.2 JAPAN
  9.4.3 SOUTH KOREA
  9.4.4 TAIWAN
  9.4.5 OTHERS
9.5 REST OF THE WORLD (ROW)
  9.5.1 SOUTH AMERICA
  9.5.2 MIDDLE EAST
  9.5.3 AFRICA

10 COMPETITIVE LANDSCAPE

10.1 OVERVIEW
10.2 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET: COMPARATIVE ANALYSIS
10.3 MARKET RANKING ANALYSIS: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, 2015
10.4 COMPETITIVE SITUATIONS AND TRENDS
  10.4.1 NEW PRODUCT LAUNCHES
  10.4.2 CONTRACTS, PATNERSHIPS, AND COLLABORATIONS
  10.4.3 ACQUISITIONS
  10.4.4 EXPANSIONS

11 COMPANY PROFILE

(Overview, Financial*, Products & Services, Strategy, and Developments)

11.1 INTRODUCTION
11.2 MICRON TECHNOLOGY, INC.
11.3 SAMSUNG ELECTRONICS CO., LTD.
11.4 SK HYNIX, INC.
11.5 ADVANCED MICRO DEVICES, INC.
11.6 INTEL CORPORATION
11.7 FUJITSU LTD.
11.8 IBM CORPORATION
11.9 XILINX INC.
11.10 NVIDIA CORPORATION
11.11 OPEN-SILICON, INC.
11.12 ARIRA

*Details might not be captured in case of unlisted companies

12 APPENDIX

12.1 INSIGHTS OF INDUSTRY EXPERTS
12.2 DISCUSSION GUIDE
12.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
12.4 INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
12.5 AVAILABLE CUSTOMIZATIONS
12.6 RELATED REPORTS

LIST OF TABLES

Table 1 GROWING DEMAND FOR ENTERPRISE STORAGE APPLICATION PROPELS THE GROWTH OF THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
Table 2 DECLINING ASP OF VOLATILE MEMORY EXPECTED TO RESTRAIN THE GROWTH OF THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
Table 3 GROWING BIG DATA APPLICATIONS WOULD DRIVE THE DEMAND FOR HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
Table 4 MANUFACTURING AND FABRICATION CHALLENGE IS THE MAJOR CHALLENGE FOR THE HYBRID MEMORY CUBE MARKET
Table 5 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET, 2015–2022 (USD MILLION)
Table 6 HYBRID MEMORY CUBE MARKET, BY APPLICATION, 2015–2022 (USD MILLION)
Table 7 HYBRID MEMORY CUBE MARKET, BY CONSUMER ELECTRONICS APPLICATION, 2015–2022 (USD MILLION)
Table 8 COMPARISON BETWEEN DDR3 AND DDR4 VS. HYBRID MEMORY CUBE
Table 9 COMPARISON BETWEEN HYBRID MEMORY CUBE CONSORTIUM VERSION 1.1 AND 2.0
Table 10 2GB HYBRID MEMORY CUBE SPECIFICATIONS
Table 11 4GB HYBRID MEMORY CUBE SPECIFICATIONS
Table 12 HYBRID MEMORY CUBE MARKET, BY DENSITY, 2015–2022 (USD MILLION)
Table 13 COMPARISON BETWEEN DDR3 AND GDDR5 VS. HIGH-BANDWIDTH MEMORY
Table 14 HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION, 2015–2022 (USD MILLION)
Table 15 HIGH-BANDWIDTH MEMORY MARKET, BY CONSUMER ELECTRONICS APPLICATION, 2015–2022 (USD MILLION)
Table 16 COMPARISON BETWEEN HBM1 AND HBM2
Table 17 2GB HIGH-BANDWIDTH MEMORY HBM2 SPECIFICATIONS
Table 18 4GB HIGH-BANDWIDTH MEMORY HBM2 SPECIFICATIONS
Table 19 8GB HIGH-BANDWIDTH MEMORY HBM2 SPECIFICATIONS
Table 20 HIGH-BANDWIDTH MEMORY MARKET, BY DENSITY, 2015–2022 (USD MILLION)
Table 21 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION, 2015–2022 (USD MILLION)
Table 22 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR ENTERPRISE STORAGE, BY TYPE, 2015–2022 (USD MILLION)
Table 23 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR ENTERPRISE SECTOR, BY REGION, 2015–2022 (USD MILLION)
Table 24 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR CONSUMER ELECTRONICS , BY TYPE, 2015–2022 (USD MILLION)
Table 25 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2015–2022 (USD MILLION)
Table 26 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY CONSUMER ELECTRONICS APPLICATION, 2015–2022 (USD MILLION)
Table 27 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR PCS, BY TYPE, 2015–2022 (USD MILLION)
Table 28 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR PCS, BY REGION, 2015–2022 (USD MILLION)
Table 29 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR LAPTOPS, BY TYPE, 2015–2022 (USD MILLION)
Table 30 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR LAPTOPS, BY REGION, 2015–2022 (USD MILLION)
Table 31 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR GAMING CONSOLES, BY TYPE, 2015–2022 (USD MILLION)
Table 32 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR GAMING CONSOLES, BY REGION, 2015–2022 (USD MILLION)
Table 33 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR NETWORKING & TELECOMMUNICATION, BY TYPE, 2015–2022 (USD MILLION)
Table 34 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR NETWORKING & TELECOMMUNICATION, BY REGION, 2015–2022 (USD MILLION)
Table 35 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR INDUSTRIAL APPLICATION, BY TYPE, 2015–2022 (USD MILLION)
Table 36 HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET IN INDUSTRIAL APPLICATION, BY REGION, 2015–2022 (USD MILLION)
Table 37 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET, BY REGION, 2015–2022 (USD MILLION)
Table 38 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN NORTH AMERICA, BY APPLICATION, 2015–2022 (USD MILLION)
Table 39 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN NORTH AMERICA, BY COUNTRY, 2015–2022 (USD MILLION)
Table 40 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN EUROPE, BY APPLICATION, 2015–2022 (USD MILLION)
Table 41 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN EUROPE, BY COUNTRY, 2015–2022 (USD MILLION)
Table 42 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN APAC, BY APPLICATION, 2015–2022 (USD MILLION)
Table 43 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN APAC, BY COUNTRY, 2015–2022 (USD MILLION)
Table 44 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKETIN ROW, BY APPLICATION, 2015–2022 (USD MILLION)
Table 45 HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN ROW, BY REGION, 2015–2022 (USD MILLION)
Table 46 GLOBAL HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET RATING, BY KEY PLAYER, 2015
Table 47 GLOBAL HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET RANKING, BY KEY PLAYER, 2015
Table 48 NEW PRODUCT LAUNCHES, 2013–2016
Table 49 CONTRACTS, PARTNERSHIPS, COLLABORATIONS, 2013–2015
Table 50 ACQUISITIONS, 2013–2015
Table 51 EXPANSIONS, 2014–2015

According to the new research report "Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023", the HMC and HBM market is expected to grow from USD 922.7 in 2018 to USD 3,842.5 Million by 2023, at a CAGR of 33.02% between 2018 and 2023. The growth of this market is mainly driven by the growing need for high-bandwidth, low power consuming, and highly scalable memories; increasing adoption of artificial intelligence; and rising trend of miniaturization of electronic devices.

Some of the Major players operating in the market include:

  • Samsung (South Korea),
  • Micron (US),
  • SK Hynix (South Korea),
  • Intel (US), and
  • AMD (US)

The report also covers various major contributors involved in the HMC and HBM market. Fujitsu (Japan), Xilinx (US), NVIDIA (US), IBM (US), and Open-Silicon (US) are the other important key companies in the HMC and HBM market. In addition, Arira (US), Cadence (US), Marvell (US), Cray (US), ARM (UK), and Rambus (China) are a few other companies involved in the market.

The market for HMC accounted for the largest share in 2017

HMC offers higher bandwidth than HBM. Moreover, the primary application that HMC serves is high-performance computing, which is gaining traction owing to the developments in artificial intelligence and machine learning. HMC also acts as a far memory and supports capability expansion through the chaining process which is attached to the CPU for a maximum of eight cubes. This ensures scalability which is demanded in high-performance computing. All these factors are supporting the adoption of the HMC technology.

The market for APU is expected to grow at the highest CAGR during the forecast period

The market for APU is expected to grow at the highest rate during the forecast period. An HBM-based APU is a recent innovation by AMD (US) developed to meet the requirements of high-performance computing. APUs integrate both GPU and CPU capabilities on a single SoC. This further improves the overall energy efficiency of APUs by eliminating connections between chips. APUs can also be used for graphics applications. Moreover, AMD (US), the leading manufacturer of APUs, demonstrated an APU with integrated HBM and stacked non-volatile memory cells. This will also serve to drive the adoption of APUs in computing applications.

High-performance computing held the largest market size in 2017

High-performance computing has gained traction in the last few years owing to the various developments in artificial intelligence and machine learning. The increasing computational power in the cloud and advancements in sophisticated algorithms are driving the adoption of artificial intelligence by several companies. Along with improvements in AI algorithms, an increasing number of hardware solutions also need advanced devices, which will drive the demand for high-performing memory and processors. Intel (US) has already integrated deep-learning instructions in its Xeon and Xeon Phi processors which use the HMC technology.

The APAC market is expected to grow at the highest CAGR during the forecast period

The major drivers for the rapid growth of the HMC and HBM market in the APAC are the growing number of data centers and servers, increasing shipments of network equipment, and the rising number of manufacturing activities in the enterprise storage and consumer electronics sectors. The strong economic growth and growing demand for high-density memories is expected to drive the HMC and HBM market in the APAC region.



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