Global Outsourced Semiconductor Assembly and Test Market (OSAT) Market with Focus on IC Packaging (2018-2022)
Scope of the Report
The report titled “Global Outsourced Semiconductor Assembly and Test Market (OSAT) Market with Focus on IC Packaging: Size, Trends & Forecasts (2018-2022)”, provides an in-depth analysis of the global OSAT market by value and by region. Further, analysis includes IC Packaging market by value, by volume and by segment. The report also provides the analysis of the OSAT market by value for China region.
The report also assesses the key opportunities in the market and outlines the factors that are and will be driving the growth of the industry. Growth of the overall global OSAT market with focus on IC packaging market has also been forecasted for the period 2018-2022, taking into consideration the previous growth patterns, the growth drivers and the current and future trends.
The OSAT market with focus on IC packaging market is dominated by few players, but there are other new players, private label players as well. However, the competition in the global OSAT market with focus on IC packaging market is dominated by Advanced Semiconductor Engineering, (ASE) Inc., Amkor Technology, Inc., ChipMOS Technologies Inc. (ChipMOS), Mubadala Investment Company (GlobalFoundries Inc.), who are also profiled with their financial information and respective business strategies.
Country Coverage
China
Company Coverage
An Integrated Circuit (IC) is defined as the circuit that is comprised of inseparable and electrically interconnected elements. An IC is basically a semiconductor wafer in which millions of components, like, tiny resistors, capacitors, and transistors, are fabricated. ICs have distinct characteristics like, they are very small in size, have less weight, require low power, and are highly reliable, etc.
The OSATs offer Integrated Circuit packaging services on the open market to the integrated semiconductor manufacturers (ISMs), and fabless companies, and to IDMs and foundries as well. Outsourced Semiconductor Assembly and Test (OSAT) provide third-party Integrated Circuit (IC) packaging and test services.
The OSAT market can be segmented on the basis of technology used in IC packaging. OSAT is based on three major IC packaging technologies, named as Wirebond Packaging, Flip Chip Packaging and Wafer level Packaging.
The global OSAT market with focus on IC packaging has increased at a significant CAGR over the years and projections are made that the market would rise in the next four years i.e. 2018-2022 tremendously. The OSAT market is expected to increase due to rising automotive production, rising Internet of Things (IoT), growing personal electronics, increasing smartphone users, rising urban population etc. Yet the market faces some challenges such as volatile demand from cryptocurrency, etc.
The report titled “Global Outsourced Semiconductor Assembly and Test Market (OSAT) Market with Focus on IC Packaging: Size, Trends & Forecasts (2018-2022)”, provides an in-depth analysis of the global OSAT market by value and by region. Further, analysis includes IC Packaging market by value, by volume and by segment. The report also provides the analysis of the OSAT market by value for China region.
The report also assesses the key opportunities in the market and outlines the factors that are and will be driving the growth of the industry. Growth of the overall global OSAT market with focus on IC packaging market has also been forecasted for the period 2018-2022, taking into consideration the previous growth patterns, the growth drivers and the current and future trends.
The OSAT market with focus on IC packaging market is dominated by few players, but there are other new players, private label players as well. However, the competition in the global OSAT market with focus on IC packaging market is dominated by Advanced Semiconductor Engineering, (ASE) Inc., Amkor Technology, Inc., ChipMOS Technologies Inc. (ChipMOS), Mubadala Investment Company (GlobalFoundries Inc.), who are also profiled with their financial information and respective business strategies.
Country Coverage
China
Company Coverage
- Advanced Semiconductor Engineering, (ASE) Inc.
- Amkor Technology, Inc.
- ChipMOS Technologies Inc. (ChipMOS)
- Mubadala Investment Company (GlobalFoundries Inc.)
An Integrated Circuit (IC) is defined as the circuit that is comprised of inseparable and electrically interconnected elements. An IC is basically a semiconductor wafer in which millions of components, like, tiny resistors, capacitors, and transistors, are fabricated. ICs have distinct characteristics like, they are very small in size, have less weight, require low power, and are highly reliable, etc.
The OSATs offer Integrated Circuit packaging services on the open market to the integrated semiconductor manufacturers (ISMs), and fabless companies, and to IDMs and foundries as well. Outsourced Semiconductor Assembly and Test (OSAT) provide third-party Integrated Circuit (IC) packaging and test services.
The OSAT market can be segmented on the basis of technology used in IC packaging. OSAT is based on three major IC packaging technologies, named as Wirebond Packaging, Flip Chip Packaging and Wafer level Packaging.
The global OSAT market with focus on IC packaging has increased at a significant CAGR over the years and projections are made that the market would rise in the next four years i.e. 2018-2022 tremendously. The OSAT market is expected to increase due to rising automotive production, rising Internet of Things (IoT), growing personal electronics, increasing smartphone users, rising urban population etc. Yet the market faces some challenges such as volatile demand from cryptocurrency, etc.
1. EXECUTIVE SUMMARY
2. INTRODUCTION
2.1 Integrated Circuit (IC): An Overview
2.1.1 Characteristics of Integrated Circuit (IC)
2.1.2 Integrated Circuit (IC) Manufacturing Process
2.2 Segmentation of Integrated Circuit (IC): An Overview
2.3 Outsourced Semiconductor Assembly and Test (OSAT): An Overview
2.4 Outsourced Semiconductor Assembly and Test (OSAT):Value Chain
3. GLOBAL MARKET ANALYSIS
3.1 Global OSAT Market: An Analysis
3.1.1 Global OSAT Market by Value
3.1.2 Global OSAT Market by Region (China, Rest of World)
3.2 Global IC Packaging Market: An Analysis
3.2.1 Global IC Packaging Market by Value
3.2.2 Global IC Packaging Market by Segment (Wirebond Packaging, Flip Chip Packaging and Wafer Level Packaging)
3.2.3 Global IC Packaging Market by Volume
3.2.4 Global IC Packaging Market Volume by Segment (Wirebond Packaging, Flip Chip Packaging and Wafer Level Packaging)
3.3 Global IC Packaging Market: Segment Analysis
3.3.1 Global Wirebond (WB) Packaging Market by Value
3.3.2 Global Wirebond (WB) Packaging Market by Volume
3.3.3 Global Flip Chip (FC) Packaging Market by Value
3.3.4 Global Flip Chip (FC) Packaging Market by Volume
3.3.5 Global Wafer Level Packaging (WLP) Market by Value
3.3.6 Global Wafer Level Packaging (WLP) Market by Volume
4. CHINA MARKET ANALYSIS
4.1 China OSAT Market: An Analysis
5. MARKET DYNAMICS
5.1 Growth Drivers
5.1.1 Rising Automotive Production
5.1.2 Increasing Usage of Camera in Automotive
5.1.3 Rising Demand for Fingerprint Sensors
5.1.4 Rising Internet of Things (IoT)
5.1.5 Increasing Smartphone Users
5.1.6 Growing Personal Electronics
5.1.7 Rising Urban Population
5.2 Challenges
5.2.1 Threat from Foundry’s Forward Integration
5.2.2 Rising Raw Material Cost
5.2.3 Volatile Demand from Cryptocurrency
5.3 Market Trends
5.3.1 Growing Demand for AI-related Semiconductor
5.3.2 Wafer Level Chip Scale Packaging (WLCSP)Technology
5.3.3 Rising Demand for Domestic Consumer Robotics
5.3.4 Increasing Flexible Devices
6. COMPETITIVE LANDSCAPE
6.1 Global OSAT Market Players by Share
6.2 Global OSAT Market Players Financial Comparison
7. COMPANY PROFILE
7.1 Advanced Semiconductor Engineering, Inc. (ASE)
7.1.1 Business Overview
7.1.2 Financial Overview
7.1.1 Business Strategy
7.2 Amkor Technology, Inc.
7.2.1 Business Overview
7.2.2 Financial Overview
7.2.1 Business Strategy
7.3 ChipMOS Technologies Inc. (ChipMOS)
7.3.1 Business Overview
7.3.2 Financial Overview
7.3.3 Business Strategy
7.4 Mubadala Investment Company (GlobalFoundries Inc.)
7.4.1 Business Overview
7.4.2 Financial Overview
7.4.3 Business Strategy
2. INTRODUCTION
2.1 Integrated Circuit (IC): An Overview
2.1.1 Characteristics of Integrated Circuit (IC)
2.1.2 Integrated Circuit (IC) Manufacturing Process
2.2 Segmentation of Integrated Circuit (IC): An Overview
2.3 Outsourced Semiconductor Assembly and Test (OSAT): An Overview
2.4 Outsourced Semiconductor Assembly and Test (OSAT):Value Chain
3. GLOBAL MARKET ANALYSIS
3.1 Global OSAT Market: An Analysis
3.1.1 Global OSAT Market by Value
3.1.2 Global OSAT Market by Region (China, Rest of World)
3.2 Global IC Packaging Market: An Analysis
3.2.1 Global IC Packaging Market by Value
3.2.2 Global IC Packaging Market by Segment (Wirebond Packaging, Flip Chip Packaging and Wafer Level Packaging)
3.2.3 Global IC Packaging Market by Volume
3.2.4 Global IC Packaging Market Volume by Segment (Wirebond Packaging, Flip Chip Packaging and Wafer Level Packaging)
3.3 Global IC Packaging Market: Segment Analysis
3.3.1 Global Wirebond (WB) Packaging Market by Value
3.3.2 Global Wirebond (WB) Packaging Market by Volume
3.3.3 Global Flip Chip (FC) Packaging Market by Value
3.3.4 Global Flip Chip (FC) Packaging Market by Volume
3.3.5 Global Wafer Level Packaging (WLP) Market by Value
3.3.6 Global Wafer Level Packaging (WLP) Market by Volume
4. CHINA MARKET ANALYSIS
4.1 China OSAT Market: An Analysis
5. MARKET DYNAMICS
5.1 Growth Drivers
5.1.1 Rising Automotive Production
5.1.2 Increasing Usage of Camera in Automotive
5.1.3 Rising Demand for Fingerprint Sensors
5.1.4 Rising Internet of Things (IoT)
5.1.5 Increasing Smartphone Users
5.1.6 Growing Personal Electronics
5.1.7 Rising Urban Population
5.2 Challenges
5.2.1 Threat from Foundry’s Forward Integration
5.2.2 Rising Raw Material Cost
5.2.3 Volatile Demand from Cryptocurrency
5.3 Market Trends
5.3.1 Growing Demand for AI-related Semiconductor
5.3.2 Wafer Level Chip Scale Packaging (WLCSP)Technology
5.3.3 Rising Demand for Domestic Consumer Robotics
5.3.4 Increasing Flexible Devices
6. COMPETITIVE LANDSCAPE
6.1 Global OSAT Market Players by Share
6.2 Global OSAT Market Players Financial Comparison
7. COMPANY PROFILE
7.1 Advanced Semiconductor Engineering, Inc. (ASE)
7.1.1 Business Overview
7.1.2 Financial Overview
7.1.1 Business Strategy
7.2 Amkor Technology, Inc.
7.2.1 Business Overview
7.2.2 Financial Overview
7.2.1 Business Strategy
7.3 ChipMOS Technologies Inc. (ChipMOS)
7.3.1 Business Overview
7.3.2 Financial Overview
7.3.3 Business Strategy
7.4 Mubadala Investment Company (GlobalFoundries Inc.)
7.4.1 Business Overview
7.4.2 Financial Overview
7.4.3 Business Strategy
LIST OF FIGURES
Figure 1: Characteristics of Integrated Circuit (IC)
Figure 2: Integrated Circuit (IC) Manufacturing Process
Figure 3: Segmentation of Integrated Circuit (IC)
Figure 4: Technology Used in IC Packaging
Figure 5: Global OSAT Market by Value; 2013-2018 (US$ Billion)
Figure 6: Global OSAT Market by Region; 2017 (Percentage, %)
Figure 7: Global IC Packaging Market by Value; 2014-2017 (US$ Billion)
Figure 8: Global IC Packaging Market by Value; 2018-2022 (US$ Billion)
Figure 9: Global IC Packaging Market by Segment; 2017 (Percentage, %)
Figure 10: Global IC Packaging Market by Volume; 2014-2017 (Million Units)
Figure 11: Global IC Packaging Market by Volume; 2018-2022 (Million Units)
Figure 12: Global IC Packaging Market Volume by Segment; 2017 (Percentage, %)
Figure 13: Global Wirebond Packaging (WB) Market by Value; 2014-2017 (US$ Billion)
Figure 14: Global Wirebond Packaging (WB) Market by Value; 2018-2022 (US$ Billion)
Figure 15: Global Wirebond (WB) Packaging Market by Volume; 2014-2017 (Million Units)
Figure 16: Global Wirebond (WB) Packaging Market by Volume; 2018-2022 (Million Units)
Figure 17: Global Flip Chip (FC) Packaging Market by Value; 2014-2017 (US$ Billion)
Figure 18: Global Flip Chip (FC) Packaging Market by Value; 2018-2022 (US$ Billion)
Figure 19: Global Flip Chip (FC) Packaging Market by Volume; 2014-2017 (Thousand Units)
Figure 20: Global Flip Chip (FC) Packaging Market by Volume; 2018-2022 (Thousand Units)
Figure 21: Global Wafer Level Packaging (WLP) Market by Value; 2014-2017 (US$ Billion)
Figure 22: Global Wafer Level Packaging (WLP) Market by Value; 2018-2022 (US$ Billion)
Figure 23: Global Wafer Level Packaging (WLP) Market by Volume; 2014-2017 (Thousand Units)
Figure 24: Global Wafer Level Packaging (WLP) Market by Volume; 2018-2022 (Thousand Units)
Figure 25: China OSAT Market by Value; 2013-2018 (US$ Billion)
Figure 26: Global Automotive Production; 2013-2017 (Million)
Figure 27: Global Automotive Camera Shipment; 2013-2020 (Million Units)
Figure 28: Global Fingerprint Sensors Shipment; 2014-2018 (Million Units)
Figure 29: Global Internet of Things (IoT) Connected Devices Installed Base; 2015-2022 (Billion)
Figure 30: Global Smartphone Users; 2014-2020 (Billion)
Figure 31: Global Personal Electronics Market; 2013-2020 (Billion Units)
Figure 32: Global Urban Population by Region; 2015-2025 (Billion)
Figure 33: Global AI-related Semiconductor Revenue; 2017-2022 (US$ Billion)
Figure 34: Global WLCSP Market; 2012-2022 (US$ Billion)
Figure 35: Global Domestic Consumer Robotics Market; 2015-2022 (US$ Billion)
Figure 36: Global Wearable Technology by Shipments; 2013-2018 (Million)
Figure 37: Global OSAT Market Players by Share
Figure 38: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues; 2013-2017 (US$ Billion)
Figure 39: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues by Segment; 2017 (Percentage, %)
Figure 40: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues by Region; 2017 (Percentage, %)
Figure 41: Amkor Technology, Inc. Net Sales; 2013-2017 (US$ Billion)
Figure 42: Amkor Technology, Inc. Net Sales by Segment; 2017 (Percentage, %)
Figure 43: Amkor Technology, Inc. Net Sales by Region; 2017 (Percentage, %)
Figure 44: ChipMOS Revenue; 2013-2017 (US$ Million)
Figure 45: ChipMOS Revenue by Segment; 2017 (Percentage,%)
Figure 46: ChipMOS Revenue by Region; 2017 (Percentage,%)
Figure 47: Mubadala Investment Company Revenue; 2013-2017 (US$ Billion)
Figure 48: Mubadala Investment Company Revenue by Segment; 2017 (Percentage, %)
Figure 49: Mubadala Investment Company Revenue by Region; 2017 (Percentage, %)
Figure 1: Characteristics of Integrated Circuit (IC)
Figure 2: Integrated Circuit (IC) Manufacturing Process
Figure 3: Segmentation of Integrated Circuit (IC)
Figure 4: Technology Used in IC Packaging
Figure 5: Global OSAT Market by Value; 2013-2018 (US$ Billion)
Figure 6: Global OSAT Market by Region; 2017 (Percentage, %)
Figure 7: Global IC Packaging Market by Value; 2014-2017 (US$ Billion)
Figure 8: Global IC Packaging Market by Value; 2018-2022 (US$ Billion)
Figure 9: Global IC Packaging Market by Segment; 2017 (Percentage, %)
Figure 10: Global IC Packaging Market by Volume; 2014-2017 (Million Units)
Figure 11: Global IC Packaging Market by Volume; 2018-2022 (Million Units)
Figure 12: Global IC Packaging Market Volume by Segment; 2017 (Percentage, %)
Figure 13: Global Wirebond Packaging (WB) Market by Value; 2014-2017 (US$ Billion)
Figure 14: Global Wirebond Packaging (WB) Market by Value; 2018-2022 (US$ Billion)
Figure 15: Global Wirebond (WB) Packaging Market by Volume; 2014-2017 (Million Units)
Figure 16: Global Wirebond (WB) Packaging Market by Volume; 2018-2022 (Million Units)
Figure 17: Global Flip Chip (FC) Packaging Market by Value; 2014-2017 (US$ Billion)
Figure 18: Global Flip Chip (FC) Packaging Market by Value; 2018-2022 (US$ Billion)
Figure 19: Global Flip Chip (FC) Packaging Market by Volume; 2014-2017 (Thousand Units)
Figure 20: Global Flip Chip (FC) Packaging Market by Volume; 2018-2022 (Thousand Units)
Figure 21: Global Wafer Level Packaging (WLP) Market by Value; 2014-2017 (US$ Billion)
Figure 22: Global Wafer Level Packaging (WLP) Market by Value; 2018-2022 (US$ Billion)
Figure 23: Global Wafer Level Packaging (WLP) Market by Volume; 2014-2017 (Thousand Units)
Figure 24: Global Wafer Level Packaging (WLP) Market by Volume; 2018-2022 (Thousand Units)
Figure 25: China OSAT Market by Value; 2013-2018 (US$ Billion)
Figure 26: Global Automotive Production; 2013-2017 (Million)
Figure 27: Global Automotive Camera Shipment; 2013-2020 (Million Units)
Figure 28: Global Fingerprint Sensors Shipment; 2014-2018 (Million Units)
Figure 29: Global Internet of Things (IoT) Connected Devices Installed Base; 2015-2022 (Billion)
Figure 30: Global Smartphone Users; 2014-2020 (Billion)
Figure 31: Global Personal Electronics Market; 2013-2020 (Billion Units)
Figure 32: Global Urban Population by Region; 2015-2025 (Billion)
Figure 33: Global AI-related Semiconductor Revenue; 2017-2022 (US$ Billion)
Figure 34: Global WLCSP Market; 2012-2022 (US$ Billion)
Figure 35: Global Domestic Consumer Robotics Market; 2015-2022 (US$ Billion)
Figure 36: Global Wearable Technology by Shipments; 2013-2018 (Million)
Figure 37: Global OSAT Market Players by Share
Figure 38: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues; 2013-2017 (US$ Billion)
Figure 39: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues by Segment; 2017 (Percentage, %)
Figure 40: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues by Region; 2017 (Percentage, %)
Figure 41: Amkor Technology, Inc. Net Sales; 2013-2017 (US$ Billion)
Figure 42: Amkor Technology, Inc. Net Sales by Segment; 2017 (Percentage, %)
Figure 43: Amkor Technology, Inc. Net Sales by Region; 2017 (Percentage, %)
Figure 44: ChipMOS Revenue; 2013-2017 (US$ Million)
Figure 45: ChipMOS Revenue by Segment; 2017 (Percentage,%)
Figure 46: ChipMOS Revenue by Region; 2017 (Percentage,%)
Figure 47: Mubadala Investment Company Revenue; 2013-2017 (US$ Billion)
Figure 48: Mubadala Investment Company Revenue by Segment; 2017 (Percentage, %)
Figure 49: Mubadala Investment Company Revenue by Region; 2017 (Percentage, %)
LIST OF TABLES
Table 1: Value Chain of OSAT
Table 2: Global OSAT Market Players Financial Comparison; 2017
Table 1: Value Chain of OSAT
Table 2: Global OSAT Market Players Financial Comparison; 2017
