Global LTCC Market Forecast and Analysis 2016-2021

September 2016 | 123 pages | ID: G5F1395A1FFEN
Gen Consulting Company

Abstracts

The Low Temperature Co-fired Ceramic (LTCC) technology can be defined as a way to produce multilayer circuits with the help of single tapes. These single sheets have to be laminated together and fired all in one step. This saves time, money and reduces circuits’ dimensions. Another great advantage is that every single layer can be inspected before firing which prevents the need of manufacturing a whole new circuit. Because of the low firing temperature (about 850°C), it is possible to use the low resistive materials such as silver and gold instead of molybdenum and tungsten.

LTCC production, which measures output worldwide, was expected to reach *** million units in 2016 with an increase of ***% from its year-earlier level. The global LTCC market size is estimated to grow from USD *** million in 2011 to USD *** million by 2016, at an estimated CAGR of ***% between 2011 and 2016. With regards to this, key players of LTCC industry are expected to find potential opportunities in this market.

The global LTCC market report profiles some of the key technological developments in the recent times. It also profiles some of the leading players in the market and analyzes their key strategies. The competitive landscape section of the report provides a clear insight into the market share analysis of key industry players. The major players in the global LTCC market are Murata, Kyocera, TDK, Bosch, Taiyo Yuden, Hitachi Metals, C-MAC MicroTechnology, ATC, Soshin, ACX, etc.

Contents

PART 1. SCOPE OF REPORT

1.1 Methodology
1.2 Geographic Scope
1.3 Years Considered

PART 2. INTRODUCTION

2.1 Definition
2.2 Benefits of LTCC
2.3 LTCC RF Components
2.4 Current Scenario
Part.3 Value Chain Analysis
3.1 Upstream
  3.1.1 Ceramic Powder & Green Tape
  3.1.2 Passive Components
3.2 Downstream

PART 4. MANUFACTURE

4.1 Manufacturing Process
4.2 Manufacturing Costs

PART 5. COMPANY PROFILES

5.1 Murata (Japan)
  5.1.1 Business Overview
  5.1.2 Products Offered
  5.1.3 Business Performance
5.2 Kyocera (Japan)
  5.2.1 Business Overview
  5.2.2 Products Offered
  5.2.3 Business Performance
5.3 TDK (Japan)
  5.3.1 Business Overview
  5.3.2 Products Offered
  5.3.3 Business Performance
5.4 Taiyo Yuden (Japan)
  5.4.1 Business Overview
  5.4.2 Products Offered
  5.4.3 Business Performance
5.5 Soshin (Japan)
  5.5.1 Business Overview
  5.5.2 Products Offered
  5.5.3 Business Performance
5.6 Hitachi Metals (Japan)
  5.6.1 Business Overview
  5.6.2 Products Offered
  5.6.3 Business Performance
5.7 BOSCH (Germany)
  5.7.1 Business Overview
  5.7.2 Products Offered
  5.7.3 Business Performance
5.8 C-MAC MicroTechnology (Belgium)
  5.8.1 Business Overview
  5.8.2 Products Offered
  5.8.3 Business Performance
5.9 ATC (USA)
  5.9.1 Business Overview
  5.9.2 Products Offered
  5.9.3 Business Performance
5.10 ACX (Taiwan)
  5.10.1 Business Overview
  5.10.2 Products Offered
  5.10.3 Business Performance
5.11 Mag.Layers (Taiwan)
  5.11.1 Business Overview
  5.11.2 Products Offered
  5.11.3 Business Performance
5.12 Microgate (China)
  5.12.1 Business Overview
  5.12.2 Products Offered
  5.12.3 Business Performance
5.13 BDStar Navigation (China)
  5.13.1 Business Overview
  5.13.2 Products Offered
  5.13.3 Business Performance
5.14 Sunlord (China)
  5.14.1 Business Overview
  5.14.2 Business Performance
5.15 Ray Tech (China)
  5.15.1 Business Overview
  5.15.2 Products Offered
  5.15.3 Business Performance

PART 6. MARKET OVERVIEW

6.1 Global Production Volume 2011-2016
6.2 Production Volume by Region 2011-2016
  6.2.1 China
  6.2.2 North America
  6.2.3 EMEA
  6.2.4 Asia-Pacific
6.3 Global Production Value 2011-2016
6.4 Production Value by Region
  6.4.1 China
  6.4.2 North America
  6.4.3 EMEA
  6.4.4 Asia-Pacific

PART 7. CONSUMPTION PATTERN

7.1 Regional Consumption
  7.1.1 China
  7.1.2 North America
  7.1.3 EMEA
  7.1.4 Asia-Pacific
7.2 Global Consumption by Application
7.3 Chinese Consumption by Application

PART 8. MARKET FORECAST

8.1 Market Size Forecast
  8.1.1 Market Size by Volume (Million Units)
  8.1.2 Market Size by Value (M USD)
8.2 Regional Consumption Forecast
  8.2.1 China
  8.2.2 North America
  8.2.3 EMEA
  8.2.4 Asia-Pacific
8.3 Consumption Forecast by Application

PART 9. MARKET DYNAMICS

9.1 Market Drivers
  9.1.1 Telecommunications & Automotive
  9.1.2 Time to Market & Cost Efficient
  9.1.3 Increase in R&D Investments
  9.1.4 Demand in Developing Countries
9.2 Market Constraints
  9.2.1 Entry Barriers
  9.2.2 Rising Labor Costs
  9.2.3 Exchange Rate
9.2 Market Strategies
9.3 Key Events

PART 10. INVESTMENT FEASIBILITY

10.1 Global Economic Highlight 2015
10.2 Recent Developments
10.3 The Updated Forecast
  10.3.1 Advanced Economies
  10.3.2 Emerging Market and Developing Economies
10.4 China Outlook 2016
10.5 Investment in China
  10.5.1 Outlook on investment
  10.5.2 Growth opportunities
  10.5.3 Policy Trends
  10.5.4 Conclusions
10.6 Feasibility of New Project
  10.6.1 Basis and Presumptions
  10.6.2 New Project in China
Disclaimer
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