Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024
“Die bonder equipment market is projected to grow at CAGR of 3.5% from 2019 to 2024”
The global die bonder equipment market size is projected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% from 2019 to 2024. Key factors fueling the growth of this market include the growing demand for miniature electronic components and the increasing adoption of stacked die technology in IoT devices.
“Market for fully automatic die bonders is projected to grow at highest CAGR during forecast period”
Among different types, fully automatic die bonders are projected to lead the market from 2019 to 2024. Fully automatic die bonders can work on different modules, such as wire bonding, wedge bonding, flip chip bonding, and die bonding. Fully automatic die bonders are required for the assembly and packaging of the high volume of consumer products. In addition, fully automatic die bonder equipment provide micron-level placement accuracy, ranging from ± 1.5?m to ± 0.5?m, necessary for the fabrication of electronic components used in medical devices, automobile systems, and consumer electronics, which is expected to propel the market growth in the near future.
“Market for eutectic bonding technique is projected to grow at highest CAGR during 2019–2024”
Among bonding techniques, the eutectic bonding technique is projected to witness the highest CAGR in the die bonder equipment market from 2019 to 2024. This technique requires higher operating temperature during the bonding process, and the bond created is not only robust but can also remain intact even in harsh environments. Semiconductor components fabricated using the eutectic bonding technique are suitable for products that are used in automotive, telecommunications, and industrial applications due to their robustness, which is expected to contribute significantly to the growth of the market for the eutectic bonding technique in the near future.
“Consumer electronics application accounted for largest market share in 2018”
Among applications, the consumer electronics segment is projected to lead the die bonder equipment market from 2019 to 2024. The largest market size is due to the high demand for miniaturized consumer electronic products such as smartphones, wearables, and white goods that provide advantages such as compactness and durability. These miniaturized products make use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die bonding equipment in the assembly process of these components.
“Asia Pacific (APAC) is expected to hold largest share of die bonder equipment market in 2024”
APAC is expected to hold the largest share of the die bonder equipment industry in 2024. More than 60% of OSAT players present across the world have their headquarters in the APAC region. These OSAT companies use die bonding equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs in the region is expected to boost the die bonder equipment market growth in the near future. Similarly, the mass production of electronic products, such as smartphones, wearables, and white goods, in China and Taiwan is also expected to accelerate market growth in APAC.
Breakdown of profiles of primary participants:
This report offers detailed insights into the die bonder equipment market based on type, bonding technique, supply chain participant, device, application, and region. Based on type, the die bonder equipment industry has been segmented into manual, semiautomatic, and fully automatic die bonders. Based on bonding technique, the market has been divided into epoxy, eutectic, soft solder, and other bonding techniques. Based on supply chain participant, the die bonder equipment market has been classified into IDM firms and OSAT companies. Based on device, the market has been divided into optoelectronics, MEMS and MOEMS, and power devices. Based on application, the die bonder equipment market has been classified into consumer electronics, automotive, industrial, telecommunications, healthcare, and aerospace & defense. The market has been studied for Asia Pacific (APAC), the Americas; and Europe, the Middle East, and Africa (EMEA).
Reasons to buy the report
The report is expected to help market leaders/new entrants in this market in the following ways:
1. This report segments the die bonder equipment market comprehensively and provides the closest approximations of the overall size of the market, as well as its segments and subsegments.
2. The report is expected to help stakeholders understand the pulse of the market and provide them with information about key drivers, restraints, challenges, and opportunities.
3. This report aims at helping stakeholders in obtaining an improved understanding of their competitors and gaining insights to enhance their position in the market. The competitive landscape section includes the competitor ecosystem of the market, as well as growth strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions adopted by major market players.
The global die bonder equipment market size is projected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% from 2019 to 2024. Key factors fueling the growth of this market include the growing demand for miniature electronic components and the increasing adoption of stacked die technology in IoT devices.
“Market for fully automatic die bonders is projected to grow at highest CAGR during forecast period”
Among different types, fully automatic die bonders are projected to lead the market from 2019 to 2024. Fully automatic die bonders can work on different modules, such as wire bonding, wedge bonding, flip chip bonding, and die bonding. Fully automatic die bonders are required for the assembly and packaging of the high volume of consumer products. In addition, fully automatic die bonder equipment provide micron-level placement accuracy, ranging from ± 1.5?m to ± 0.5?m, necessary for the fabrication of electronic components used in medical devices, automobile systems, and consumer electronics, which is expected to propel the market growth in the near future.
“Market for eutectic bonding technique is projected to grow at highest CAGR during 2019–2024”
Among bonding techniques, the eutectic bonding technique is projected to witness the highest CAGR in the die bonder equipment market from 2019 to 2024. This technique requires higher operating temperature during the bonding process, and the bond created is not only robust but can also remain intact even in harsh environments. Semiconductor components fabricated using the eutectic bonding technique are suitable for products that are used in automotive, telecommunications, and industrial applications due to their robustness, which is expected to contribute significantly to the growth of the market for the eutectic bonding technique in the near future.
“Consumer electronics application accounted for largest market share in 2018”
Among applications, the consumer electronics segment is projected to lead the die bonder equipment market from 2019 to 2024. The largest market size is due to the high demand for miniaturized consumer electronic products such as smartphones, wearables, and white goods that provide advantages such as compactness and durability. These miniaturized products make use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die bonding equipment in the assembly process of these components.
“Asia Pacific (APAC) is expected to hold largest share of die bonder equipment market in 2024”
APAC is expected to hold the largest share of the die bonder equipment industry in 2024. More than 60% of OSAT players present across the world have their headquarters in the APAC region. These OSAT companies use die bonding equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs in the region is expected to boost the die bonder equipment market growth in the near future. Similarly, the mass production of electronic products, such as smartphones, wearables, and white goods, in China and Taiwan is also expected to accelerate market growth in APAC.
Breakdown of profiles of primary participants:
- By Company: Tier 1 = 45%, Tier 2 = 35%, and Tier 3 = 20%
- By Designation: C-level Executives = 35%, Managers = 43%, and Others (Managers, Scientists, and University Researchers) = 22%
- By Region: APAC = 38%, Americas = 37%, and EMEA = 25%
- BE Semiconductor Industries N.V.
- ASM Pacific Technology Ltd.
- Kulicke & Soffa
- Mycronic AB
- Palomar Technologies, Inc.
- West·Bond, Inc.
- MicroAssembly Technologies, Ltd.
- Finetech GmbH & Co. KG
- Dr. Tresky AG
- Smart Equipment Technology
This report offers detailed insights into the die bonder equipment market based on type, bonding technique, supply chain participant, device, application, and region. Based on type, the die bonder equipment industry has been segmented into manual, semiautomatic, and fully automatic die bonders. Based on bonding technique, the market has been divided into epoxy, eutectic, soft solder, and other bonding techniques. Based on supply chain participant, the die bonder equipment market has been classified into IDM firms and OSAT companies. Based on device, the market has been divided into optoelectronics, MEMS and MOEMS, and power devices. Based on application, the die bonder equipment market has been classified into consumer electronics, automotive, industrial, telecommunications, healthcare, and aerospace & defense. The market has been studied for Asia Pacific (APAC), the Americas; and Europe, the Middle East, and Africa (EMEA).
Reasons to buy the report
The report is expected to help market leaders/new entrants in this market in the following ways:
1. This report segments the die bonder equipment market comprehensively and provides the closest approximations of the overall size of the market, as well as its segments and subsegments.
2. The report is expected to help stakeholders understand the pulse of the market and provide them with information about key drivers, restraints, challenges, and opportunities.
3. This report aims at helping stakeholders in obtaining an improved understanding of their competitors and gaining insights to enhance their position in the market. The competitive landscape section includes the competitor ecosystem of the market, as well as growth strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions adopted by major market players.
1 INTRODUCTION
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION AND SCOPE
1.2.1 INCLUSIONS AND EXCLUSIONS
1.3 SCOPE
1.3.1 MARKETS COVERED
1.3.2 YEARS CONSIDERED
1.4 CURRENCY
1.5 LIMITATIONS
1.6 MARKET STAKEHOLDERS
2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
2.1.1 SECONDARY DATA
2.1.1.1 Secondary sources
2.1.2 PRIMARY DATA
2.1.2.1 Breakdown of primary interviews
2.1.2.2 Key data from primary sources
2.2 MARKET SIZE ESTIMATION
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Approach for capturing market size by bottom-up
analysis (demand side)
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Approach for capturing market share by top-down
analysis (supply side)
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
3 EXECUTIVE SUMMARY
4 PREMIUM INSIGHTS
4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN DIE BONDER EQUIPMENT MARKET
4.2 DIE BONDER EQUIPMENT MARKET, BY COUNTRY
4.3 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
4.4 DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION
5 MARKET OVERVIEW
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
5.2.1 DRIVERS
5.2.1.1 Growing demand for miniature electronic components
5.2.1.2 Increasing adoption of stacked die technology in IoT devices
5.2.2 RESTRAINTS
5.2.2.1 High cost of ownership
5.2.3 OPPORTUNITIES
5.2.3.1 Increasing demand for 3D semiconductor assembly and packaging
5.2.4 CHALLENGES
5.2.4.1 Mechanical unbalance of moving parts
5.3 VALUE CHAIN ANALYSIS
5.3.1 DIE BONDER EQUIPMENT VALUE CHAIN
6 DIE BONDER EQUIPMENT MARKET, BY TYPE
6.1 INTRODUCTION
6.2 MANUAL DIE BONDERS
6.2.1 MANUAL DIE BONDERS PLAY SIGNIFICANT ROLE IN R&D, TESTING, AND PROTOTYPING APPLICATIONS
6.3 SEMIAUTOMATIC DIE BONDERS
6.3.1 SEMIAUTOMATIC DIE BONDERS ARE EASY TO USE AND FLEXIBLE
6.4 FULLY AUTOMATIC DIE BONDERS
6.4.1 FULLY AUTOMATIC DIE BONDERS TO CONTINUE TO REGISTER HIGHEST CAGR AND LARGEST MARKET SIZE DURING 2019–2024
7 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
7.1 INTRODUCTION
7.2 EPOXY
7.2.1 EPOXY BONDING TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DUE TO LOW COST AND LOW CURING TEMPERATURE
7.3 EUTECTIC
7.3.1 DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
7.4 SOFT SOLDER
7.4.1 SOFT SOLDER BOIDNG PLAYS SIGNIFICANT ROLE IN FABRICATION OF POWER DEVICES
7.5 OTHERS
7.5.1 ASSEMBLY OF TEMPERATURE-RESTRICTED PRODUCTS FUEL GROWTH OF MARKET FOR OTHER BONDING TECHNIQUES
8 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
8.1 INTRODUCTION
8.2 OSAT COMPANIES
8.2.1 OSAT COMPANIES TO PLAY SIGNIFICANT ROLE OWING TO CHALLENGES FACED BY FOUNDRIES RELATED TO ASSEMBLY AND PACKAGING
8.3 IDM FIRMS
8.3.1 IDM FIRMS TO CONTINUE TO LEAD DIE BONDER EQUIPMENT MARKET OWING TO THEIR ABILITY TO PROGRESS RAPIDLY WITH INNOVATIVE TECHNOLOGIES DURING FORECAST PERIOD
9 DIE BONDER EQUIPMENT MARKET, BY DEVICE
9.1 INTRODUCTION
9.2 OPTOELECTRONICS
9.2.1 OPTOELECTRONICS TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
9.3 MEMS AND MOEMS
9.3.1 AUTOMOTIVE, CONSUMER ELECTRONICS, HEALTHCARE, AND TELECOMMUNICATIONS SECTORS CONTRIBUTE MOST TO HIGHEST CAGR OF MEMS AND MOEMS DEVICES IN COMING YEARS
9.4 POWER DEVICES
9.4.1 DIE ATTACH PACKAGING METHODOLOGY ENABLES POWER DEVICES TO WITHSTAND EXTREME OPERATING CONDITIONS
10 DIE BONDER EQUIPMENT MARKET, BY APPLICATION
10.1 INTRODUCTION
10.2 CONSUMER ELECTRONICS
10.2.1 INCREASING ADOPTION OF MINIATURIZED AND LIGHTWEIGHT ELECTRONIC PRODUCTS ACCELERATES DEMAND FOR DIE BONDERS
10.3 AUTOMOTIVE
10.3.1 RISING USE OF MEMS TO ENSURE IMPROVED PASSENGER SAFETY WOULD SPUR DEMAND FOR DIE BONDERS IN AUTOMOTIVE APPLICATIONS
10.4 INDUSTRIAL
10.4.1 GROWING IMPLEMENTATION OF INDUSTRIAL IOT TO DRIVE GROWTH OF DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS
10.5 TELECOMMUNICATIONS
10.5.1 RISING DEPLOYMENT OF 5G NETWORK INFRASTRUCTURE CONTRIBUTING TO GROWTH OF DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS
10.6 HEALTHCARE
10.6.1 SURGING DEMAND FOR NANO-SIZED AND LIGHTWEIGHT HEALTHCARE GADGETS AUGMENTS ADOPTION OF DIE BONDERS IN HEALTHCARE APPLICATIONS
10.7 AEROSPACE & DEFENSE
10.7.1 INCREASING DEMAND FOR ROBUST COMPONENTS BOOSTING DIE BONDER MARKET GROWTH FOR AEROSPACE & DEFENSE APPLICATIONS
11 GEOGRAPHIC ANALYSIS
11.1 INTRODUCTION
11.2 APAC
11.2.1 TAIWAN
11.2.1.1 Presence of many key OSAT companies drives market growth in Taiwan
11.2.2 CHINA
11.2.2.1 Growing trend of miniaturization in consumer electronic products spurs growth of market in China
11.2.3 JAPAN
11.2.3.1 Increasing demand for passenger cars and commercial vehicles and expanding presence of market players in country fuels growth of die bonder equipment market in Japan
11.2.4 SOUTH KOREA
11.2.4.1 South Korea to continue to account for largest size of market in APAC during 2019–2024
11.2.5 REST OF APAC
11.2.5.1 Strong presence of die bonder equipment manufactures accelerates market growth in Rest of APAC
11.3 AMERICAS
11.3.1 US
11.3.1.1 US to continue to lead die bonder equipment market in Americas during 2019–2024
11.3.2 CANADA
11.3.2.1 Government initiatives toward developing electric vehicle infrastructure to create growth opportunities for die bonder equipment market in near future
11.3.3 REST OF AMERICAS
11.3.3.1 Increasing demand for IoT and 5G surging demand for die bonding equipment in Rest of Americas
11.4 EMEA
11.4.1 GERMANY
11.4.1.1 Adoption of smart homes and connected cars to spur demand in Germany
11.4.2 UK
11.4.2.1 Deployment of 5G infrastructure fueling market growth in UK
11.4.3 ISRAEL
11.4.3.1 Presence of fabrication plants of IDM companies including Intel and Tower Jazz to boost market growth in Israel
11.4.4 FRANCE
11.4.4.1 Developed communication network has prompted market growth in France
11.4.5 REST OF EMEA
11.4.5.1 Initiatives of die bonder equipment manufacturers to propel market growth in Rest of EMEA
12 COMPETITIVE LANDSCAPE
12.1 INTRODUCTION
12.2 MARKET RANKING ANALYSIS, 2018
12.3 COMPETITIVE SCENARIO
12.3.1 PRODUCT LAUNCHES
12.3.2 PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS
12.3.3 ACQUISITIONS
12.3.4 EXPANSIONS
12.4 COMPETITIVE LEADERSHIP MAPPING
12.4.1 VISIONARY LEADERS
12.4.2 DYNAMIC DIFFERENTIATORS
12.4.3 INNOVATORS
12.4.4 EMERGING COMPANIES
12.5 STRENGTH OF PRODUCT PORTFOLIO
12.6 BUSINESS STRATEGY EXCELLENCE
13 COMPANY PROFILES
13.1 KEY PLAYERS
(Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view)*
13.1.1 BE SEMICONDUCTOR INDUSTRIES N.V.
13.1.2 ASM PACIFIC TECHNOLOGY LTD.
13.1.3 KULICKE & SOFFA
13.1.4 MYCRONIC AB
13.1.5 PALOMAR TECHNOLOGIES, INC.
13.1.6 WEST·BOND, INC.
13.1.7 MICROASSEMBLY TECHNOLOGIES, LTD.
13.1.8 FINETECH GMBH & CO. KG
13.1.9 DR. TRESKY AG
13.1.10 SMART EQUIPMENT TECHNOLOGY
13.2 RIGHT TO WIN
13.3 OTHER KEY PLAYERS
13.3.1 HYBOND, INC.
13.3.2 SHIBUYA CORPORATION
13.3.3 ANZA TECHNOLOGY, INC.
13.3.4 PAROTEQ GMBH
13.3.5 TRESKY GMBH
13.3.6 DIAS AUTOMATION (HK) LTD
13.3.7 SHINKAWA LTD.
13.3.8 FOUR TECHNOS CO., LTD.
13.3.9 FASFORD TECHNOLOGY CO., LTD.
13.3.10 UNITEMP GMBH
13.3.11 TPT WIRE BONDER GMBH & CO. KG
*Details on Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view might not be captured in case of unlisted companies.
14 APPENDIX
14.1 DISCUSSION GUIDE
14.2 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
14.3 AVAILABLE CUSTOMIZATIONS
14.4 RELATED REPORTS
14.5 AUTHOR DETAILS
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION AND SCOPE
1.2.1 INCLUSIONS AND EXCLUSIONS
1.3 SCOPE
1.3.1 MARKETS COVERED
1.3.2 YEARS CONSIDERED
1.4 CURRENCY
1.5 LIMITATIONS
1.6 MARKET STAKEHOLDERS
2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
2.1.1 SECONDARY DATA
2.1.1.1 Secondary sources
2.1.2 PRIMARY DATA
2.1.2.1 Breakdown of primary interviews
2.1.2.2 Key data from primary sources
2.2 MARKET SIZE ESTIMATION
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Approach for capturing market size by bottom-up
analysis (demand side)
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Approach for capturing market share by top-down
analysis (supply side)
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
3 EXECUTIVE SUMMARY
4 PREMIUM INSIGHTS
4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN DIE BONDER EQUIPMENT MARKET
4.2 DIE BONDER EQUIPMENT MARKET, BY COUNTRY
4.3 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
4.4 DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION
5 MARKET OVERVIEW
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
5.2.1 DRIVERS
5.2.1.1 Growing demand for miniature electronic components
5.2.1.2 Increasing adoption of stacked die technology in IoT devices
5.2.2 RESTRAINTS
5.2.2.1 High cost of ownership
5.2.3 OPPORTUNITIES
5.2.3.1 Increasing demand for 3D semiconductor assembly and packaging
5.2.4 CHALLENGES
5.2.4.1 Mechanical unbalance of moving parts
5.3 VALUE CHAIN ANALYSIS
5.3.1 DIE BONDER EQUIPMENT VALUE CHAIN
6 DIE BONDER EQUIPMENT MARKET, BY TYPE
6.1 INTRODUCTION
6.2 MANUAL DIE BONDERS
6.2.1 MANUAL DIE BONDERS PLAY SIGNIFICANT ROLE IN R&D, TESTING, AND PROTOTYPING APPLICATIONS
6.3 SEMIAUTOMATIC DIE BONDERS
6.3.1 SEMIAUTOMATIC DIE BONDERS ARE EASY TO USE AND FLEXIBLE
6.4 FULLY AUTOMATIC DIE BONDERS
6.4.1 FULLY AUTOMATIC DIE BONDERS TO CONTINUE TO REGISTER HIGHEST CAGR AND LARGEST MARKET SIZE DURING 2019–2024
7 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
7.1 INTRODUCTION
7.2 EPOXY
7.2.1 EPOXY BONDING TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DUE TO LOW COST AND LOW CURING TEMPERATURE
7.3 EUTECTIC
7.3.1 DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
7.4 SOFT SOLDER
7.4.1 SOFT SOLDER BOIDNG PLAYS SIGNIFICANT ROLE IN FABRICATION OF POWER DEVICES
7.5 OTHERS
7.5.1 ASSEMBLY OF TEMPERATURE-RESTRICTED PRODUCTS FUEL GROWTH OF MARKET FOR OTHER BONDING TECHNIQUES
8 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
8.1 INTRODUCTION
8.2 OSAT COMPANIES
8.2.1 OSAT COMPANIES TO PLAY SIGNIFICANT ROLE OWING TO CHALLENGES FACED BY FOUNDRIES RELATED TO ASSEMBLY AND PACKAGING
8.3 IDM FIRMS
8.3.1 IDM FIRMS TO CONTINUE TO LEAD DIE BONDER EQUIPMENT MARKET OWING TO THEIR ABILITY TO PROGRESS RAPIDLY WITH INNOVATIVE TECHNOLOGIES DURING FORECAST PERIOD
9 DIE BONDER EQUIPMENT MARKET, BY DEVICE
9.1 INTRODUCTION
9.2 OPTOELECTRONICS
9.2.1 OPTOELECTRONICS TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
9.3 MEMS AND MOEMS
9.3.1 AUTOMOTIVE, CONSUMER ELECTRONICS, HEALTHCARE, AND TELECOMMUNICATIONS SECTORS CONTRIBUTE MOST TO HIGHEST CAGR OF MEMS AND MOEMS DEVICES IN COMING YEARS
9.4 POWER DEVICES
9.4.1 DIE ATTACH PACKAGING METHODOLOGY ENABLES POWER DEVICES TO WITHSTAND EXTREME OPERATING CONDITIONS
10 DIE BONDER EQUIPMENT MARKET, BY APPLICATION
10.1 INTRODUCTION
10.2 CONSUMER ELECTRONICS
10.2.1 INCREASING ADOPTION OF MINIATURIZED AND LIGHTWEIGHT ELECTRONIC PRODUCTS ACCELERATES DEMAND FOR DIE BONDERS
10.3 AUTOMOTIVE
10.3.1 RISING USE OF MEMS TO ENSURE IMPROVED PASSENGER SAFETY WOULD SPUR DEMAND FOR DIE BONDERS IN AUTOMOTIVE APPLICATIONS
10.4 INDUSTRIAL
10.4.1 GROWING IMPLEMENTATION OF INDUSTRIAL IOT TO DRIVE GROWTH OF DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS
10.5 TELECOMMUNICATIONS
10.5.1 RISING DEPLOYMENT OF 5G NETWORK INFRASTRUCTURE CONTRIBUTING TO GROWTH OF DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS
10.6 HEALTHCARE
10.6.1 SURGING DEMAND FOR NANO-SIZED AND LIGHTWEIGHT HEALTHCARE GADGETS AUGMENTS ADOPTION OF DIE BONDERS IN HEALTHCARE APPLICATIONS
10.7 AEROSPACE & DEFENSE
10.7.1 INCREASING DEMAND FOR ROBUST COMPONENTS BOOSTING DIE BONDER MARKET GROWTH FOR AEROSPACE & DEFENSE APPLICATIONS
11 GEOGRAPHIC ANALYSIS
11.1 INTRODUCTION
11.2 APAC
11.2.1 TAIWAN
11.2.1.1 Presence of many key OSAT companies drives market growth in Taiwan
11.2.2 CHINA
11.2.2.1 Growing trend of miniaturization in consumer electronic products spurs growth of market in China
11.2.3 JAPAN
11.2.3.1 Increasing demand for passenger cars and commercial vehicles and expanding presence of market players in country fuels growth of die bonder equipment market in Japan
11.2.4 SOUTH KOREA
11.2.4.1 South Korea to continue to account for largest size of market in APAC during 2019–2024
11.2.5 REST OF APAC
11.2.5.1 Strong presence of die bonder equipment manufactures accelerates market growth in Rest of APAC
11.3 AMERICAS
11.3.1 US
11.3.1.1 US to continue to lead die bonder equipment market in Americas during 2019–2024
11.3.2 CANADA
11.3.2.1 Government initiatives toward developing electric vehicle infrastructure to create growth opportunities for die bonder equipment market in near future
11.3.3 REST OF AMERICAS
11.3.3.1 Increasing demand for IoT and 5G surging demand for die bonding equipment in Rest of Americas
11.4 EMEA
11.4.1 GERMANY
11.4.1.1 Adoption of smart homes and connected cars to spur demand in Germany
11.4.2 UK
11.4.2.1 Deployment of 5G infrastructure fueling market growth in UK
11.4.3 ISRAEL
11.4.3.1 Presence of fabrication plants of IDM companies including Intel and Tower Jazz to boost market growth in Israel
11.4.4 FRANCE
11.4.4.1 Developed communication network has prompted market growth in France
11.4.5 REST OF EMEA
11.4.5.1 Initiatives of die bonder equipment manufacturers to propel market growth in Rest of EMEA
12 COMPETITIVE LANDSCAPE
12.1 INTRODUCTION
12.2 MARKET RANKING ANALYSIS, 2018
12.3 COMPETITIVE SCENARIO
12.3.1 PRODUCT LAUNCHES
12.3.2 PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS
12.3.3 ACQUISITIONS
12.3.4 EXPANSIONS
12.4 COMPETITIVE LEADERSHIP MAPPING
12.4.1 VISIONARY LEADERS
12.4.2 DYNAMIC DIFFERENTIATORS
12.4.3 INNOVATORS
12.4.4 EMERGING COMPANIES
12.5 STRENGTH OF PRODUCT PORTFOLIO
12.6 BUSINESS STRATEGY EXCELLENCE
13 COMPANY PROFILES
13.1 KEY PLAYERS
(Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view)*
13.1.1 BE SEMICONDUCTOR INDUSTRIES N.V.
13.1.2 ASM PACIFIC TECHNOLOGY LTD.
13.1.3 KULICKE & SOFFA
13.1.4 MYCRONIC AB
13.1.5 PALOMAR TECHNOLOGIES, INC.
13.1.6 WEST·BOND, INC.
13.1.7 MICROASSEMBLY TECHNOLOGIES, LTD.
13.1.8 FINETECH GMBH & CO. KG
13.1.9 DR. TRESKY AG
13.1.10 SMART EQUIPMENT TECHNOLOGY
13.2 RIGHT TO WIN
13.3 OTHER KEY PLAYERS
13.3.1 HYBOND, INC.
13.3.2 SHIBUYA CORPORATION
13.3.3 ANZA TECHNOLOGY, INC.
13.3.4 PAROTEQ GMBH
13.3.5 TRESKY GMBH
13.3.6 DIAS AUTOMATION (HK) LTD
13.3.7 SHINKAWA LTD.
13.3.8 FOUR TECHNOS CO., LTD.
13.3.9 FASFORD TECHNOLOGY CO., LTD.
13.3.10 UNITEMP GMBH
13.3.11 TPT WIRE BONDER GMBH & CO. KG
*Details on Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view might not be captured in case of unlisted companies.
14 APPENDIX
14.1 DISCUSSION GUIDE
14.2 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
14.3 AVAILABLE CUSTOMIZATIONS
14.4 RELATED REPORTS
14.5 AUTHOR DETAILS
LIST OF TABLES
TABLE 1 DIE BONDER EQUIPMENT MARKET, BY TYPE, 2016–2024 (USD MILLION)
TABLE 2 MANUAL DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 3 MANUAL DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 4 MANUAL DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 5 MANUAL DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 6 MANUAL DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 7 MANUAL DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 8 MANUAL DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 9 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 10 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 11 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 12 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 13 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 14 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 15 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 16 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 17 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 18 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 19 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 20 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 21 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 22 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 23 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 24 DIE BONDER EQUIPMENT MARKET FOR EPOXY BONDING TECHNIQUE, BY TYPE, 2016–2024 (USD MILLION)
TABLE 25 DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE, BY TYPE, 2016–2024 (USD MILLION)
TABLE 26 DIE BONDER EQUIPMENT MARKET FOR SOFT SOLDER BONDING TECHNIQUE, BY TYPE, 2016–2024 (USD MILLION)
TABLE 27 DIE BONDER EQUIPMENT MARKET FOR OTHER BONDING TECHNIQUES, BY TYPE, 2016–2024 (USD MILLION)
TABLE 28 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 29 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY TYPE, 2016–2024 (USD MILLION)
TABLE 30 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 31 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN OSAT COMPANIES, BY REGION, 2016–2024 (USD MILLION)
TABLE 32 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN OSAT COMPANIES, BY REGION, 2016–2024 (USD MILLION)
TABLE 33 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN OSAT COMPANIES, BY REGION, 2016–2024 (USD THOUSAND)
TABLE 34 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY REGION, 2016–2024 (USD MILLION)
TABLE 35 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 36 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 37 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 38 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN IDM FIRMS, BY REGION, 2016–2024 (USD THOUSAND)
TABLE 39 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN IDM FIRMS, BY REGION, 2016–2024 (USD MILLION)
TABLE 40 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN IDM FIRMS, BY REGION, 2016–2024 (USD MILLION)
TABLE 41 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY REGION, 2016–2024 (USD MILLION)
TABLE 42 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY APPLICATION, 2016–2024 (USD THOUSAND)
TABLE 43 DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 44 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 45 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 46 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 47 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY REGION, 2016–2024 (USD MILLION)
TABLE 48 DIE BONDER EQUIPMENT MARKET IN APAC FOR OPTOELECTRONICS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 49 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR OPTOELECTRONICS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 50 DIE BONDER EQUIPMENT MARKET IN EMEA FOR OPTOELECTRONICS, BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 51 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 52 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 53 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 54 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY REGION, 2016–2024 (USD MILLION)
TABLE 55 DIE BONDER EQUIPMENT MARKET IN APAC FOR MEMS AND MOEMS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 56 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR MEMS AND MOEMS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 57 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN EMEA, BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 58 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY TYPE, 2016–2024 (USD MILLION)
TABLE 59 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 60 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 61 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY REGION, 2016–2024 (USD MILLION)
TABLE 62 DIE BONDER EQUIPMENT MARKET IN APAC FOR POWER DEVICES, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 63 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR POWER DEVICES, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 64 DIE BONDER EQUIPMENT MARKET IN EMEA FOR POWER DEVICES, BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 65 DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 66 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 67 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 68 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 69 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 70 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 71 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 72 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 73 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 74 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 75 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 76 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 77 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 78 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 79 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 80 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 81 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 82 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD THOUSAND)
TABLE 83 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 84 DIE BONDER EQUIPMENT MARKET, BY REGION, 2016–2024 (USD MILLION)
TABLE 85 DIE BONDER EQUIPMENT MARKET IN APAC, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 86 DIE BONDER EQUIPMENT MARKET IN APAC, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 87 DIE BONDER EQUIPMENT MARKET IN APAC, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 88 DIE BONDER EQUIPMENT MARKET IN TAIWAN, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 89 DIE BONDER EQUIPMENT MARKET IN CHINA, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 90 DIE BONDER EQUIPMENT MARKET IN JAPAN, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 91 DIE BONDER EQUIPMENT MARKET IN SOUTH KOREA, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 92 DIE BONDER EQUIPMENT MARKET IN REST OF APAC, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 93 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 94 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 95 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 96 DIE BONDER EQUIPMENT MARKET IN US, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 97 DIE BONDER EQUIPMENT MARKET IN CANADA, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 98 DIE BONDER EQUIPMENT MARKET IN REST OF AMERICAS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 99 DIE BONDER EQUIPMENT MARKET IN EMEA, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 100 DIE BONDER EQUIPMENT MARKET IN EMEA, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 101 DIE BONDER EQUIPMENT MARKET IN EMEA, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 102 DIE BONDER EQUIPMENT MARKET IN GERMANY, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 103 DIE BONDER EQUIPMENT MARKET IN UK, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 104 DIE BONDER EQUIPMENT MARKET IN ISRAEL, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 105 DIE BONDER EQUIPMENT MARKET IN FRANCE, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 106 DIE BONDER EQUIPMENT MARKET IN REST OF EMEA, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 107 PRODUCT LAUNCHES, 2017–2019
TABLE 108 PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS, 2017–2019
TABLE 109 ACQUISITIONS, 2018
TABLE 110 EXPANSIONS, 2017–2019
TABLE 1 DIE BONDER EQUIPMENT MARKET, BY TYPE, 2016–2024 (USD MILLION)
TABLE 2 MANUAL DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 3 MANUAL DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 4 MANUAL DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 5 MANUAL DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 6 MANUAL DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 7 MANUAL DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 8 MANUAL DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 9 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 10 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 11 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 12 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 13 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 14 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 15 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 16 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 17 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 18 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 19 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 20 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 21 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 22 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 23 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 24 DIE BONDER EQUIPMENT MARKET FOR EPOXY BONDING TECHNIQUE, BY TYPE, 2016–2024 (USD MILLION)
TABLE 25 DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE, BY TYPE, 2016–2024 (USD MILLION)
TABLE 26 DIE BONDER EQUIPMENT MARKET FOR SOFT SOLDER BONDING TECHNIQUE, BY TYPE, 2016–2024 (USD MILLION)
TABLE 27 DIE BONDER EQUIPMENT MARKET FOR OTHER BONDING TECHNIQUES, BY TYPE, 2016–2024 (USD MILLION)
TABLE 28 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 29 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY TYPE, 2016–2024 (USD MILLION)
TABLE 30 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 31 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN OSAT COMPANIES, BY REGION, 2016–2024 (USD MILLION)
TABLE 32 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN OSAT COMPANIES, BY REGION, 2016–2024 (USD MILLION)
TABLE 33 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN OSAT COMPANIES, BY REGION, 2016–2024 (USD THOUSAND)
TABLE 34 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY REGION, 2016–2024 (USD MILLION)
TABLE 35 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 36 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 37 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 38 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN IDM FIRMS, BY REGION, 2016–2024 (USD THOUSAND)
TABLE 39 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN IDM FIRMS, BY REGION, 2016–2024 (USD MILLION)
TABLE 40 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN IDM FIRMS, BY REGION, 2016–2024 (USD MILLION)
TABLE 41 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY REGION, 2016–2024 (USD MILLION)
TABLE 42 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY APPLICATION, 2016–2024 (USD THOUSAND)
TABLE 43 DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 44 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 45 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 46 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 47 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY REGION, 2016–2024 (USD MILLION)
TABLE 48 DIE BONDER EQUIPMENT MARKET IN APAC FOR OPTOELECTRONICS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 49 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR OPTOELECTRONICS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 50 DIE BONDER EQUIPMENT MARKET IN EMEA FOR OPTOELECTRONICS, BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 51 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 52 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 53 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 54 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY REGION, 2016–2024 (USD MILLION)
TABLE 55 DIE BONDER EQUIPMENT MARKET IN APAC FOR MEMS AND MOEMS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 56 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR MEMS AND MOEMS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 57 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN EMEA, BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 58 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY TYPE, 2016–2024 (USD MILLION)
TABLE 59 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 60 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 61 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY REGION, 2016–2024 (USD MILLION)
TABLE 62 DIE BONDER EQUIPMENT MARKET IN APAC FOR POWER DEVICES, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 63 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR POWER DEVICES, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 64 DIE BONDER EQUIPMENT MARKET IN EMEA FOR POWER DEVICES, BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 65 DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 66 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 67 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 68 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 69 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 70 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 71 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 72 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 73 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 74 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 75 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 76 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 77 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 78 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 79 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 80 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 81 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 82 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD THOUSAND)
TABLE 83 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 84 DIE BONDER EQUIPMENT MARKET, BY REGION, 2016–2024 (USD MILLION)
TABLE 85 DIE BONDER EQUIPMENT MARKET IN APAC, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 86 DIE BONDER EQUIPMENT MARKET IN APAC, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 87 DIE BONDER EQUIPMENT MARKET IN APAC, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 88 DIE BONDER EQUIPMENT MARKET IN TAIWAN, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 89 DIE BONDER EQUIPMENT MARKET IN CHINA, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 90 DIE BONDER EQUIPMENT MARKET IN JAPAN, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 91 DIE BONDER EQUIPMENT MARKET IN SOUTH KOREA, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 92 DIE BONDER EQUIPMENT MARKET IN REST OF APAC, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 93 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 94 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 95 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 96 DIE BONDER EQUIPMENT MARKET IN US, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 97 DIE BONDER EQUIPMENT MARKET IN CANADA, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 98 DIE BONDER EQUIPMENT MARKET IN REST OF AMERICAS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 99 DIE BONDER EQUIPMENT MARKET IN EMEA, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 100 DIE BONDER EQUIPMENT MARKET IN EMEA, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 101 DIE BONDER EQUIPMENT MARKET IN EMEA, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 102 DIE BONDER EQUIPMENT MARKET IN GERMANY, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 103 DIE BONDER EQUIPMENT MARKET IN UK, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 104 DIE BONDER EQUIPMENT MARKET IN ISRAEL, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 105 DIE BONDER EQUIPMENT MARKET IN FRANCE, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 106 DIE BONDER EQUIPMENT MARKET IN REST OF EMEA, BY DEVICE, 2016–2024 (USD THOUSAND)
TABLE 107 PRODUCT LAUNCHES, 2017–2019
TABLE 108 PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS, 2017–2019
TABLE 109 ACQUISITIONS, 2018
TABLE 110 EXPANSIONS, 2017–2019
LIST OF FIGURES
FIGURE 1 DIE BONDER EQUIPMENT MARKET: RESEARCH DESIGN
FIGURE 2 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 1 (SUPPLY SIDE): REVENUE GENERATED FROM PRODUCTS IN DIE BONDER EQUIPMENT MARKET
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 BOTTOM-UP
(SUPPLY SIDE): ILLUSTRATIVE EXAMPLE OF COMPANY IN DIE BONDER EQUIPMENT MARKET
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 – BOTTOM-UP (DEMAND SIDE): SUPPLY CHAIN PARTICIPANTS COVERED UNDER DIE BONDER EQUIPMENT MARKET
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3 – BOTTOM-UP MARKET ESTIMATION FOR DIE BONDER EQUIPMENT, BY TYPE
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
FIGURE 7 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
FIGURE 8 DATA TRIANGULATION
FIGURE 9 RESEARCH STUDY ASSUMPTIONS
FIGURE 10 MARKET FOR FULLY AUTOMATIC DIE BONDER EQUIPMENT TO GROW AT HIGHEST CAGR DURING 2019–2024
FIGURE 11 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS TO GROW AT HIGHER CAGR DURING 2019–2024
FIGURE 12 AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET DURING 2019–2024
FIGURE 13 APAC TO BE FASTEST-GROWING REGION IN DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 14 INCREASING DEMAND FOR MINIATURIZED ELECTRONIC DEVICES TO SPUR DIE BONDER EQUIPMENT MARKET GROWTH DURING FORECAST PERIOD
FIGURE 15 CHINA TO RECORD HIGHEST CAGR IN OVERALL DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 16 EPOXY BONDING TECHNIQUE TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET TILL 2024
FIGURE 17 CONSUMER ELECTRONICS AND APAC LIKELY TO BE LARGEST SHAREHOLDERS IN OVERALL DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION, RESPECTIVELY, IN 2024
FIGURE 18 GROWING DEMAND OF MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE DIE BONDER EQUIPMENT MARKET
FIGURE 19 DIE BONDER EQUIPMENT MARKET DRIVERS AND THEIR IMPACT
FIGURE 20 DIE BONDER EQUIPMENT MARKET RESTRAINTS AND THEIR IMPACT
FIGURE 21 DIE BONDER EQUIPMENT MARKET OPPORTUNITIES AND THEIR IMPACT
FIGURE 22 DIE BONDER EQUIPMENT MARKET CHALLENGES AND THEIR IMPACT
FIGURE 23 DIE BONDER EQUIPMENT ECOSYSTEM: MAJOR VALUE IS ADDED BY PRODUCT MANUFACTURERS
FIGURE 24 DIE BONDER EQUIPMENT MARKET, BY TYPE
FIGURE 25 MARKET FOR FULLY AUTOMATIC DIE BONDERS TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 26 MANUAL DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 27 IDM FIRMS TO EXHIBIT HIGHER CAGR IN SEMIAUTOMATIC DIE BONDING EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 28 FULLY DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 29 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
FIGURE 30 MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 31 FULLY AUTOMATIC SOFT SOLDER DIE BONDERS TO DOMINATE MARKET DURING FORECAST PERIOD
FIGURE 32 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
FIGURE 33 IDM FIRMS TO COMMAND DIE BONDER EQUIPMENT MARKET
DURING 2019–2024
FIGURE 34 APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES DURING FORECAST PERIOD
FIGURE 35 AUTOMOTIVE APPLICATION TO RECORD HIGHEST CAGR IN DIE BONDER MARKET FOR IDM FIRMS DURING FORECAST PERIOD
FIGURE 36 DIE BONDER EQUIPMENT MAREKT, BY DEVICE
FIGURE 37 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 38 APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS DURING FORECAST PERIOD
FIGURE 39 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 40 GERMANY TO DOMINATE DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DURING FORECAST PERIOD
FIGURE 41 AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES DURING FORECAST PERIOD
FIGURE 42 DIE BONDER EQUIPMENT MAREKT, BY APPLICATION
FIGURE 43 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 44 FULLY AUTOMATIC DIE BONDERS TO DOMINATE MARKET FOR AUTOMOTIVE APPLICATIONS DURING FORECAST PERIOD
FIGURE 45 MEMS AND MOEMS DEVICES TO EXHIBIT HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS DURING FORECAST PERIOD
FIGURE 46 IDM FIRMS TO LEAD DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS DURING FORECAST PERIOD
FIGURE 47 DIE BONDER EQUIPMENT IN APAC TO GROW AT HIGHEST CARG DURING
FORECAST PERIOD
FIGURE 48 APAC: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 49 MEMS AND MOEMS DEVICES TO RECORD HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN JAPAN DURING FORECAST PERIOD
FIGURE 50 AMERICAS: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 51 DIE BONDER EQUIPMENT MARKET IN CANADA FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CARG DURING FORECAST PERIOD
FIGURE 52 EMEA: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 53 GERMANY TO REGISTER HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN EMEA DURING FORECAST PERIOD
FIGURE 54 MEMES AND MOEMS DEVICES TO EXHIBIT HIGHEST CARG IN FRENCH DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 55 COMPANIES ADOPTED PRODUCT LAUNCHES AS KEY GROWTH STRATEGIES
FROM 2017 TO 2019
FIGURE 56 RANKING OF TOP 5 PLAYERS IN DIE BONDER EQUIPMENT MARKET
FIGURE 57 DIE BONDER EQUIPMENT MARKET (GLOBAL) COMPETITIVE LEADERSHIP
MAPPING, 2018
FIGURE 58 BE SEMICONDUCTOR INDUSTRIES N.V.: COMPANY SNAPSHOT
FIGURE 59 ASM PACIFIC TECHNOLOGY LTD: COMPANY SNAPSHOT
FIGURE 60 KULICKE & SOFFA: COMPANY SNAPSHOT
FIGURE 61 MYCRONIC AB: COMPANY SNAPSHOT
FIGURE 1 DIE BONDER EQUIPMENT MARKET: RESEARCH DESIGN
FIGURE 2 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 1 (SUPPLY SIDE): REVENUE GENERATED FROM PRODUCTS IN DIE BONDER EQUIPMENT MARKET
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 BOTTOM-UP
(SUPPLY SIDE): ILLUSTRATIVE EXAMPLE OF COMPANY IN DIE BONDER EQUIPMENT MARKET
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 – BOTTOM-UP (DEMAND SIDE): SUPPLY CHAIN PARTICIPANTS COVERED UNDER DIE BONDER EQUIPMENT MARKET
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3 – BOTTOM-UP MARKET ESTIMATION FOR DIE BONDER EQUIPMENT, BY TYPE
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
FIGURE 7 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
FIGURE 8 DATA TRIANGULATION
FIGURE 9 RESEARCH STUDY ASSUMPTIONS
FIGURE 10 MARKET FOR FULLY AUTOMATIC DIE BONDER EQUIPMENT TO GROW AT HIGHEST CAGR DURING 2019–2024
FIGURE 11 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS TO GROW AT HIGHER CAGR DURING 2019–2024
FIGURE 12 AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET DURING 2019–2024
FIGURE 13 APAC TO BE FASTEST-GROWING REGION IN DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 14 INCREASING DEMAND FOR MINIATURIZED ELECTRONIC DEVICES TO SPUR DIE BONDER EQUIPMENT MARKET GROWTH DURING FORECAST PERIOD
FIGURE 15 CHINA TO RECORD HIGHEST CAGR IN OVERALL DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 16 EPOXY BONDING TECHNIQUE TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET TILL 2024
FIGURE 17 CONSUMER ELECTRONICS AND APAC LIKELY TO BE LARGEST SHAREHOLDERS IN OVERALL DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION, RESPECTIVELY, IN 2024
FIGURE 18 GROWING DEMAND OF MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE DIE BONDER EQUIPMENT MARKET
FIGURE 19 DIE BONDER EQUIPMENT MARKET DRIVERS AND THEIR IMPACT
FIGURE 20 DIE BONDER EQUIPMENT MARKET RESTRAINTS AND THEIR IMPACT
FIGURE 21 DIE BONDER EQUIPMENT MARKET OPPORTUNITIES AND THEIR IMPACT
FIGURE 22 DIE BONDER EQUIPMENT MARKET CHALLENGES AND THEIR IMPACT
FIGURE 23 DIE BONDER EQUIPMENT ECOSYSTEM: MAJOR VALUE IS ADDED BY PRODUCT MANUFACTURERS
FIGURE 24 DIE BONDER EQUIPMENT MARKET, BY TYPE
FIGURE 25 MARKET FOR FULLY AUTOMATIC DIE BONDERS TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 26 MANUAL DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 27 IDM FIRMS TO EXHIBIT HIGHER CAGR IN SEMIAUTOMATIC DIE BONDING EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 28 FULLY DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 29 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
FIGURE 30 MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 31 FULLY AUTOMATIC SOFT SOLDER DIE BONDERS TO DOMINATE MARKET DURING FORECAST PERIOD
FIGURE 32 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
FIGURE 33 IDM FIRMS TO COMMAND DIE BONDER EQUIPMENT MARKET
DURING 2019–2024
FIGURE 34 APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES DURING FORECAST PERIOD
FIGURE 35 AUTOMOTIVE APPLICATION TO RECORD HIGHEST CAGR IN DIE BONDER MARKET FOR IDM FIRMS DURING FORECAST PERIOD
FIGURE 36 DIE BONDER EQUIPMENT MAREKT, BY DEVICE
FIGURE 37 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 38 APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS DURING FORECAST PERIOD
FIGURE 39 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 40 GERMANY TO DOMINATE DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DURING FORECAST PERIOD
FIGURE 41 AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES DURING FORECAST PERIOD
FIGURE 42 DIE BONDER EQUIPMENT MAREKT, BY APPLICATION
FIGURE 43 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 44 FULLY AUTOMATIC DIE BONDERS TO DOMINATE MARKET FOR AUTOMOTIVE APPLICATIONS DURING FORECAST PERIOD
FIGURE 45 MEMS AND MOEMS DEVICES TO EXHIBIT HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS DURING FORECAST PERIOD
FIGURE 46 IDM FIRMS TO LEAD DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS DURING FORECAST PERIOD
FIGURE 47 DIE BONDER EQUIPMENT IN APAC TO GROW AT HIGHEST CARG DURING
FORECAST PERIOD
FIGURE 48 APAC: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 49 MEMS AND MOEMS DEVICES TO RECORD HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN JAPAN DURING FORECAST PERIOD
FIGURE 50 AMERICAS: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 51 DIE BONDER EQUIPMENT MARKET IN CANADA FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CARG DURING FORECAST PERIOD
FIGURE 52 EMEA: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 53 GERMANY TO REGISTER HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN EMEA DURING FORECAST PERIOD
FIGURE 54 MEMES AND MOEMS DEVICES TO EXHIBIT HIGHEST CARG IN FRENCH DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 55 COMPANIES ADOPTED PRODUCT LAUNCHES AS KEY GROWTH STRATEGIES
FROM 2017 TO 2019
FIGURE 56 RANKING OF TOP 5 PLAYERS IN DIE BONDER EQUIPMENT MARKET
FIGURE 57 DIE BONDER EQUIPMENT MARKET (GLOBAL) COMPETITIVE LEADERSHIP
MAPPING, 2018
FIGURE 58 BE SEMICONDUCTOR INDUSTRIES N.V.: COMPANY SNAPSHOT
FIGURE 59 ASM PACIFIC TECHNOLOGY LTD: COMPANY SNAPSHOT
FIGURE 60 KULICKE & SOFFA: COMPANY SNAPSHOT
FIGURE 61 MYCRONIC AB: COMPANY SNAPSHOT
