AI Data Center Liquid Cooling Market - 2026-2035

June 2026 | 55 pages | ID: AEDE2BF1ED27EN
DataM Intelligence

Abstracts

AI Data Center Liquid Cooling Market reached US$ 3.39 Billion in 2025 and is expected to reach US$ 23.23 billion by 2035, growing with a CAGR of 21.21% during the forecast period 2026-2035.

The AI Data Center Liquid Cooling Market emerges as a key focus in DataM Intelligence latest in-depth analysis, where seasoned researchers harness advanced data analytics and strategic foresight to deliver unparalleled market intelligence. This insightful report meticulously explores the competitive landscape, profiling key players and their forward-thinking innovations in product development, pricing strategies, financial metrics, and global expansion initiatives. By uncovering the driving forces, market dynamics, and disruptive trends shaping the future, this research equips industry stakeholders with the actionable insights needed to make informed decisions in an increasingly dynamic and competitive environment.

A AI Data Center Liquid Cooling Market is a data-driven software solution that collects, integrates, analyzes, and visualizes customer data across various touchpoints to generate actionable insights. These platforms help businesses understand customer behaviors, preferences, and purchasing patterns in real time, enabling personalized marketing, enhanced customer engagement, and data-driven decision-making.

By Cooling Technology

• Direct-to-Chip Cooling*
• Adoption Trends in GPU-Dense AI Racks
• Retrofit Potential in Existing Data Centers
• Single-Phase Immersion Cooling
• Demand in AI, HPC and Research Computing Facilities
• Two-Phase Immersion Cooling
• Adoption Outlook for Extreme-Density AI Workloads
• Rear-Door Heat Exchangers
• Role in Hybrid and Transitional Data Center Cooling
• Hybrid Air-Liquid Cooling
• Use in Brownfield AI Data Center Upgrades
• Spray/Jet Cooling
• Emerging Applications in Advanced AI Hardware Cooling

By Component

• Solutions*
• Direct-to-Chip, Immersion and Rack-Level Cooling Solutions
• Coolant Distribution Units
• CDU Capacity Expansion for AI and HPC Data Centers
• Cold Plates
• GPU and CPU-Level Heat Removal Applications
• Heat Exchangers
• Pumps, Valves and Manifolds
• Sensors and Leak Detection Systems
• Role in Reliability, Uptime and Risk Management
• Coolants and Dielectric Fluids
• Water-Glycol, Dielectric and Engineered Fluid Analysis
• Services
• Design, Installation, Commissioning, Maintenance and Consulting Services

By Data Center Type

• Hyperscale AI Data Centers*
• AI Cluster Deployment and High-Density Rack Demand
• Colocation AI Data Centers
• Demand for AI-Ready Multi-Tenant Infrastructure
• Enterprise AI Data Centers
• Private AI Infrastructure and Enterprise Modernization
• Edge AI Data Centers
• Liquid Cooling Demand for Distributed AI Inference
• HPC and Research Facilities
• Supercomputing, Simulation and Scientific Computing Applications

By Workload

• Generative AI Training*
• Demand from GPU Clusters and Large Language Model Training
• AI Inference
• Growth of Distributed and Edge AI Inference Workloads
• High-Performance Computing
• Cloud AI Infrastructure
• GPU-as-a-Service and AI Cloud Platform Demand
• Semiconductor Design and Simulation
• Defense and Research Computing
• Enterprise Analytics

By End User

• Cloud Service Providers*
• Hyperscale AI Cloud and GPU Infrastructure Demand
• Colocation Providers
• AI-Ready Colocation Capacity and High-Density Customer Demand
• Server OEMs
• Liquid-Ready Rack and AI Server Integration
• Enterprises
• Government and Defense
• BFSI
• Healthcare and Life Sciences
• Telecom
• Manufacturing
• Others

Regional Analysis for AI Data Center Liquid Cooling Market:

• North America (U.S., Canada, Mexico)
• Europe (U.K., Italy, Germany, Russia, France, Spain, The Netherlands and Rest of Europe)
• Asia-Pacific (India, Japan, China, South Korea, Australia, Indonesia Rest of Asia Pacific)
• South America (Colombia, Brazil, Argentina, Rest of South America)
• Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of Middle East & Africa)

This Report Covers:

• Go-to-market Strategy.
• Neutral perspective on the market performance.
• Development trends, competitive landscape analysis, supply side analysis, demand side analysis, year-on-year growth, competitive benchmarking, vendor identification, and other significant analysis, as well as development status.
• Customized regional/country reports as per request and country level analysis.
• Potential & niche segments and regions exhibiting promising growth covered.
• Analysis of Market Size (historical and forecast), Total Addressable Market (TAM), Serviceable Available Market (SAM), Serviceable Obtainable Market (SOM), Market Growth, Technological Trends, Market Share, Market Dynamics, Competitive Landscape and Major Players (Innovators, Start-ups, Laggard, and Pioneer).

Research Process:

Both primary and secondary data sources have been used in the global AI Data Center Liquid Cooling Market research report. During the research process, a wide range of industry-affecting factors are examined, including governmental regulations, market conditions, competitive levels, historical data, market situation, technological advancements, upcoming developments, in related businesses, as well as market volatility, prospects, potential barriers, and challenges.

Contents

1. METHODOLOGY AND SCOPE

1.1. Research Methodology
1.2. Research Objective and Scope of the Report
1.3. Market Definition and Research Assumptions
1.4. Data Sources and Forecasting Model
1.5. Base Year, Historical Years and Forecast Period
  1.5.1. Historical Years: 2023-2024
  1.5.2. Base Year: 2025
  1.5.3. Forecast Period: 2026-2035
  1.5.4. Available Years: 2023-2035

2. DEFINITION AND OVERVIEW

2.1. AI Data Center Liquid Cooling Market Definition
2.2. Market Scope and Coverage
2.3. Market Inclusions and Exclusions
2.4. AI Data Center Liquid Cooling Ecosystem Overview
2.5. Evolution from Air Cooling to Liquid Cooling in AI Data Centers

3. EXECUTIVE SUMMARY

3.1. Snippet by Cooling Technology
3.2. Snippet by Component
3.3. Snippet by Data Center Type
3.4. Snippet by Workload
3.5. Snippet by End User
3.6. Snippet by Region
3.7. Key Market Takeaways
3.8. Market Opportunity Snapshot

4. DYNAMICS

4.1. Impacting Factors
  4.1.1. Drivers
    4.1.1.1. Rising Generative AI, HPC and GPU-Dense Workloads Requiring High-Density Cooling
    4.1.1.2. Growing Adoption of Direct-to-Chip and Immersion Cooling in AI-Ready Data Centers
    4.1.1.3. Increasing Demand for Energy-Efficient and Sustainable Data Center Infrastructure
    4.1.1.4. Expansion of Hyperscale Cloud and AI Colocation Facilities
    4.1.1.5. Rising Rack Power Density and Next-Generation AI Accelerator Deployments
  4.1.2. Restraints
    4.1.2.1. Complexity and Cost of Retrofitting Existing Air-Cooled Data Centers
    4.1.2.2. Facility Readiness Challenges for Liquid Cooling Deployment
    4.1.2.3. Concerns Related to Fluid Handling, Leak Detection and Maintenance Skills
    4.1.2.4. Compatibility Issues Across Servers, CDUs, Coolants and Rack Infrastructure
  4.1.3. Opportunities
    4.1.3.1. Growing Demand for AI-Ready Colocation Capacity
    4.1.3.2. Greenfield AI Data Center Construction and Liquid-Ready Facility Design
    4.1.3.3. Cooling-as-a-Service and Managed Liquid Cooling Models
    4.1.3.4. Expansion of CDU, Cold Plate and Engineered Coolant Innovation
    4.1.3.5. Waste Heat Recovery and Low-Carbon Data Center Design
  4.1.4. Trends
    4.1.4.1. Shift Toward Rack-Scale Liquid-Cooled AI Infrastructure
    4.1.4.2. Integration of AI-Based Thermal Monitoring and DCIM Platforms
    4.1.4.3. Growing Partnerships Between Chipmakers, Server OEMs and Cooling Vendors
    4.1.4.4. Rising Demand for Modular and Prefabricated Liquid Cooling Infrastructure
    4.1.4.5. Adoption of Hybrid Air-Liquid Cooling in Brownfield Facilities
4.2. Impact Analysis

5. INDUSTRY ANALYSIS

5.1. Porter’s Five Forces Analysis
  5.1.1. Bargaining Power of Suppliers
  5.1.2. Bargaining Power of Buyers
  5.1.3. Threat of New Entrants
  5.1.4. Threat of Substitutes
  5.1.5. Competitive Rivalry
5.2. Supply Chain Analysis
5.3. Value Chain Analysis
5.4. Pricing Analysis
5.5. Technology Readiness Analysis
5.6. Rack Density and Thermal Load Analysis
5.7. Regulatory and Compliance Analysis
5.8. Sustainability Analysis
5.9. PUE, Energy Efficiency and Water Usage Analysis
5.10. Patent and Innovation Analysis
5.11. Mergers, Acquisitions and Strategic Partnerships Analysis
5.12. DMI Opinion

6. BY COOLING TECHNOLOGY

6.1. Introduction
  6.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Cooling Technology
  6.1.2. Market Attractiveness Index, By Cooling Technology
6.2. Direct-to-Chip Cooling*
  6.2.1. Introduction
  6.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  6.2.3. Adoption Trends in GPU-Dense AI Racks
  6.2.4. Retrofit Potential in Existing Data Centers
6.3. Single-Phase Immersion Cooling
  6.3.1. Introduction
  6.3.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  6.3.3. Demand in AI, HPC and Research Computing Facilities
6.4. Two-Phase Immersion Cooling
  6.4.1. Introduction
  6.4.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  6.4.3. Adoption Outlook for Extreme-Density AI Workloads
6.5. Rear-Door Heat Exchangers
  6.5.1. Introduction
  6.5.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  6.5.3. Role in Hybrid and Transitional Data Center Cooling
6.6. Hybrid Air-Liquid Cooling
  6.6.1. Introduction
  6.6.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  6.6.3. Use in Brownfield AI Data Center Upgrades
6.7. Spray/Jet Cooling
  6.7.1. Introduction
  6.7.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  6.7.3. Emerging Applications in Advanced AI Hardware Cooling

7. BY COMPONENT

7.1. Introduction
  7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  7.1.2. Market Attractiveness Index, By Component
7.2. Solutions*
  7.2.1. Introduction
  7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  7.2.3. Direct-to-Chip, Immersion and Rack-Level Cooling Solutions
7.3. Coolant Distribution Units
  7.3.1. Introduction
  7.3.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  7.3.3. CDU Capacity Expansion for AI and HPC Data Centers
7.4. Cold Plates
  7.4.1. Introduction
  7.4.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  7.4.3. GPU and CPU-Level Heat Removal Applications
7.5. Heat Exchangers
  7.5.1. Introduction
  7.5.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.6. Pumps, Valves and Manifolds
  7.6.1. Introduction
  7.6.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.7. Sensors and Leak Detection Systems
  7.7.1. Introduction
  7.7.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  7.7.3. Role in Reliability, Uptime and Risk Management
7.8. Coolants and Dielectric Fluids
  7.8.1. Introduction
  7.8.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  7.8.3. Water-Glycol, Dielectric and Engineered Fluid Analysis
7.9. Services
  7.9.1. Introduction
  7.9.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  7.9.3. Design, Installation, Commissioning, Maintenance and Consulting Services

8. BY DATA CENTER TYPE

8.1. Introduction
  8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Data Center Type
  8.1.2. Market Attractiveness Index, By Data Center Type
8.2. Hyperscale AI Data Centers*
  8.2.1. Introduction
  8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  8.2.3. AI Cluster Deployment and High-Density Rack Demand
8.3. Colocation AI Data Centers
  8.3.1. Introduction
  8.3.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  8.3.3. Demand for AI-Ready Multi-Tenant Infrastructure
8.4. Enterprise AI Data Centers
  8.4.1. Introduction
  8.4.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  8.4.3. Private AI Infrastructure and Enterprise Modernization
8.5. Edge AI Data Centers
  8.5.1. Introduction
  8.5.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  8.5.3. Liquid Cooling Demand for Distributed AI Inference
8.6. HPC and Research Facilities
  8.6.1. Introduction
  8.6.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  8.6.3. Supercomputing, Simulation and Scientific Computing Applications

9. BY WORKLOAD

9.1. Introduction
  9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Workload
  9.1.2. Market Attractiveness Index, By Workload
9.2. Generative AI Training*
  9.2.1. Introduction
  9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  9.2.3. Demand from GPU Clusters and Large Language Model Training
9.3. AI Inference
  9.3.1. Introduction
  9.3.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  9.3.3. Growth of Distributed and Edge AI Inference Workloads
9.4. High-Performance Computing
  9.4.1. Introduction
  9.4.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.5. Cloud AI Infrastructure
  9.5.1. Introduction
  9.5.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  9.5.3. GPU-as-a-Service and AI Cloud Platform Demand
9.6. Semiconductor Design and Simulation
  9.6.1. Introduction
  9.6.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.7. Defense and Research Computing
  9.7.1. Introduction
  9.7.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.8. Enterprise Analytics
  9.8.1. Introduction
  9.8.2. Market Size Analysis and Y-o-Y Growth Analysis (%)

10. BY END USER

10.1. Introduction
  10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End User
  10.1.2. Market Attractiveness Index, By End User
10.2. Cloud Service Providers*
  10.2.1. Introduction
  10.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  10.2.3. Hyperscale AI Cloud and GPU Infrastructure Demand
10.3. Colocation Providers
  10.3.1. Introduction
  10.3.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  10.3.3. AI-Ready Colocation Capacity and High-Density Customer Demand
10.4. Server OEMs
  10.4.1. Introduction
  10.4.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  10.4.3. Liquid-Ready Rack and AI Server Integration
10.5. Enterprises
  10.5.1. Introduction
  10.5.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.6. Government and Defense
  10.6.1. Introduction
  10.6.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.7. BFSI
  10.7.1. Introduction
  10.7.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.8. Healthcare and Life Sciences
  10.8.1. Introduction
  10.8.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.9. Telecom
  10.9.1. Introduction
  10.9.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.10. Manufacturing
  10.10.1. Introduction
  10.10.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.11. Others
  10.11.1. Introduction
  10.11.2. Market Size Analysis and Y-o-Y Growth Analysis (%)

11. BY REGION

11.1. Introduction
  11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
  11.1.2. Market Attractiveness Index, By Region
11.2. North America
  11.2.1. Introduction
  11.2.2. Key Region-Specific Dynamics
  11.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Cooling Technology
  11.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  11.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Data Center Type
  11.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Workload
  11.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End User
  11.2.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    11.2.8.1. U.S.
    11.2.8.2. Canada
    11.2.8.3. Mexico
11.3. Europe
  11.3.1. Introduction
  11.3.2. Key Region-Specific Dynamics
  11.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Cooling Technology
  11.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  11.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Data Center Type
  11.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Workload
  11.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End User
  11.3.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    11.3.8.1. Germany
    11.3.8.2. UK
    11.3.8.3. France
    11.3.8.4. Italy
    11.3.8.5. Spain
    11.3.8.6. Netherlands
    11.3.8.7. Nordics
    11.3.8.8. Rest of Europe
11.4. South America
  11.4.1. Introduction
  11.4.2. Key Region-Specific Dynamics
  11.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Cooling Technology
  11.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  11.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Data Center Type
  11.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Workload
  11.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End User
  11.4.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    11.4.8.1. Brazil
    11.4.8.2. Argentina
    11.4.8.3. Chile
    11.4.8.4. Colombia
    11.4.8.5. Rest of South America
11.5. Asia-Pacific
  11.5.1. Introduction
  11.5.2. Key Region-Specific Dynamics
  11.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Cooling Technology
  11.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  11.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Data Center Type
  11.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Workload
  11.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End User
  11.5.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    11.5.8.1. China
    11.5.8.2. India
    11.5.8.3. Japan
    11.5.8.4. South Korea
    11.5.8.5. Australia
    11.5.8.6. Singapore
    11.5.8.7. Rest of Asia-Pacific
11.6. Middle East and Africa
  11.6.1. Introduction
  11.6.2. Key Region-Specific Dynamics
  11.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Cooling Technology
  11.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  11.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Data Center Type
  11.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Workload
  11.6.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End User
  11.6.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    11.6.8.1. Saudi Arabia
    11.6.8.2. UAE
    11.6.8.3. South Africa
    11.6.8.4. Rest of Middle East and Africa

12. COMPETITIVE LANDSCAPE

12.1. Competitive Scenario
12.2. Market Positioning/Share Analysis
12.3. Competitive Benchmarking
12.4. Product Portfolio Comparison
12.5. Technology Benchmarking
12.6. Strategic Initiatives
12.7. Mergers and Acquisitions Analysis
12.8. Partnerships, Collaborations and Joint Ventures
12.9. Recent Product Launches and Innovations

13. COMPANY PROFILES

13.1. Schneider Electric SE*
  13.1.1. Company Overview
  13.1.2. Product Portfolio and Description
  13.1.3. Financial Overview
  13.1.4. Key Developments
  13.1.5. Strategic Focus in AI Data Center Liquid Cooling
13.2. Vertiv Group Corporation
  13.2.1. Company Overview
  13.2.2. Product Portfolio and Description
  13.2.3. Financial Overview
  13.2.4. Key Developments
13.3. Asetek A/S
13.4. LiquidStack Inc.
13.5. Submer Technologies SL
13.6. CoolIT Systems Inc.
13.7. Midas Green Technologies LLC
13.8. Iceotope Technologies Limited
13.9. Chilldyne Inc.
13.10. Asperitas BV
13.11. Green Revolution Cooling Inc.
13.12. Boyd Corporation
13.13. Fujitsu Limited
13.14. Super Micro Computer, Inc.
13.15. NVIDIA Corporation (*LIST NOT EXHAUSTIVE)

14. APPENDIX

14.1. About Us and Services
14.2. Research Methodology Notes
14.3. Abbreviations
14.4. Sources and References
14.5. Contact Us