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Multilayer Printed-wiring Board Industry Research Report 2023

August 2023 | 115 pages | ID: MAE2C9969BE9EN
APO Research

US$ 2,950.00

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This report aims to provide a comprehensive presentation of the global market for Multilayer Printed-wiring Board, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multilayer Printed-wiring Board.

The Multilayer Printed-wiring Board market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Multilayer Printed-wiring Board market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Multilayer Printed-wiring Board manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.

Key Companies & Market Share Insights

In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2018-2023. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
  • Nippon Mektron
  • Zhen Ding Technology
  • Unimicron
  • Young Poong Group
  • SEMCO
  • Ibiden
  • Tripod
  • TTM Technologies
  • Sumitomo Electric SEI
  • Daeduck Group
  • Nan Ya PCB
  • Compeq
  • HannStar Board
  • LG Innotek
  • AT&S
  • Meiko
  • WUS
  • TPT
  • Chin-Poon
  • Shennan
Product Type Insights

Global markets are presented by Multilayer Printed-wiring Board type, along with growth forecasts through 2029. Estimates on production and value are based on the price in the supply chain at which the Multilayer Printed-wiring Board are procured by the manufacturers.

This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type, and during the historical period (2018-2023) and forecast period (2024-2029).

Multilayer Printed-wiring Board segment by Type
  • Layer 4-6
  • Layer 8-10
  • Layer 10+
Application Insights

This report has provided the market size (production and revenue data) by application, during the historical period (2018-2023) and forecast period (2024-2029).

This report also outlines the market trends of each segment and consumer behaviors impacting the Multilayer Printed-wiring Board market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the Multilayer Printed-wiring Board market.

Multilayer Printed-wiring Board segment by Application
  • Consumer Electronics
  • Communications
  • Computer Related Industry
  • Automotive Industry
  • Others
Regional Outlook

This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and sales data of each region and country for the period 2018-2029.

The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2022 because of the base year, with estimates for 2023 and forecast value for 2029.
  • North America
    • U.S.
    • Canada
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Russia
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Australia
    • China Taiwan
    • Indonesia
    • Thailand
    • Malaysia
  • Latin America
    • Mexico
    • Brazil
    • Argentina
Key Drivers & Barriers

High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.

COVID-19 and Russia-Ukraine War Influence Analysis

The readers in the section will understand how the Multilayer Printed-wiring Board market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.

Reasons to Buy This Report

This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Multilayer Printed-wiring Board market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.

This report will help stakeholders to understand the global industry status and trends of Multilayer Printed-wiring Board and provides them with information on key market drivers, restraints, challenges, and opportunities.

This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.

This report stays updated with novel technology integration, features, and the latest developments in the market

This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the Multilayer Printed-wiring Board industry.

This report helps stakeholders to gain insights into which regions to target globally

This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Multilayer Printed-wiring Board.

This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.

Core Chapters

Chapter 1: Research objectives, research methods, data sources, data cross-validation;

Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 3: Detailed analysis of Multilayer Printed-wiring Board manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 5: Production/output, value of Multilayer Printed-wiring Board by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 6: Consumption of Multilayer Printed-wiring Board in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 11: The main points and conclusions of the report.
1 PREFACE

1.1 Scope of Report
1.2 Reasons for Doing This Study
1.3 Research Methodology
1.4 Research Process
1.5 Data Source
  1.5.1 Secondary Sources
  1.5.2 Primary Sources

2 MARKET OVERVIEW

2.1 Product Definition
2.2 Multilayer Printed-wiring Board by Type
  2.2.1 Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
  1.2.2 Layer 4-6
  1.2.3 Layer 8-10
  1.2.4 Layer 10+
2.3 Multilayer Printed-wiring Board by Application
  2.3.1 Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
  2.3.2 Consumer Electronics
  2.3.3 Communications
  2.3.4 Computer Related Industry
  2.3.5 Automotive Industry
  2.3.6 Others
2.4 Global Market Growth Prospects
  2.4.1 Global Multilayer Printed-wiring Board Production Value Estimates and Forecasts (2018-2029)
  2.4.2 Global Multilayer Printed-wiring Board Production Capacity Estimates and Forecasts (2018-2029)
  2.4.3 Global Multilayer Printed-wiring Board Production Estimates and Forecasts (2018-2029)
  2.4.4 Global Multilayer Printed-wiring Board Market Average Price (2018-2029)

3 MARKET COMPETITIVE LANDSCAPE BY MANUFACTURERS

3.1 Global Multilayer Printed-wiring Board Production by Manufacturers (2018-2023)
3.2 Global Multilayer Printed-wiring Board Production Value by Manufacturers (2018-2023)
3.3 Global Multilayer Printed-wiring Board Average Price by Manufacturers (2018-2023)
3.4 Global Multilayer Printed-wiring Board Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
3.5 Global Multilayer Printed-wiring Board Key Manufacturers, Manufacturing Sites & Headquarters
3.6 Global Multilayer Printed-wiring Board Manufacturers, Product Type & Application
3.7 Global Multilayer Printed-wiring Board Manufacturers, Date of Enter into This Industry
3.8 Global Multilayer Printed-wiring Board Market CR5 and HHI
3.9 Global Manufacturers Mergers & Acquisition

4 MANUFACTURERS PROFILED

4.1 Nippon Mektron
  4.1.1 Nippon Mektron Multilayer Printed-wiring Board Company Information
  4.1.2 Nippon Mektron Multilayer Printed-wiring Board Business Overview
  4.1.3 Nippon Mektron Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.1.4 Nippon Mektron Product Portfolio
  4.1.5 Nippon Mektron Recent Developments
4.2 Zhen Ding Technology
  4.2.1 Zhen Ding Technology Multilayer Printed-wiring Board Company Information
  4.2.2 Zhen Ding Technology Multilayer Printed-wiring Board Business Overview
  4.2.3 Zhen Ding Technology Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.2.4 Zhen Ding Technology Product Portfolio
  4.2.5 Zhen Ding Technology Recent Developments
4.3 Unimicron
  4.3.1 Unimicron Multilayer Printed-wiring Board Company Information
  4.3.2 Unimicron Multilayer Printed-wiring Board Business Overview
  4.3.3 Unimicron Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.3.4 Unimicron Product Portfolio
  4.3.5 Unimicron Recent Developments
4.4 Young Poong Group
  4.4.1 Young Poong Group Multilayer Printed-wiring Board Company Information
  4.4.2 Young Poong Group Multilayer Printed-wiring Board Business Overview
  4.4.3 Young Poong Group Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.4.4 Young Poong Group Product Portfolio
  4.4.5 Young Poong Group Recent Developments
4.5 SEMCO
  4.5.1 SEMCO Multilayer Printed-wiring Board Company Information
  4.5.2 SEMCO Multilayer Printed-wiring Board Business Overview
  4.5.3 SEMCO Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.5.4 SEMCO Product Portfolio
  4.5.5 SEMCO Recent Developments
4.6 Ibiden
  4.6.1 Ibiden Multilayer Printed-wiring Board Company Information
  4.6.2 Ibiden Multilayer Printed-wiring Board Business Overview
  4.6.3 Ibiden Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.6.4 Ibiden Product Portfolio
  4.6.5 Ibiden Recent Developments
4.7 Tripod
  4.7.1 Tripod Multilayer Printed-wiring Board Company Information
  4.7.2 Tripod Multilayer Printed-wiring Board Business Overview
  4.7.3 Tripod Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.7.4 Tripod Product Portfolio
  4.7.5 Tripod Recent Developments
4.8 TTM Technologies
  4.8.1 TTM Technologies Multilayer Printed-wiring Board Company Information
  4.8.2 TTM Technologies Multilayer Printed-wiring Board Business Overview
  4.8.3 TTM Technologies Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.8.4 TTM Technologies Product Portfolio
  4.8.5 TTM Technologies Recent Developments
4.9 Sumitomo Electric SEI
  4.9.1 Sumitomo Electric SEI Multilayer Printed-wiring Board Company Information
  4.9.2 Sumitomo Electric SEI Multilayer Printed-wiring Board Business Overview
  4.9.3 Sumitomo Electric SEI Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.9.4 Sumitomo Electric SEI Product Portfolio
  4.9.5 Sumitomo Electric SEI Recent Developments
4.10 Daeduck Group
  4.10.1 Daeduck Group Multilayer Printed-wiring Board Company Information
  4.10.2 Daeduck Group Multilayer Printed-wiring Board Business Overview
  4.10.3 Daeduck Group Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  4.10.4 Daeduck Group Product Portfolio
  4.10.5 Daeduck Group Recent Developments
7.11 Nan Ya PCB
  7.11.1 Nan Ya PCB Multilayer Printed-wiring Board Company Information
  7.11.2 Nan Ya PCB Multilayer Printed-wiring Board Business Overview
  4.11.3 Nan Ya PCB Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.11.4 Nan Ya PCB Product Portfolio
  7.11.5 Nan Ya PCB Recent Developments
7.12 Compeq
  7.12.1 Compeq Multilayer Printed-wiring Board Company Information
  7.12.2 Compeq Multilayer Printed-wiring Board Business Overview
  7.12.3 Compeq Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.12.4 Compeq Product Portfolio
  7.12.5 Compeq Recent Developments
7.13 HannStar Board
  7.13.1 HannStar Board Multilayer Printed-wiring Board Company Information
  7.13.2 HannStar Board Multilayer Printed-wiring Board Business Overview
  7.13.3 HannStar Board Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.13.4 HannStar Board Product Portfolio
  7.13.5 HannStar Board Recent Developments
7.14 LG Innotek
  7.14.1 LG Innotek Multilayer Printed-wiring Board Company Information
  7.14.2 LG Innotek Multilayer Printed-wiring Board Business Overview
  7.14.3 LG Innotek Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.14.4 LG Innotek Product Portfolio
  7.14.5 LG Innotek Recent Developments
7.15 AT&S
  7.15.1 AT&S Multilayer Printed-wiring Board Company Information
  7.15.2 AT&S Multilayer Printed-wiring Board Business Overview
  7.15.3 AT&S Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.15.4 AT&S Product Portfolio
  7.15.5 AT&S Recent Developments
7.16 Meiko
  7.16.1 Meiko Multilayer Printed-wiring Board Company Information
  7.16.2 Meiko Multilayer Printed-wiring Board Business Overview
  7.16.3 Meiko Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.16.4 Meiko Product Portfolio
  7.16.5 Meiko Recent Developments
7.17 WUS
  7.17.1 WUS Multilayer Printed-wiring Board Company Information
  7.17.2 WUS Multilayer Printed-wiring Board Business Overview
  7.17.3 WUS Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.17.4 WUS Product Portfolio
  7.17.5 WUS Recent Developments
7.18 TPT
  7.18.1 TPT Multilayer Printed-wiring Board Company Information
  7.18.2 TPT Multilayer Printed-wiring Board Business Overview
  7.18.3 TPT Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.18.4 TPT Product Portfolio
  7.18.5 TPT Recent Developments
7.19 Chin-Poon
  7.19.1 Chin-Poon Multilayer Printed-wiring Board Company Information
  7.19.2 Chin-Poon Multilayer Printed-wiring Board Business Overview
  7.19.3 Chin-Poon Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.19.4 Chin-Poon Product Portfolio
  7.19.5 Chin-Poon Recent Developments
7.20 Shennan
  7.20.1 Shennan Multilayer Printed-wiring Board Company Information
  7.20.2 Shennan Multilayer Printed-wiring Board Business Overview
  7.20.3 Shennan Multilayer Printed-wiring Board Production Capacity, Value and Gross Margin (2018-2023)
  7.20.4 Shennan Product Portfolio
  7.20.5 Shennan Recent Developments

5 GLOBAL MULTILAYER PRINTED-WIRING BOARD PRODUCTION BY REGION

5.1 Global Multilayer Printed-wiring Board Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.2 Global Multilayer Printed-wiring Board Production by Region: 2018-2029
  5.2.1 Global Multilayer Printed-wiring Board Production by Region: 2018-2023
  5.2.2 Global Multilayer Printed-wiring Board Production Forecast by Region (2024-2029)
5.3 Global Multilayer Printed-wiring Board Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.4 Global Multilayer Printed-wiring Board Production Value by Region: 2018-2029
  5.4.1 Global Multilayer Printed-wiring Board Production Value by Region: 2018-2023
  5.4.2 Global Multilayer Printed-wiring Board Production Value Forecast by Region (2024-2029)
5.5 Global Multilayer Printed-wiring Board Market Price Analysis by Region (2018-2023)
5.6 Global Multilayer Printed-wiring Board Production and Value, YOY Growth
  5.6.1 North America Multilayer Printed-wiring Board Production Value Estimates and Forecasts (2018-2029)
  5.6.2 Europe Multilayer Printed-wiring Board Production Value Estimates and Forecasts (2018-2029)
  5.6.3 China Multilayer Printed-wiring Board Production Value Estimates and Forecasts (2018-2029)
  5.6.4 Japan Multilayer Printed-wiring Board Production Value Estimates and Forecasts (2018-2029)
  5.6.5 South Korea Multilayer Printed-wiring Board Production Value Estimates and Forecasts (2018-2029)
  5.6.6 Southeast Asia Multilayer Printed-wiring Board Production Value Estimates and Forecasts (2018-2029)

6 GLOBAL MULTILAYER PRINTED-WIRING BOARD CONSUMPTION BY REGION

6.1 Global Multilayer Printed-wiring Board Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
6.2 Global Multilayer Printed-wiring Board Consumption by Region (2018-2029)
  6.2.1 Global Multilayer Printed-wiring Board Consumption by Region: 2018-2029
  6.2.2 Global Multilayer Printed-wiring Board Forecasted Consumption by Region (2024-2029)
6.3 North America
  6.3.1 North America Multilayer Printed-wiring Board Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
  6.3.2 North America Multilayer Printed-wiring Board Consumption by Country (2018-2029)
  6.3.3 U.S.
  6.3.4 Canada
6.4 Europe
  6.4.1 Europe Multilayer Printed-wiring Board Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
  6.4.2 Europe Multilayer Printed-wiring Board Consumption by Country (2018-2029)
  6.4.3 Germany
  6.4.4 France
  6.4.5 U.K.
  6.4.6 Italy
  6.4.7 Russia
6.5 Asia Pacific
  6.5.1 Asia Pacific Multilayer Printed-wiring Board Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
  6.5.2 Asia Pacific Multilayer Printed-wiring Board Consumption by Country (2018-2029)
  6.5.3 China
  6.5.4 Japan
  6.5.5 South Korea
  6.5.6 China Taiwan
  6.5.7 Southeast Asia
  6.5.8 India
  6.5.9 Australia
6.6 Latin America, Middle East & Africa
  6.6.1 Latin America, Middle East & Africa Multilayer Printed-wiring Board Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
  6.6.2 Latin America, Middle East & Africa Multilayer Printed-wiring Board Consumption by Country (2018-2029)
  6.6.3 Mexico
  6.6.4 Brazil
  6.6.5 Turkey
  6.6.5 GCC Countries

7 SEGMENT BY TYPE

7.1 Global Multilayer Printed-wiring Board Production by Type (2018-2029)
  7.1.1 Global Multilayer Printed-wiring Board Production by Type (2018-2029) & (K Sqm)
  7.1.2 Global Multilayer Printed-wiring Board Production Market Share by Type (2018-2029)
7.2 Global Multilayer Printed-wiring Board Production Value by Type (2018-2029)
  7.2.1 Global Multilayer Printed-wiring Board Production Value by Type (2018-2029) & (US$ Million)
  7.2.2 Global Multilayer Printed-wiring Board Production Value Market Share by Type (2018-2029)
7.3 Global Multilayer Printed-wiring Board Price by Type (2018-2029)

8 SEGMENT BY APPLICATION

8.1 Global Multilayer Printed-wiring Board Production by Application (2018-2029)
  8.1.1 Global Multilayer Printed-wiring Board Production by Application (2018-2029) & (K Sqm)
  8.1.2 Global Multilayer Printed-wiring Board Production by Application (2018-2029) & (K Sqm)
8.2 Global Multilayer Printed-wiring Board Production Value by Application (2018-2029)
  8.2.1 Global Multilayer Printed-wiring Board Production Value by Application (2018-2029) & (US$ Million)
  8.2.2 Global Multilayer Printed-wiring Board Production Value Market Share by Application (2018-2029)
8.3 Global Multilayer Printed-wiring Board Price by Application (2018-2029)

9 VALUE CHAIN AND SALES CHANNELS ANALYSIS OF THE MARKET

9.1 Multilayer Printed-wiring Board Value Chain Analysis
  9.1.1 Multilayer Printed-wiring Board Key Raw Materials
  9.1.2 Raw Materials Key Suppliers
  9.1.3 Multilayer Printed-wiring Board Production Mode & Process
9.2 Multilayer Printed-wiring Board Sales Channels Analysis
  9.2.1 Direct Comparison with Distribution Share
  9.2.2 Multilayer Printed-wiring Board Distributors
  9.2.3 Multilayer Printed-wiring Board Customers

10 GLOBAL MULTILAYER PRINTED-WIRING BOARD ANALYZING MARKET DYNAMICS

10.1 Multilayer Printed-wiring Board Industry Trends
10.2 Multilayer Printed-wiring Board Industry Drivers
10.3 Multilayer Printed-wiring Board Industry Opportunities and Challenges
10.4 Multilayer Printed-wiring Board Industry Restraints

11 REPORT CONCLUSION

12 DISCLAIMER



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