[email protected] +44 20 8123 2220 (UK) +1 732 587 5005 (US) Contact Us | FAQ |

Global Solder Ball Market Data Survey Report 2025

November 2017 | 81 pages | ID: GC6352C1332EN
HeyReport

US$ 1,500.00

E-mail Delivery (PDF)

Download PDF Leaflet

Accepted cards
Wire Transfer
Checkout Later
Need Help? Ask a Question
SUMMARY

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as 'ball' or 'bumps') is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

The global Solder Ball market will reach Volume Million USD in 2017 with CAGR xx% 2018-2025. The main contents of the report including:

Global market size and forecast
Regional market size, production data and export & import
Key manufacturers (manufacturing sites, capacity and production, product specifications etc.)
Average market price by SUK
Major applications

Key manufacturers are included based on manufacturing sites, capacity and production, product specifications etc.:
  • Senju Metal
  • DS HiMetal
  • MKE
  • YCTC
  • Nippon Micrometal
  • Accurus
  • PMTC
  • Shanghai hiking solder material
  • Shenmao Technology
Major applications as follows:
  • BGA
  • CSP & WLCSP
  • Flip-Chip & Others
Regional market size, production data and export & import:
  • Asia-Pacific
  • North America
  • Europe
  • South America
  • Middle East & Africa
1 GLOBAL MARKET OVERVIEW

1.1 Scope of Statistics
  1.1.1 Scope of Products
  1.1.2 Scope of Manufacturers
  1.1.3 Scope of Application
  1.1.4 Scope of Regions/Countries
1.2 Global Market Size

2 REGIONAL MARKET

2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade

3 KEY MANUFACTURERS

3.1 Senju Metal
  3.1.2 Company Information
  3.1.2 Product Specifications
  3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2 DS HiMetal
  3.2.1 Company Information
  3.2.2 Product Specifications
  3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3 MKE
  3.3.1 Company Information
  3.3.2 Product Specifications
  3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4 YCTC
  3.4.1 Company Information
  3.4.2 Product Specifications
  3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5 Nippon Micrometal
  3.5.1 Company Information
  3.5.2 Product Specifications
  3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6 Accurus
  3.6.1 Company Information
  3.6.2 Product Specifications
  3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7 PMTC
  3.7.1 Company Information
  3.7.2 Product Specifications
  3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8 Shanghai hiking solder material
  3.8.1 Company Information
  3.8.2 Product Specifications
  3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.9 Shenmao Technology
  3.9.1 Company Information
  3.9.2 Product Specifications
  3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)

4 MAJOR APPLICATION

4.1 BGA
  4.1.1 Overview
  4.1.2 BGA Market Size and Forecast
4.2 CSP & WLCSP
  4.2.1 Overview
  4.2.2 CSP & WLCSP Market Size and Forecast
4.3 Flip-Chip & Others
  4.3.1 Overview
  4.3.2 Flip-Chip & Others Market Size and Forecast

5 MARKET PRICE

5.1 Overview
5.2 Price by SUK

6 CONCLUSION

LIST OF TABLES

Tab Regional Production 2011-2017 (Value)
Tab Regional Production 2011-2017 (Volume)
Tab Regional Demand and CAGR 2011-2017 (Value)
Tab Regional Demand and CAGR 2011-2017 (Volume)
Tab Regional Demand Forecast and CAGR 2018-2025 (Value)
Tab Regional Demand Forecast and CAGR 2018-2025 (Volume)
Tab Regional Export 2011-2017 (Value)
Tab Regional Export 2011-2017 (Volume)
Tab Regional Import 2011-2017 (Value)
Tab Regional Import 2011-2017 (Volume)
Tab Sales Revenue, Volume, Price, Cost and Margin of Senju Metal
Tab Sales Revenue, Volume, Price, Cost and Margin of DS HiMetal
Tab Sales Revenue, Volume, Price, Cost and Margin of MKE
Tab Sales Revenue, Volume, Price, Cost and Margin of YCTC
Tab Sales Revenue, Volume, Price, Cost and Margin of Nippon Micrometal
Tab Sales Revenue, Volume, Price, Cost and Margin of Accurus
Tab Sales Revenue, Volume, Price, Cost and Margin of PMTC
Tab Sales Revenue, Volume, Price, Cost and Margin of Shanghai hiking solder material
Tab Sales Revenue, Volume, Price, Cost and Margin of Shenmao Technology
Tab Market Price by Region
Tab Market Price by Manufacturers
Tab Market Price by Application
Tab Price by SUK (Popular Goods on the Market)

LIST OF FIGURES

Fig Global Solder Ball Market Size and CAGR 2011-2017 (Value)
Fig Global Solder Ball Market Size and CAGR 2011-2017 (Volume)
Fig Global Solder Ball Market Forecast and CAGR 2018-2025 (Value)
Fig Global Solder Ball Market Forecast and CAGR 2018-2025 (Volume)
Fig BGA Market Size and CAGR 2011-2017 (Value)
Fig BGA Market Size and CAGR 2011-2017 (Volume)
Fig BGA Market Forecast and CAGR 2018-2025 (Value)
Fig BGA Market Forecast and CAGR 2018-2025 (Volume)
Fig CSP & WLCSP Market Size and CAGR 2011-2017 (Value)
Fig CSP & WLCSP Market Size and CAGR 2011-2017 (Volume)
Fig CSP & WLCSP Market Forecast and CAGR 2018-2025 (Value)
Fig CSP & WLCSP Market Forecast and CAGR 2018-2025 (Volume)
Fig Flip-Chip & Others Market Size and CAGR 2011-2017 (Value)
Fig Flip-Chip & Others Market Size and CAGR 2011-2017 (Volume)
Fig Flip-Chip & Others Market Forecast and CAGR 2018-2025 (Value)
Fig Flip-Chip & Others Market Forecast and CAGR 2018-2025 (Volume)
Fig Global Market Price 2011-2017
Fig Global Market Price 2018-2025


More Publications