Global Electronic Adhesive Market - Forecasts from 2018 to 2023

September 2018 | 105 pages | ID: G026E3C9634EN
Knowledge Sourcing Intelligence LLP

Abstracts

The global Electronic adhesives market is projected to expand at a CAGR of 13.25% over the forecast period of 2017 - 2023. The use of adhesives in the electronics is widespread and is used not only in the manufacturing of the electronic commodities but also in maintaining the long-term operation of these products. PCB or Printed Circuit Board is the building block of the electronics industry where the use of adhesives is required for bonding surface mount components, wire tacking or fixing and also in the encapsulation of the components. The increasing use of electronic adhesives across various industry verticals including telecommunications, consumer electronics, automotive and many more are driving the market growth. Also, increasing use of consumer electronics, one of the major contributors in promoting the growth of the electronics industry is further fueling the growth of the global electronic adhesives market.
Region-wise, North America is expected to hold the major market share while the Asia Pacific is considered the fastest growing market due to the growing electronics industry in countries like India and China.
The Dow Chemical Company, a Midland Michigan based company has an industry-leading portfolio of specialty chemicals and advanced materials delivering more than 6000 technology-based product families to their customers in around 180 countries across all high-growth sectors which include packaging, electronics, water, coatings, and agriculture. The company’s leading portfolio of silicone die attach adhesives delivers proven and dependable bonds in most of the chip demanding applications in automotive, communications, consumer electronics, and industrial markets. DOW CORNING™ die attach adhesives are solventless, environmentally responsible products which cure at a range of temperatures reducing thermal stress and energy consumption.

Major industry players profiled as part of the report are 3M, H.B. Fuller, Master Bond Inc, LG Chem and Henkel Corporation among others.

Segmentation

The global Electronic adhesives market has been analyzed through following segments:
By Type
Electrically conductive adhesives
Thermally conductive adhesives
Ultraviolet-curing adhesives
Others
By Application
Chip bonding
Wire tacking
Potting and encapsulation
Conformal coatings
By Industry Vertical
Telecommunications
Automotive
Consumer Electronics
Defense
Others
By Geography
North America
US
Canada
Mexico
Others
South America
Brazil
Argentina
Others
Europe
UK
Germany
France
Italy
Others
Middle East and Africa
Israel
Saudi Arabia
UAE
Others
Asia Pacific
China
India
Japan
South Korea
Australia
Others

Contents

1. INTRODUCTION

1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

2.1. Research Design
2.2. Secondary Sources

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
  4.5.1. Bargaining Power of Suppliers
  4.5.2. Bargaining Power of Buyers
  4.5.3. Threat of New Entrants
  4.5.4. Threat of Substitutes
  4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness

5. GLOBAL ELECTRONIC ADHESIVES MARKET BY TYPE

5.1. Electrically conductive adhesives
5.2. Thermally conductive adhesives
5.3. Ultraviolet-curing adhesives
5.4. Others

6. GLOBAL ELECTRONIC ADHESIVES MARKET BY APPLICATION

6.1. Chip bonding
6.2. Wire tacking
6.3. Potting and encapsulation
6.4. Conformal coatings

7. GLOBAL ELECTRONIC ADHESIVES MARKET BY INDUSTRY VERTICAL

7.1. Telecommunications
7.2. Automotive
7.3. Consumer electronics
7.4. Defense
7.5. Others

8. GLOBAL ELECTRONIC ADHESIVES MARKET BY GEOGRAPHY

8.1. North America
  8.1.1. United States
  8.1.2. Canada
  8.1.3. Mexico
  8.1.4. Others
8.2. South America
  8.2.1. Brazil
  8.2.2. Argentina
  8.2.3. Others
8.3. Europe
  8.3.1. Germany
  8.3.2. France
  8.3.3. Italy
  8.3.4. United Kingdom
  8.3.5. Others
8.4. Middle East and Africa
  8.4.1. Israel
  8.4.2. Saudi Arabia
  8.4.3. UAE
  8.4.4. Others
8.5. Asia Pacific
  8.5.1. Japan
  8.5.2. China
  8.5.3. India
  8.5.4. Australia
  8.5.5. South Korea
  8.5.6. Others

9. COMPETITIVE INTELLIGENCE

9.1. Market Share Analysis
9.2. Recent Deals and Investment
9.3. Strategies of Key Players

10. COMPANY PROFILES

10.1. DELO Industrie Klebstoffe GmbH & Co. KGaA
  10.1.1. Company Overview
  10.1.2. Financials
  10.1.3. Products and Services
  10.1.4. Recent Developments
10.2. 3M
  10.2.1. Company Overview
  10.2.2. Financials
  10.2.3. Products and Services
  10.2.4. Recent Developments
10.3. H.B. Fuller
  10.3.1. Company Overview
  10.3.2. Financials
  10.3.3. Products and Services
  10.3.4. Recent Developments
10.4. Henkel Corporation
  10.4.1. Company Overview
  10.4.2. Financials
  10.4.3. Products and Services
  10.4.4. Recent Developments
10.5. Master Bond Inc.
  10.5.1. Company Overview
  10.5.2. Financials
  10.5.3. Products and Services
  10.5.4. Recent Developments
10.6. LG Chem
  10.6.1. Company Overview
  10.6.2. Financials
  10.6.3. Products and Services
  10.6.4. Recent Developments
10.7. The Dow Chemical Company
  10.7.1. Company Overview
  10.7.2. Financials
  10.7.3. Products and Services
  10.7.4. Recent Developments
10.8. Avery Dennison Corporation
  10.8.1. Company Overview
  10.8.2. Financials
  10.8.3. Products and Services
  10.8.4. Recent Developments
10.9. Wacker Chemie AG
  10.9.1. Company Overview
  10.9.2. Financials
  10.9.3. Products and Services
  10.9.4. Recent Developments
10.10. Kohesi Bond
  10.10.1. Company Overview
  10.10.2. Financials
  10.10.3. Products and Services
  10.10.4. Recent Developments
LIST OF FIGURES
LIST OF TABLES
DISCLAIMER