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Global Packaging Materials for IGBT and SiC Modules Market 2024 by Company, Regions, Type and Application, Forecast to 2030
US$ 3,480.00
This report studies the Power Module Packaging Materials, include Encapsulation (Silicone Gel and Epoxy), Die Attach (soldering, sintering), ceramic substrates (DBC and AMB), Baseplate (copper, ALSiC,...
April 2024
127 pages
