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Flip Chip Technology Market to Grow at a Healthy Rate, Expects M&M in Its New Report Available at MarketPublishers.com

18 Apr 2016 • by Natalie Aster

LONDON – As of 2015, the flip technology marketplace was worth more than USD 19 billion. It is set to continue growing at a healthy rate in the upcoming years to almost hit the USD 31.3 billion mark. This growth will be driven by such factors as improved performance, electronic devices’ miniaturization, strong penetration of the flip chip technology in the market for consumer electronics, and more. However, reliability challenges represent a key restraint.

In the near term, the largest market share is expected to belong to CPUs packaged making use of the flip chip technology. The LED marketplace is set to exhibit the highest CAGR in the years to come.

APAC is the number one player in this space, this region held the largest share in the global marketplace as of 2015. It is predicted to grow at the highest CAGR over the period 2016-2022.

Some of major companies in this marketplace include: TSMC, Intel Corporation, SPIL, JCET, to name a few.

New research report “Flip Chip Technology Market - Global Forecast to 2022” drawn up by M&M offers a detailed analysis of the global flip technology marketplace. The study comprises a through overview of this evolving market. It investigates market dynamics and insightfully discusses industry trends. The report examines this marketplace on the basis of a wafer pumping process, packaging technology, packaging type, product and application.

The research study delves deep into performance of regional markets and concentrates on key country markets. It explores the competitive environment and includes top players’ profiles and global forecasts through 2022.

More new reports by our partner are available at M&M page

CONTACTS

The Market Publishers, Ltd.
Natalie Aster
Tel: +44 208 144 6009
Fax: +44 207 900 3970
[email protected] 
MarketPublishers.com

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