3D IC Technology Integration with TSVs Explored by MarketsandMarkets

29 Aug 2012 • by Natalie Aster

3D IC technology and its integration with through-silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors. The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. These 3D ICs with TSVs are expected to largely impact a wide variety of applications such as mobile communications, computing, graphics, and networking. Although there is huge interest in this technology, there are some major issues that need to be handled in order to achieve better market penetration and commercialization. Some of these issues are lack of standard definitions, design, verification and test challenges, and supply chain issues.

The report “Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)” by MarketsandMarkets provides the current size of the global 3D IC market and also forecasts the same for different regions, namely North America, Europe, Asia, and Rest of the World. A study of the winning imperatives and trends in the global 3D IC market is also carried out. In addition, the report also provides the profiles of over 15 companies from all the regions of the globe, along with their recent activities such as mergers and acquisitions, collaborations, joint ventures, and recent innovations.

Report Details:

Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)
Published: April, 2012
Pages: 195
Price: US$ 4.650,00

The intended audience of this report includes:

• raw material suppliers; 
• electronic design automation (EDA) vendors; 
• integrated device manufacturers (IDMs); 
• foundry vendors; 
• fabless vendors; 
• original equipment manufacturers (OEMs); 
• assembly, testing, and packaging vendors.

More information can be found in the report “Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)” by MarketsandMarkets.

To order the report or ask for sample pages contact [email protected]

Contacts

MarketPublishers, Ltd.
Tanya Rezler
Tel: +44 208 144 6009
Fax: +44 207 900 3970
[email protected]
MarketPublishers.com