[email protected] +44 20 8123 2220 (UK) +1 732 587 5005 (US) Contact Us | FAQ |

Taiwanese IC Packaging & Testing Industry, 4Q 2019

January 2020 | 18 pages | ID: T40FA2C067AEN
Market Intelligence & Consulting Institute (MIC)

US$ 1,000.00

E-mail Delivery (PDF)

Download PDF Leaflet

Accepted cards
Wire Transfer
Checkout Later
Need Help? Ask a Question
The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. The industry is expected to have continued growth momentum in the fourth quarter, reaching US$4.2 billion.
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2017 - 1Q 2020
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2017 - 1Q 2020
Taiwanese IC Packaging Industry Shipment Value , 1Q 2017 - 1Q 2020
Taiwanese IC Testing Industry Shipment Value, 1Q 2017 - 1Q 2020
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2017 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2017 - 3Q 2019
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2017 - 3Q 2019
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2017 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2017 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 3Q 2019
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2017 - 3Q 2019
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 3Q 2019
Exchange Rate, 2Q 2017 - 3Q 2019
Research Scope & Definitions


More Publications